JPH0246062Y2 - - Google Patents
Info
- Publication number
- JPH0246062Y2 JPH0246062Y2 JP1985136894U JP13689485U JPH0246062Y2 JP H0246062 Y2 JPH0246062 Y2 JP H0246062Y2 JP 1985136894 U JP1985136894 U JP 1985136894U JP 13689485 U JP13689485 U JP 13689485U JP H0246062 Y2 JPH0246062 Y2 JP H0246062Y2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- printed wiring
- conductor
- wiring board
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- -1 polytetrafluoroethylene Polymers 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- 229920001577 copolymer Polymers 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000239290 Araneae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001410 Microfiber Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003658 microfiber Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985136894U JPH0246062Y2 (fr) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985136894U JPH0246062Y2 (fr) | 1985-09-09 | 1985-09-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6245863U JPS6245863U (fr) | 1987-03-19 |
JPH0246062Y2 true JPH0246062Y2 (fr) | 1990-12-05 |
Family
ID=31040435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985136894U Expired JPH0246062Y2 (fr) | 1985-09-09 | 1985-09-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0246062Y2 (fr) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
-
1985
- 1985-09-09 JP JP1985136894U patent/JPH0246062Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6245863U (fr) | 1987-03-19 |
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