JPH0250636B2 - - Google Patents

Info

Publication number
JPH0250636B2
JPH0250636B2 JP61170557A JP17055786A JPH0250636B2 JP H0250636 B2 JPH0250636 B2 JP H0250636B2 JP 61170557 A JP61170557 A JP 61170557A JP 17055786 A JP17055786 A JP 17055786A JP H0250636 B2 JPH0250636 B2 JP H0250636B2
Authority
JP
Japan
Prior art keywords
copper
acid
resist film
clad laminate
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61170557A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327091A (ja
Inventor
Masashi Kinoshita
Hajime Hata
Kazuo Kamagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Priority to JP17055786A priority Critical patent/JPS6327091A/ja
Publication of JPS6327091A publication Critical patent/JPS6327091A/ja
Publication of JPH0250636B2 publication Critical patent/JPH0250636B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP17055786A 1986-07-18 1986-07-18 銅スル−ホ−ルプリント配線板の製造方法 Granted JPS6327091A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17055786A JPS6327091A (ja) 1986-07-18 1986-07-18 銅スル−ホ−ルプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17055786A JPS6327091A (ja) 1986-07-18 1986-07-18 銅スル−ホ−ルプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS6327091A JPS6327091A (ja) 1988-02-04
JPH0250636B2 true JPH0250636B2 (enrdf_load_stackoverflow) 1990-11-02

Family

ID=15907061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17055786A Granted JPS6327091A (ja) 1986-07-18 1986-07-18 銅スル−ホ−ルプリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS6327091A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2526251Y2 (ja) * 1991-08-23 1997-02-19 宇部興産株式会社 押出プレスのマンドレルクリーニング装置
US5275694A (en) * 1992-03-24 1994-01-04 Sanwa Laboratory Ltd. Process for production of copper through-hole printed wiring boards
JP6012393B2 (ja) * 2012-10-23 2016-10-25 四国化成工業株式会社 銅の表面処理剤および表面処理方法
JP6591284B2 (ja) * 2014-12-29 2019-10-16 四国化成工業株式会社 金属の表面処理液、表面処理方法およびその利用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5027033A (enrdf_load_stackoverflow) * 1973-07-11 1975-03-20
JPS5118896A (enrdf_load_stackoverflow) * 1974-08-07 1976-02-14 Hitachi Metals Ltd
JPS6190492A (ja) * 1984-10-11 1986-05-08 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法

Also Published As

Publication number Publication date
JPS6327091A (ja) 1988-02-04

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