JPH025018B2 - - Google Patents

Info

Publication number
JPH025018B2
JPH025018B2 JP59053609A JP5360984A JPH025018B2 JP H025018 B2 JPH025018 B2 JP H025018B2 JP 59053609 A JP59053609 A JP 59053609A JP 5360984 A JP5360984 A JP 5360984A JP H025018 B2 JPH025018 B2 JP H025018B2
Authority
JP
Japan
Prior art keywords
integrated circuit
ground
ground wire
josephson
shield plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59053609A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198788A (ja
Inventor
Kunio Yamashita
Yutaka Harada
Juji Hatano
Hideaki Nakane
Shinichiro Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP59053609A priority Critical patent/JPS60198788A/ja
Publication of JPS60198788A publication Critical patent/JPS60198788A/ja
Publication of JPH025018B2 publication Critical patent/JPH025018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP59053609A 1984-03-22 1984-03-22 ジヨセフソン集積回路の構造 Granted JPS60198788A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59053609A JPS60198788A (ja) 1984-03-22 1984-03-22 ジヨセフソン集積回路の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59053609A JPS60198788A (ja) 1984-03-22 1984-03-22 ジヨセフソン集積回路の構造

Publications (2)

Publication Number Publication Date
JPS60198788A JPS60198788A (ja) 1985-10-08
JPH025018B2 true JPH025018B2 (enrdf_load_html_response) 1990-01-31

Family

ID=12947636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59053609A Granted JPS60198788A (ja) 1984-03-22 1984-03-22 ジヨセフソン集積回路の構造

Country Status (1)

Country Link
JP (1) JPS60198788A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9190361B2 (en) 2013-09-09 2015-11-17 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US9252108B2 (en) 2013-09-24 2016-02-02 Kabushiki Kaisha Toshiba Semiconductor device having magnetic shield layer surrounding MRAM chip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889878A (ja) * 1981-11-21 1983-05-28 Nippon Telegr & Teleph Corp <Ntt> 超伝導回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9190361B2 (en) 2013-09-09 2015-11-17 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US9252108B2 (en) 2013-09-24 2016-02-02 Kabushiki Kaisha Toshiba Semiconductor device having magnetic shield layer surrounding MRAM chip
US9349942B2 (en) 2013-09-24 2016-05-24 Kabushiki Kaisha Toshiba Semiconductor device having magnetic shield layer surrounding MRAM chip

Also Published As

Publication number Publication date
JPS60198788A (ja) 1985-10-08

Similar Documents

Publication Publication Date Title
US4467345A (en) Semiconductor integrated circuit device
JPH0362934A (ja) 集積回路パツケージ
US6605873B1 (en) Integrated electronic device comprising a mechanical stress protection structure
EP0037852A1 (en) Connection for superconductive circuitry
JP2622156B2 (ja) 集積回路パッド用の接触方法とその構造
JPH025018B2 (enrdf_load_html_response)
JPH0444438B2 (enrdf_load_html_response)
US5377072A (en) Single metal-plate bypass capacitor
JPH0196943A (ja) 半導体集積回路装置
JP2624320B2 (ja) 半導体装置
JPH05251513A (ja) 半導体装置
JP2971624B2 (ja) 半導体集積回路装置およびこれを用いた半導体装置
JPS60128637A (ja) 配線構造およびその製造方法
JPS58147183A (ja) ジヨセフソン集積回路の製造方法
JPS6328516B2 (enrdf_load_html_response)
JP2932824B2 (ja) 磁気抵抗センサ
JPS6256675B2 (enrdf_load_html_response)
JP3128572B2 (ja) 超伝導集積回路チップ用ボンディングパッドの構造
JPS58125880A (ja) ジヨセフソン接合素子
JPH04249325A (ja) 半導体集積回路
JPH0214778B2 (enrdf_load_html_response)
JPS58145172A (ja) ジヨセフソン接合素子
JPS63111651A (ja) 半導体装置
JPS59119779A (ja) ジヨセフソン集積回路装置
JPS6033313B2 (ja) 半導体回路装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term