JPH0246062Y2 - - Google Patents

Info

Publication number
JPH0246062Y2
JPH0246062Y2 JP1985136894U JP13689485U JPH0246062Y2 JP H0246062 Y2 JPH0246062 Y2 JP H0246062Y2 JP 1985136894 U JP1985136894 U JP 1985136894U JP 13689485 U JP13689485 U JP 13689485U JP H0246062 Y2 JPH0246062 Y2 JP H0246062Y2
Authority
JP
Japan
Prior art keywords
base material
printed wiring
conductor
wiring board
porous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985136894U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245863U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985136894U priority Critical patent/JPH0246062Y2/ja
Publication of JPS6245863U publication Critical patent/JPS6245863U/ja
Application granted granted Critical
Publication of JPH0246062Y2 publication Critical patent/JPH0246062Y2/ja
Expired legal-status Critical Current

Links

JP1985136894U 1985-09-09 1985-09-09 Expired JPH0246062Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985136894U JPH0246062Y2 (fr) 1985-09-09 1985-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985136894U JPH0246062Y2 (fr) 1985-09-09 1985-09-09

Publications (2)

Publication Number Publication Date
JPS6245863U JPS6245863U (fr) 1987-03-19
JPH0246062Y2 true JPH0246062Y2 (fr) 1990-12-05

Family

ID=31040435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985136894U Expired JPH0246062Y2 (fr) 1985-09-09 1985-09-09

Country Status (1)

Country Link
JP (1) JPH0246062Y2 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225750A (ja) * 1984-04-24 1985-11-11 株式会社 潤工社 プリント基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225750A (ja) * 1984-04-24 1985-11-11 株式会社 潤工社 プリント基板

Also Published As

Publication number Publication date
JPS6245863U (fr) 1987-03-19

Similar Documents

Publication Publication Date Title
KR100338908B1 (ko) 인쇄회로기판및그의제조방법과전자구성부품패키지및그의제조방법
US4634631A (en) Flexible circuit laminate and method of making the same
US5505321A (en) Fabrication multilayer combined rigid/flex printed circuit board
JP3019541B2 (ja) コンデンサ内蔵型配線基板およびその製造方法
JPH031833B2 (fr)
JP3570802B2 (ja) 銅薄膜基板及びプリント配線板
JPH03177376A (ja) セラミック基板
CN111642068A (zh) Rcc基板及多层叠置软板
JPH0246062Y2 (fr)
US5583320A (en) Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board
JPH0246060Y2 (fr)
JPH0231795Y2 (fr)
JPH02140991A (ja) フレキシブル印刷配線板
JP2006229097A (ja) コンデンサフィルム及びその製造方法
JPH0720686B2 (ja) セラミックコート熱可塑性樹脂積層板の製造方法
JPH07120854B2 (ja) 多層配線板
GB2240663A (en) Metal base wiring board
JPH0429590Y2 (fr)
JPH02293132A (ja) 熱可塑性樹脂積層板
JPH02187329A (ja) 熱可塑性樹脂積層板
JPH03149896A (ja) 薄膜多層配線回路基板
JP2004241394A (ja) 接着フィルム及びこれを用いた積層板の製造法
JPS6330798B2 (fr)
JPS63203331A (ja) セラミツクコ−ト積層板の製造方法
JPS63280629A (ja) プリント配線基板の製造方法