JPH0247109B2 - JUSHIFUSHIGATAMOJUURU - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed module in which a plurality of semiconductor chips are sealed with resin.

[Conventional technology]

Hereinafter, a resin-sealed power thyristor module in which two thyristor chips are sealed with resin will be described as an example.

FIG. 2A is a plan view showing a conventional power thyristor module before being sealed with resin, and FIG. 2B is a sectional view taken along the line BB in FIG. 2A.

In the figure, 1 is a heat dissipation plate made of a metal plate, 2 is an insulating substrate made of a ceramic plate and fixed on a part of the upper surface of the heat dissipation plate 1, and 3a and 3b are each made of a metal plate, and one end side is an insulating substrate 2. L-shaped parts are fixed on the right and left parts of the upper surface with a space between them, and the other end extends upward from the right and left edges of the upper surface of the insulating substrate 2. Insulated board 2
an anode pull-out plate on which the anode plate of the thyristor chip, which will be described later, is brazed onto the part fixed to the top surface;
4a and 4b are thyristor chips having a gate electrode formed at the center of one main surface, a cathode formed surrounding the gate electrode in a part other than the gate electrode forming part, and an anode formed at the other main surface. , 5a and 5b are respectively made of molybdenum plates, and the upper surfaces are brazed to the anodes of the thyristor chips 4a and 4b, and the lower surfaces are the anode drawer plates 3a and 3b.
An anode plate 6a and 6b are each made of a metal rod, and a gate lead 7a has one end brazed to the gate electrode of the thyristor chips 4a and 4b.
and 7b are metal plates each having a U-shaped cathode plate whose central part is brazed to the cathodes of thyristor chips 4a and 4b and whose both ends are bent upwards; 8a and 8b are metal plates each and which is a U-shaped cathode plate whose central part is brazed to the cathodes of thyristor chips 4a and 4b; a cathode drawer plate, one end of which is welded to the left end and the right end of the cathode plate 7b;
9a and 9b are each made of an insulating material and are fixed on the left outer part of the insulating substrate 2 on the upper surface of the heat sink 1 so as to face each other with a gap in the direction perpendicular to the arrangement direction of the thyristor chips 4a and 4b. The signal terminal plate holders 10a and 11a, each of which holds a signal terminal plate for applying an operating signal between the gate and the cathode of the thyristor chip 4a and between the gate and the cathode of the thyristor chip 4b, are each made of a metal plate and have a metal plate between them. The signal terminals are arranged at intervals such that the lower end side protrudes outward from the side of the signal terminal board holder 9a opposite to the signal terminal board holder 9b side, and the upper end side extends upward from the upper surface of the signal terminal board holder 9a. The gate signal terminal plate held by the plate holder 9a and connected to the gate lead 6a and the cathode signal terminal plate 10b and 11b connected to the cathode plate 7a are the same as the gate signal terminal plate 10a and the cathode signal terminal plate 11a, respectively. The gate signal terminal plate held by the signal terminal plate holder 9b and connected to the gate lead 6b and the cathode signal terminal plate 12a and 12b connected to the cathode plate 7b are each made of thin metal wire, and one end thereof is connected to the gate lead 6a. and first and second leads soldered to the gate lead 6b, the other end of which is soldered to the lower end of the gate signal terminal board 10a and the lower end of the gate signal terminal board 10b.
The gate wirings 13a and 13b have one end soldered to the right end of the cathode plate 7a and the left end of the cathode plate 7b, respectively, like the gate wirings 12a and 12b, and the other end soldered to the cathode signal. First and second cathode wirings are soldered to the lower end of the terminal board 11a and the lower end of the cathode signal terminal board 11b; reference numeral 14 denotes an insulating substrate 2; anode lead-out plates 3a and 3;
Required parts of b, thyristor chips 4a, 4b, anode plates 5a, 5b, gate leads 6a, 6b, cathode plates 7a, 7b, required parts of cathode pull-out plates 8a, 8b, signal terminal board holder 9a, 9b, gate signal Required parts of terminal boards 10a and 10b, required parts of cathode signal terminal boards 11a and 11b, gate wiring 12
It is a resin container whose lower end surface is fixed to the upper surface of the heat sink 1, surrounding the cathode wires 13a, 12b and the cathode wires 13a, 13b.

This conventional power thyristor module is completed by injecting a sealing resin into the resin container 14 after assembling it in the state shown.

