JPH0247109B2 - - Google Patents

Info

Publication number
JPH0247109B2
JPH0247109B2 JP59205022A JP20502284A JPH0247109B2 JP H0247109 B2 JPH0247109 B2 JP H0247109B2 JP 59205022 A JP59205022 A JP 59205022A JP 20502284 A JP20502284 A JP 20502284A JP H0247109 B2 JPH0247109 B2 JP H0247109B2
Authority
JP
Japan
Prior art keywords
signal terminal
cathode
resin
plate
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59205022A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6184047A (ja
Inventor
Masanori Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59205022A priority Critical patent/JPS6184047A/ja
Publication of JPS6184047A publication Critical patent/JPS6184047A/ja
Publication of JPH0247109B2 publication Critical patent/JPH0247109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W72/00—

Landscapes

  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59205022A 1984-09-29 1984-09-29 樹脂封止形モジユ−ル Granted JPS6184047A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59205022A JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59205022A JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Publications (2)

Publication Number Publication Date
JPS6184047A JPS6184047A (ja) 1986-04-28
JPH0247109B2 true JPH0247109B2 (cg-RX-API-DMAC10.html) 1990-10-18

Family

ID=16500144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59205022A Granted JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Country Status (1)

Country Link
JP (1) JPS6184047A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235658A (ja) * 1985-08-09 1987-02-16 Fuji Electric Co Ltd 半導体装置
EP0609528A1 (en) * 1993-02-01 1994-08-10 Motorola, Inc. Low inductance semiconductor package
JP3013794B2 (ja) * 1996-12-10 2000-02-28 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6184047A (ja) 1986-04-28

Similar Documents

Publication Publication Date Title
US10008392B2 (en) Method for producing a power semiconductor module
JP5176507B2 (ja) 半導体装置
US7227259B2 (en) Low-inductance circuit arrangement for power semiconductor modules
US7898080B2 (en) Power semiconductor device comprising a semiconductor chip stack and method for producing the same
JPS60163447A (ja) 半導体素子
US4839713A (en) Package structure for semiconductor device
JP2828056B2 (ja) 半導体装置及びその製造方法
KR20050042724A (ko) 반도체 장치
US6664629B2 (en) Semiconductor device
JPH0247109B2 (cg-RX-API-DMAC10.html)
JP2020519027A (ja) 半導体モジュール
JPH0648874Y2 (ja) 半導体装置
JP3048707B2 (ja) 混成集積回路
KR100487464B1 (ko) 리드프레임을이용한반도체칩패키지
JPH0325965A (ja) 半導体装置
EP0181975A1 (en) Semiconductor device comprising a support body
JP3011502B2 (ja) 混成集積回路
JPH069519Y2 (ja) 高周波回路の実装構造
JPS63269553A (ja) 樹脂封止型半導体装置
JP2021177516A (ja) 半導体装置
JPH1197585A (ja) 絶縁物封止型電子装置
JPS63104458A (ja) 半導体装置
JPS6236385B2 (cg-RX-API-DMAC10.html)
EP3496141A1 (en) Semiconductor module
JPH04350990A (ja) 混成集積回路