JPS61285738A - Package for microwave integrated circuit and connecting method thereof - Google Patents

Abstract

PURPOSE:To make grounding inductance small, by directly connecting the grounding conductor of a ceramic substrate, which is attached to a monolithic microwave integrated circuit in a package, to said package. CONSTITUTION:A plurality of input and output terminals 2 are provided on a ceramic substrate 1. A grounding conductor 3 is provided on the entire surface of the ceramic substrate 1 with a specified interval being provided with the input and output terminals 2. High frequency input and output terminal parts and a bias terminal parts of an MMIC 6, which is attached on the grounding conductor 3, are connected to the input and output terminals 2 with bonding wires 7. The grounding electrode of the MMIC 6 is directly connected to the grounding conductor 3. A ceramic side wall 4 is provided at the peripheral part on the ceramic substrate 1. A metal cap 5 is provided. The input and output terminals 2 are connected to an outer connecting terminals 10 through metal films 8. Meanwhile, the grounding conductor 3 is connected to the metal cap 5 through a grounding metal film 9. Thus, grounding inductance is made small, and the deterioration of the microwave characteristics can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an envelope for a microwave integrated circuit that houses a semiconductor device used in a microwave band frequency, and a method for connecting the same.

[Technical background of the invention and its problems]

As a semiconductor device used in the microwave band, Ga
A: The seven-link microwave integrated circuit (hereinafter referred to as MMIC), which integrates semiconductor elements such as matching circuits, bias circuits, and FETs on a semi-impervious semiconductor substrate such as S, is compact, lightweight, and easy to mass produce. It is attracting attention because of its low price. From the viewpoint of reliability, this MMIC needs to be assembled in an airtight enclosure, and an example of such an enclosure is shown in FIG. Fig. 5 ta) is a plan view, Fig. 5 (b) is a plan view of Fig. 5 (→
A cross-sectional view at x', and FIG. 5(C) is a side view.

FIG. 5(d) is a back view. A plurality of input/output terminals 2 are provided on the surface of the Cerapink board 1, and these input/output terminals 2
A ground conductor 3 is provided over the entire surface of the ceramic substrate 1 with a predetermined interval between the ground conductors 3 and 3 . Further, a ceramic side wall 4 having a shape similar to the outer shape of the ceramic substrate 1 is provided on a narrow side portion of the ceramic substrate 1 so as to surround the center thereof. Furthermore, a lid 5 is provided to close the top of the ceramic side wall 4. Further, an MMIC 6 is mounted on the ground conductor 3, and a high frequency input/output terminal portion and a bias terminal portion of this MMIC 6 are connected to the input/output terminal 2 through bonding wires 7, respectively. - The ground electrode of MMIC6 is grounded by a through hole in MMIC6, etc.
directly connected to body 3. Here, each input/output terminal 2 and ground conductor 3 of the envelope are connected to an external terminal provided on the back surface of the ceramic substrate l via the gold gg8 provided on the side surface of the ceramic substrate 1 and the grounding gold maple film 9, respectively. Connection terminal 1
o and external ground terminal 11.

By the way, the structure in which these envelopes are connected to each other via a dielectric substrate on which a microstrip line is formed is shown in the sixth section.
As shown in the figure. Figure 6 (ta) is a plan view, Figure 6 (b) and Figure 6 (C) are respectively xx' and Y- of Figure 6 (a).
It is a sectional view at Y'.

That is, the envelopes (A, B) are metal carrier plates 2
It is mounted on a dielectric substrate 22 provided on the top of the envelope (
The external connection terminals 10 of A and B) are connected to a center conductor 23 of a microstrip line formed on a dielectric substrate 22.

Further, the external ground terminal 11 of the envelope is connected to a surface ground conductor 24 formed on a dielectric substrate 22, and is connected to a through hole 2.
5 to the back surface ground conductor 26 on the back surface of the dielectric substrate 22.

However, in the structures shown in Figures 5 and 6, the envelopes (A, B
) The grounding conductor 3 is connected to the grounding gold maple film 9 on the side wall of the envelope (A, B). External ground terminal 11° and Ii! Since it is grounded through the through hole 25 of the electric board 22, the grounding inductance becomes large and the characteristics of the MMIC 6 housed in the envelope (A, B) deteriorate.

Furthermore, when two or more envelopes are connected in series, it is necessary to connect them through a dielectric substrate on which a microstring line is formed between the legs of the envelopes, which increases the size and cost. There was a drawback.

[Purpose of the invention]

The present invention eliminates the above-mentioned drawbacks and provides microphone CI
To provide an envelope in which a microwave integrated circuit is incorporated, in which the grounding inductance is small and the microwave characteristics are not deteriorated. In addition, when forming an envelope and a microstrip line, the Ji [77 method with low grounding inductance is provided. ◇ Also, when connecting multiple envelopes in cascade, the connection force method with low grounding inductance and low microwave loss is provided. I will provide a.