Since the conventional power thyristor module is configured as described above, the gate signal terminal board 10
The thyristor chip 4a is activated by applying a gate signal between the gate signal terminal plate 10b and the cathode signal terminal plate 11a, and the thyristor chip 4a is activated by applying a gate signal between the gate signal terminal plate 10b and the cathode signal terminal plate 11b. The thyristor chip 4b then operates.

[Problem that the invention seeks to solve]

In the conventional power thyristor module as described above, the gate wiring 12a and the cathode wiring 13a
Since the length of the thyristor chip 4b is long (for example, about 10 cm), these wirings 12a and 13a are connected to the thyristor chip 4b.
If the thyristor chip 4b is brought close to the thyristor chip 4b, there is a risk that the thyristor chip 4a may malfunction due to electromagnetic induction to the wirings 12a and 13a due to the main current flowing between the anode and cathode of the thyristor chip 4b. In addition, the wiring 12a, 12
If these wirings 12a, 12b, 13a, 13b are damaged in the process after wiring wiring 12a, 13a, 13b, these wirings 12a, 12b, 13
There was a problem that there was a risk of wire breakage occurring in a and 13b, resulting in poor reliability. Further, it is necessary to position and fix the signal terminal plate holding stands 9a and 9b on the upper surface of the insulating substrate 2. Further, both ends of the gate wirings 12a, 12b are connected to gate leads 6a, 6b and gate signal terminal boards 10a, 10, respectively.
Position and solder the cathode wiring 13a,
Both ends of 13b had to be positioned and soldered to cathode plates 7a, 7b and cathode signal terminal plates 11a, 11b, respectively, resulting in a problem that assembly workability was extremely poor.

The present invention has been made to solve these problems, and an object of the present invention is to provide a resin-sealed module that is highly reliable and extremely easy to assemble.

[Means for solving problems]

The resin-sealed module according to the present invention has a central portion embedded in a container wall of a resin container housing a plurality of semiconductor chips having a control electrode and first and second main electrodes, and one end portion of the resin-sealed module. The control electrode of the semiconductor chip is formed such that it extends over the control electrode of the semiconductor chip so that it can be engaged with and soldered to, and the other end extends from the container wall into the resin container and extends above the resin container. Each of the plurality of semiconductor chips is provided with a control electrode signal terminal plate to which an activation signal is applied.

[Effect]

In this invention, even if the length of the control electrode signal terminal plate is long, the central part of the control electrode signal terminal plate is embedded in the container wall of the resin container. Since there is no risk that this control electrode signal terminal board will come close to a semiconductor chip other than the one to which it is connected, the semiconductor chip to which this control electrode signal terminal board is connected will not be able to connect between the first and second main electrodes of semiconductor chips other than this semiconductor chip. There is no malfunction due to electromagnetic induction caused by the flowing main current, and there is no risk of damage to the control electrode signal terminal plate and disconnection, resulting in better reliability than in the conventional device. Furthermore, since the signal terminal plate holder and the wiring made of thin metal wires in the conventional device are not required, the assembly workability is much better than in the conventional device.

〔Example〕

FIG. 1A is a plan view showing a state before resin sealing of an embodiment of the present invention, and FIG. 1B is a B--FIG.
It is a sectional view taken along the B line.

In the figure, the same reference numerals as those of the above-mentioned conventional device indicate equivalent parts. 4a and 4b are thyristor chips which are semiconductor chips in this embodiment, 6a and 6b are gate leads which are control electrodes in this embodiment, and 20a and 20b are thyristor chips each made of a metal plate and whose center part is a resin container 14. 4a and 4b are embedded in the walls of the container in the direction perpendicular to the arrangement direction of the resin container 14, and the right end engages with the gate leads 6a and 6b to enable soldering, and the left end extends into the resin container 14. In this embodiment, the insulating substrate 2 is formed to extend into the resin container 14 from the left outer container wall portion and extend above the resin container 14, and an actuation signal is applied to the gate lead 6a and the gate lead 6b. first and second gate signal terminal plates, 21, which are control electrode signal terminal plates;
a and 21b are gate signal terminal boards 20, respectively.
Gate signal terminal plate 20a and gate signal terminal plate 2 in the container wall of resin container 14 in the same manner as a and 20b.
The center part is buried in the lower part of each of the cathode plates 7a and 0b, and the right end part engages with the right end part of the cathode plate 7a and the left end part of the cathode plate 7b, and can be soldered. The left end extends into the resin container 14 from the respective left portions of the container wall of the resin container 14 with a gap between the gate signal terminal plate 20a and the gate signal terminal plate 20b. The cathode plate 7 is formed to extend upward from the cathode plate 14.
a and cathode plate 7b are first and second cathode signal terminal plates to which actuation signals are applied.

