JPH0248801A - Package for ultrahigh frequency - Google Patents

Abstract

PURPOSE:To reduce the size and to avoid conversion loss by constituting ultrahigh frequency input/output terminals with a rectangular waveguide arranged while facing a dielectric window provided to a bottom face of a package and coupling the input/output terminals and the waveguide directly. CONSTITUTION:A bare chip 8 of a semiconductor element and a printed circuit board 9 having its conductor pattern on itself are mounted in the package 1. Then the circuit pattern drawn on the printed circuit board 9 and a bias terminal 4 are connected by a bonding wire 10, an antenna 11 made of a metallic plate is arranged to a strip circuit formed on the printed circuit board 9 to be coupled with an input/output waveguide 6. Since the input/output terminals for an ultrahigh frequency signal are formed as waveguides 6, it is possible to connect the antenna 11 directly to the strip line of the printed circuit board 9. Since no coaxial waveguide converter is required, conversion loss is eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ultra-high frequency package, and particularly to an ultra-high frequency package that is used by being directly attached to a waveguide.

[Conventional technology]

In general, when using a semiconductor device such as a field effect transistor at an ultra-high frequency of 10 GH or more, if an ordinary packaged device is used, the Q value of the device will increase due to the parasitic reactance component exhibited by the package.
Adjustment using an external circuit makes it difficult to obtain low loss and wideband characteristics.

In such cases, so-called hybrid RC technology is employed, in which a bare chip of a semiconductor element is directly used to construct a desired circuit, and the circuit is hermetically sealed in a package.

Figure 3 is a diagram showing an example of a conventional ultra-high frequency hybrid IC package, where (a) is a plan view and (b) is a plan view.
) is a front view with the right side cut away.

In these figures, 1 is a metal envelope, 2 is a flange for mounting the package, 3 is a hole for screwing, 4 is a bias terminal, and 5 is a terminal that insulates and holds the terminal from the envelope. An insulator 6A for maintaining airtight sealing is an ultra-high frequency input/output terminal, which is insulated and supported on the bottom surface of the envelope 1 by an insulator 5 to form a coaxial line.

[Problem to be solved by the invention]

In the conventional ultra-high frequency package described above, the input/output terminal 6A is composed of a coaxial line. However, devices used at ultra-high frequencies such as millimeter wave bands are often constructed with waveguide circuits, so a coaxial waveguide converter is required to attach a conventional package to a waveguide. become. That is,
FIG. 4 is a diagram showing a conventional package mounted on a waveguide, in which the flange 2 of the package is screwed to the rectangular waveguide 21 using screws 22. At this time, the input/output terminal 6A of the package is inserted into the hole 23 made on the H side of the waveguide 21, and the antenna 24 is inserted into the tip of the input/output terminal 6A.
is attached. Note that 25 is a lid for hermetically sealing the package.

In this way, in the conventional structure, the antenna 2 is connected to the input/output terminal 6A.
4 to configure a coaxial waveguide converter, the loss of the coaxial waveguide converter is added, and the circuit characteristics inside the package differ from the characteristics of the coaxial waveguide converter. Furthermore, there is a problem in that the overall device becomes larger due to the coaxial waveguide converter.

An object of the present invention is to provide an ultra-high frequency package that eliminates these problems.

[Means to solve the problem]

The ultra-high frequency package of the present invention has at least one ultra-high frequency input/output terminal arranged in a container-shaped envelope in which a semiconductor element or a circuit board can be mounted, on the bottom surface of the envelope. It consists of a rectangular waveguide placed facing an opened dielectric window.

[Effect]

In the above configuration, when mounting the package on the waveguide, the input/output terminal and the waveguide can be directly coupled, and a coaxial waveguide converter is not required.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows an embodiment of the ultra-high frequency hybrid IC package of the present invention, in which FIG. 1(a) is a plan view and FIG. 1(b) is a front view with the right side cut away.

In these figures, a metal envelope 1 formed in the shape of a rectangular container is capable of mounting semiconductor elements, circuit boards, etc. therein, and the upper opening is hermetically sealed with a lid (not shown). There is. Further, the envelope 1 integrally has a flange 2 on its periphery, and a hole 3 for screwing is provided around the flange 2. A plurality of bias terminals 4 are insulated and supported on one side of the envelope 1 by an insulator 5 such as cover glass. Ultra-high frequency input/output terminals are arranged at both ends of the envelope 1, but here these input/output terminals are rectangular conductors formed facing the holes made on the bottom of the envelope 1. It consists of wave tube 6. A dielectric window 7 is formed in this bottom hole to hermetically seal the bottom.

FIG. 2 is a diagram showing a state in which a hybrid IC is manufactured using an ultra-high frequency package having the configuration shown in FIG.
A bare semiconductor chip 8 and a circuit board 9 are mounted inside. The circuit pattern drawn on the circuit board 9 and the bias terminal 4 are connected by a bonding wire 10, and a strip line (not shown) is formed on the circuit board 9.
An antenna 11 made of a metal plate is disposed at and coupled to the input/output waveguide 6.

Therefore, in this configuration, since the ultra-high frequency input/output end is configured as the waveguide 6, it is possible to directly connect the antenna 11 to the strip line of the circuit board 9. Furthermore, when mounting the package on a waveguide, it is sufficient to simply attach the rectangular waveguide 6 for the input and output ends to the holes made in the waveguide, and the rectangular waveguide 6 Dielectric window 7
, it is possible to perform airtight sealing to protect the bare chip 8 of the semiconductor element.

〔Effect of the invention〕

As explained above, in the present invention, the input/output terminals arranged inside the envelope are constructed of rectangular waveguides, and this is sealed with a dielectric window, so the package is mounted on the waveguide. In this case, the input/output terminal and the waveguide can be directly coupled, making a coaxial waveguide converter unnecessary. This eliminates the loss that occurs in coaxial waveguide converters, the circuit characteristics inside the package do not depend on the measurement jig, and it can be directly connected to the waveguide, making the overall device smaller. You can get the effect of

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the ultra-high frequency package of the present invention, in which Fig. 1(a) is a plan view, Fig. 1(b) is a partially cutaway front view, and Fig. 2 is the same as Fig. 1. Figure 3 shows an example of a conventional ultra-high frequency package, where (a) is a plan view and (b) is a partial view. A front view of the
FIG. 4 is a partially cutaway front view of a conventional package attached to a waveguide. 1... Envelope, 2... Flange, 3... Hole, 4...
...Bias terminal, 5...Insulator, 6...Input/output terminal (rectangular waveguide), 6A...Conventional input/output terminal, 7.
... Dielectric window, 8... Semiconductor element chip, 9... Circuit board, 10... Bonding wire, 11... Antenna, 21... Waveguide, 22... Screw, 23... ...hole, 24...antenna, 25...lid. (a) Figure 2 (a) Figure 4 (b)

Claims (1)

[Claims] 1. a container-shaped envelope that integrally has a flange for attachment to the waveguide and into which a semiconductor element or a circuit board can be mounted; a bias terminal that is insulated and supported on the side surface of the envelope;
at least one ultra-high frequency input/output terminal disposed within the envelope, the ultra-high frequency input/output terminal facing a dielectric window disposed on the bottom surface of the envelope. An ultra-high frequency package characterized by being composed of a rectangular waveguide.