[Summary of the invention]

In order to achieve the above object, the present invention provides.

By directly connecting the ground conductor of the ceramic substrate to which the MMIC is attached within the envelope to this envelope, it is possible to provide an envelope with low ground inductance. In addition, place this envelope directly on the metal plate with the lid facing down, and then attach a dielectric substrate with a microstrip line with its grounding part down and adjacent to the envelope. By continuously connecting the connecting terminal and the center conductor of the microstrip line, it is possible to provide a method of connecting the microstrip line and the envelope with low grounding inductance. Mount each side adjacent to each other with the lids down;
Furthermore, by connecting adjacent connection terminals of a plurality of envelopes with respective connection lines, it is possible to provide a connection method for interconnecting a plurality of envelopes with low ground inductance and low microwave loss.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

Figure 1 shows the structure of the envelope of the present invention.
a) is a plan view, FIG. 1(b) is a cross-sectional view along x-x'Ic, % FIG. 1(C) is a side view, and FIG. 1(d) is a back view. A plurality of input/output terminals 2 are provided on the surface, and a grounding conductor 3 with predetermined spacing between these input/output terminals 2 is installed over the entire surface of the ceramic substrate ◎In addition, each input/output terminal 2 and By providing a predetermined distance between the ground conductor 3 and the ground conductor 3, a cograin line is formed. Also, an MMIC 6 is installed on the ground conductor 3,
A high frequency input/output terminal section and a bias terminal section of this MMIC 6 are connected to the input/output terminal 2 through bonding wires 7, respectively. - The ground electrode of MMIC6 is M
It is directly connected to the ground conductor 3 through a through hole or the like in the MIC 6.

Further, a ceramic side wall 4 having a shape similar to the outer shape of the ceramic substrate 1 is provided at the peripheral portion of the ceramic substrate 1 so as to surround the center thereof, and a metallic side wall 4 is provided to close the upper part of the ceramic 11 wall 4. A lid 5 is provided. Here, each input/output terminal 2 of the envelope is connected to an external connection terminal lO provided on the back surface of the ceramic substrate 1 via a metal film 8 provided on the side wall 4, while a ground conductor 3 is connected to the side wall 4.
It is connected to the metal lid 5 via a grounding metal film 9 provided on the ground.

Next, FIG. 2 shows a structure in which the envelopes of the present invention are interconnected via a dielectric substrate 22 on which a microstrip line is formed. Figure 2 (1) is a plan view.

FIG. 2(b) is a sectional view taken along line xx'. As shown in FIG. 2, the envelopes (A, B) are directly mounted on a metallic medium gelatin plate 21 via a dielectric substrate 22 with the metallic lid 5 facing down. In addition, the external connection terminal IO is connected to the dielectric substrate 2.
2 Center conductor 2 of the microstrip line formed above
3 with a connecting wire such as a metal foil 27.

When the enclosures (A, B) having the above configuration are connected to each other, each grounding conductor 3 in the enclosure (A, B) is connected to the grounding metal film 9 and the metal cover 5. Since it is directly grounded through
Grounding inductance can be significantly reduced compared to conventional methods. Therefore, each M in the envelope (A, B)
Deterioration in the performance of MIC6 can be sufficiently reduced.

Figure 3 shows a structure in which the envelopes (A, B) of the present invention are connected in series without intervening a dielectric substrate.
a) is a top view, and FIG. 3(b) is a view taken along line XX' in FIG. 3(a).
FIG. That is, each envelope (A, B
) is placed directly adjacent to the carrier plate 21 with the lid 5 of the envelope (A, B) facing down, as in FIG.
The mutually opposing portions of the external connection terminals 10 of each of the external enclosures (A, B) are connected with metal foil 27 or the like.

In the above structure shown in FIG. 3, each of the ground conductors 3 in the envelopes (A, B) is directly grounded via the grounding metal film 9 and the lid 5, so that the same effect as in the above embodiment is produced. . In addition, since the microstrip line 23 is not inserted between the legs of the envelopes (A, B), microwave loss can be reduced, and the circuit can be made smaller, lighter, and less expensive. indicates a joint where the envelopes (A, B) are interconnected; if the envelopes (A, B) are directly connected, impedance mismatch may occur at the joint due to discontinuity. In this case, an island-shaped electrode 12 with a capacitance is provided around the external connection terminal 10, and a connection line 13 or the like is used to connect between this electrode 12 and the external connection terminal 10. Impedance mismatch can be reduced.

