JPH0249740Y2 - - Google Patents
Info
- Publication number
- JPH0249740Y2 JPH0249740Y2 JP1985061731U JP6173185U JPH0249740Y2 JP H0249740 Y2 JPH0249740 Y2 JP H0249740Y2 JP 1985061731 U JP1985061731 U JP 1985061731U JP 6173185 U JP6173185 U JP 6173185U JP H0249740 Y2 JPH0249740 Y2 JP H0249740Y2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- conductor
- condensing lens
- conductor circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 230000007935 neutral effect Effects 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985061731U JPH0249740Y2 (enrdf_load_stackoverflow) | 1985-04-26 | 1985-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985061731U JPH0249740Y2 (enrdf_load_stackoverflow) | 1985-04-26 | 1985-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177789U JPS61177789U (enrdf_load_stackoverflow) | 1986-11-06 |
| JPH0249740Y2 true JPH0249740Y2 (enrdf_load_stackoverflow) | 1990-12-27 |
Family
ID=30590278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985061731U Expired JPH0249740Y2 (enrdf_load_stackoverflow) | 1985-04-26 | 1985-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249740Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-04-26 JP JP1985061731U patent/JPH0249740Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177789U (enrdf_load_stackoverflow) | 1986-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4538757A (en) | Wave soldering in a reducing atmosphere | |
| US7280028B2 (en) | Temperature sensor and method of making the same | |
| EP0575985B1 (en) | Low-bridging soldering process | |
| CA2469463A1 (en) | Circuit formation by laser ablation of ink | |
| JPH0249740Y2 (enrdf_load_stackoverflow) | ||
| JPS61248588A (ja) | 導体回路形成方法 | |
| JPS63209193A (ja) | 導体パタ−ン形成方法 | |
| JPH05335725A (ja) | レーザ光線照射による電気回路形成方法 | |
| JPH0770378B2 (ja) | 回路基板 | |
| JPS5619648A (en) | Package for integrated circuit | |
| JPS61182894A (ja) | アルミナ基板のレ−ザスクライブ法 | |
| JP2760093B2 (ja) | 回路基板の製造方法 | |
| JPH0569182A (ja) | 電子部品の半田付け方法 | |
| JPH02302015A (ja) | 厚膜電子部品の製造方法 | |
| JPS5666374A (en) | Soldering method | |
| JPH0362989A (ja) | 厚膜回路基板及びその製造方法 | |
| KR930005352B1 (ko) | 인쇄회로기판(pcb)의 도금방법 | |
| SU1318374A1 (ru) | Флюс дл лужени и пайки легкоплавкими припо ми | |
| JPH06251914A (ja) | トリミング抵抗を有する回路基板の製造方法 | |
| JPH1052789A (ja) | はんだペースト | |
| JPS58123701A (ja) | 抵抗基板の製造方法 | |
| JPH0187578U (enrdf_load_stackoverflow) | ||
| JPS5678147A (en) | Manufacture of thick film hybrid integrated circuit board | |
| JPS6345886A (ja) | 回路形成法 | |
| JPS60216598A (ja) | 回路基板の製造方法 |