In the power thyristor module configured as described above, even if the gate signal terminal plate 20a and the cathode signal terminal plate 21a are long, the center portions of these signal terminal plates 20a and 21a are made of resin. Since these signal terminal boards 20a and 21a are buried in the wall of the container 14, there is no risk of them coming close to the thyristor chip 4b, so that they are not affected by electromagnetic induction caused by the main current flowing between the anode and cathode of the thyristor chip 4b. Thyristor chip 4a
There is no risk of malfunction, and the signal terminal board 20
There is no fear of damage to a, 21a, 20b, and 21b resulting in disconnection, and reliability is improved compared to the conventional device. Furthermore, since the signal terminal plate holding stands 9a, 9b and the wires 12a, 12b, 13a, 13b from the thin metal wires in the conventional device are no longer required, the assembly workability is much better than in the conventional device.

Note that in this embodiment, the cathode signal terminal plate 21
a, 21b are provided, but these are not necessarily necessary, and these cathode signal terminal plates 21a, 21b are provided.
may be omitted. In this case, instead of the cathode signal terminal plates 21a and 21b, the cathode drawer plate 8
a, 8b may be used.

Further, in this embodiment, a resin-sealed power thyristor module has been described as an example, but the present invention is not limited to this, and can be applied to other devices such as a transistor chip having a control electrode and first and second main electrodes. It can also be applied to a resin-sealed module using a semiconductor chip.

〔Effect of the invention〕

As explained above, the present invention has a central portion embedded in the container wall of a resin container that accommodates a plurality of semiconductor chips having a control electrode and first and second main electrodes, and one end portion of which contains a plurality of semiconductor chips. It extends over the control electrode so that it can be engaged with and soldered to, and the other end extends from the container wall into the resin container and extends above the resin container, and is actuated to the control electrode of the semiconductor chip. Since a control electrode signal terminal plate to which a signal is applied is provided on each of the plurality of semiconductor chips, even if the control electrode signal terminal plate is long, the center part of the control electrode signal terminal plate is made of resin. Since this control electrode signal terminal plate is embedded in the container wall of the container, there is no risk that the control electrode signal terminal plate will come close to a semiconductor chip other than the semiconductor chip to which this control electrode signal terminal plate is connected. There is no risk of malfunction due to electromagnetic induction due to the main current flowing between the first and second main electrodes of semiconductor chips other than this semiconductor chip, and there is no risk of damage to the control electrode signal terminal plate and disconnection. Therefore, the reliability is better than that of the conventional device. Furthermore, since the signal terminal holder and the wiring made of thin metal wires in the conventional device are not required, the assembly workability is much better than in the conventional device.

[Brief explanation of drawings]

FIG. 1A is a plan view showing a state before resin sealing of an embodiment of the present invention, and FIG. 1B is a B--FIG.
Figure 2A is a plan view of a conventional power thyristor module before being sealed with resin, and Figure 2B is a cross-sectional view taken along line B-B of Figure 2A. be. In the figure, 1 is a heat sink, 2 is an insulating substrate, and 4a
and 4b is a semiconductor chip (thyristor chip),
6a and 6b are control electrodes (gate leads), 2
0a and 20b are control electrode signal terminal plates (gate signal terminal plates). Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] 1 a plurality of semiconductor chips having a control electrode and first and second main electrodes fixed to the upper surface of an insulating substrate fixed to a portion of the upper surface of the heat sink with a space therebetween; the above-mentioned insulating substrate; and a resin container surrounding the plurality of semiconductor chips and having a lower end surface fixed to the upper surface of the heat sink, and a resin container provided corresponding to each of the plurality of semiconductor chips and having a central portion within the container wall of the resin container. The chip is embedded in the resin container with one end extending over the control electrode of the semiconductor chip to enable soldering, and the other end extending from the container wall into the resin container. A resin-sealed module comprising a control electrode signal terminal plate extending upward for applying an actuation signal to the semiconductor chip.