JPH0249615Y2 - - Google Patents
Info
- Publication number
- JPH0249615Y2 JPH0249615Y2 JP1982050544U JP5054482U JPH0249615Y2 JP H0249615 Y2 JPH0249615 Y2 JP H0249615Y2 JP 1982050544 U JP1982050544 U JP 1982050544U JP 5054482 U JP5054482 U JP 5054482U JP H0249615 Y2 JPH0249615 Y2 JP H0249615Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- metal
- metal piece
- brazing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 77
- 229910052751 metal Inorganic materials 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 41
- 238000005219 brazing Methods 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 239000010953 base metal Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229910006404 SnO 2 Inorganic materials 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 238000005304 joining Methods 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910017888 Cu—P Inorganic materials 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5054482U JPS58152714U (ja) | 1982-04-07 | 1982-04-07 | 複合電気接点部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5054482U JPS58152714U (ja) | 1982-04-07 | 1982-04-07 | 複合電気接点部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58152714U JPS58152714U (ja) | 1983-10-13 |
| JPH0249615Y2 true JPH0249615Y2 (zh) | 1990-12-27 |
Family
ID=30061336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5054482U Granted JPS58152714U (ja) | 1982-04-07 | 1982-04-07 | 複合電気接点部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58152714U (zh) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6326890Y2 (zh) * | 1980-05-17 | 1988-07-21 |
-
1982
- 1982-04-07 JP JP5054482U patent/JPS58152714U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58152714U (ja) | 1983-10-13 |
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