〔Effect of the invention〕

As described above, according to the present invention, in an enclosure trap incorporating a microwave integrated circuit, the grounding inductance of the microwave integrated circuit can be reduced by connecting the grounding part of the microwave integrated circuit to the lid of the enclosure. A circuit envelope can be provided. In addition, when connecting the microwave integrated circuit envelope and the microstrip line, the lid of the envelope is facing down and the connection is made directly to the carrier plate, so the microwave integrated circuit envelope has low grounding inductance. It is possible to provide a method for connecting devices. In addition, when connecting multiple microwave integrated circuit envelopes to each other, each envelope is placed directly onto the carrier plate with its lid facing down, and the external connection terminals of each are connected using connecting wires. , it is possible to provide a method for connecting an envelope for a microwave integrated circuit with low grounding inductance and low microwave loss.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view of a microwave integrated circuit incorporated into an envelope according to the present invention, FIG. 1(b) is a sectional view taken along line xx' in FIG. 1(a), and FIG. ) is a side view of Fig. 1 ta), Fig. 1 (d) is a back view of Fig. 1 (al), Fig. 2 +
8) is a plan view of the envelope shown in FIG. 1 connected to the microstrip line by the connection method according to the present invention, and FIG.
) are Fig. 2(a) x-x' sectional view at K, Fig. 3(
a) is a plan view of a plurality of envelopes shown in FIG. 1 connected to each other by the connection method according to the present invention, and FIG.
xx' sectional view in a), FIG. 4 is a plan view showing a part of the connecting part where envelopes with island-like electrodes are interconnected, and FIG. 5(a) is a conventional envelope. 5(b) is a cross-sectional view taken along line X-X in FIG. 5(a), and FIG. 5(C) is a side view of FIG. 5(a). , Fig. 5(d) is the back view of the broom Fig. 5(a), Fig. 6+8
) is a plan view connecting the envelope and microstrip line in Figure 5, and Figures 6(b) and 6(C) are Figure 6(a).
). l...ceramic board, 2...input/output terminal, 3...
- Grounding conductor, 4... Side wall, 5... Lid, 7... Bonding wire, 8... Metal film, 9... Metal film for grounding, 10'... External connection terminal, 21. ...Carrier plate, 22...Dielectric substrate, 23...Center conductor,
27... Connection line. Agent Patent attorney Kensuke Chika (and 1 other person) (c>(b) Hikari J-zu

Claims (3)

[Claims] (1) a ceramic substrate; at least one input/output terminal provided in the peripheral portion on the surface of the ceramic substrate;
A grounding conductor to which the microwave integrated circuit is attached is provided on the surface of the ceramic substrate at a predetermined distance around the input/output terminal, and an input/output section of the microwave integrated circuit attached to the grounding conductor. A connection body for connecting the input/output terminals, a connection terminal provided at a position on the back surface of the ceramic substrate corresponding to the position of the input/output terminal, and a connection terminal provided at a peripheral portion on the surface of the ceramic substrate at the center of the ceramic substrate. a metal lid that closes an upper part of the side wall, and a conductor that connects the input/output terminal and the connection terminal, and the ground conductor and the lid, respectively. Envelope for microwave integrated circuits. (2) a ceramic substrate; at least one input/output terminal provided on the peripheral portion of the surface of the ceramic substrate;
A grounding conductor to which the microwave integrated circuit is attached is provided on the surface of the ceramic substrate at a predetermined distance around the input/output terminal, and an input/output section of the microwave integrated circuit attached to the grounding conductor. A connection body for connecting the input/output terminals, a connection terminal provided at a position on the back surface of the ceramic substrate corresponding to the position of the input/output terminal, and a connection terminal provided at a peripheral portion on the surface of the ceramic substrate at the center of the ceramic substrate. a metal lid that closes an upper part of the side wall, and a conductor that connects the input/output terminal, the connection terminal, the ground conductor, and the lid, respectively. A microwave integrated circuit envelope is mounted on a metal carrier plate with the lid facing down, and a dielectric substrate on which a microstrip line is formed adjacent to the envelope is placed on the carrier plate and connected thereto. It is mounted adjacent to the envelope with the ground facing down, and the connection terminal of the envelope and the center conductor of the microstrip line are connected by a connecting wire, and the envelope and the microstrip line are connected to each other by a connecting wire. A method for connecting an envelope for a microwave integrated circuit, the method comprising: connecting an envelope for a microwave integrated circuit. (3) a ceramic substrate, at least one input/output terminal provided on the peripheral portion of the surface of the ceramic substrate;
A grounding conductor to which the microwave integrated circuit is attached is provided on the surface of the ceramic substrate at a predetermined distance around the input/output terminal, and an input/output section of the microwave integrated circuit attached to the grounding conductor. A connection body for connecting the input/output terminals, a connection terminal provided at a position on the back surface of the ceramic substrate corresponding to the position of the input/output terminal, and a connection terminal provided at a peripheral portion on the surface of the ceramic substrate at the center of the ceramic substrate. a metal lid that closes an upper part of the side wall, and a conductor that connects the input/output terminal and the connection terminal, and the ground conductor and the lid, respectively. mounting a plurality of microwave integrated circuit enclosures adjacent to each other on a metal carrier plate with the lid facing down, and connecting the adjacent connection terminals of the plurality of enclosures with connection wires, respectively; A method for connecting an envelope for a microwave integrated circuit, comprising connecting the plurality of envelopes.