JPH0246061Y2 - - Google Patents
Info
- Publication number
- JPH0246061Y2 JPH0246061Y2 JP1986038470U JP3847086U JPH0246061Y2 JP H0246061 Y2 JPH0246061 Y2 JP H0246061Y2 JP 1986038470 U JP1986038470 U JP 1986038470U JP 3847086 U JP3847086 U JP 3847086U JP H0246061 Y2 JPH0246061 Y2 JP H0246061Y2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer sheet
- reinforcing
- metal
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 239000011148 porous material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- 239000003989 dielectric material Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003292 diminished effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
- Y10T428/24182—Inward from edge of web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/249991—Synthetic resin or natural rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038470U JPH0246061Y2 (US07655688-20100202-C00086.png) | 1986-03-17 | 1986-03-17 | |
GB8719883A GB2208971B (en) | 1986-03-17 | 1987-08-22 | A reinforced porous dielectric sheet |
EP87307452A EP0304516A1 (en) | 1986-03-17 | 1987-08-24 | A reinforced porous dielectric sheet |
US07/190,458 US4857381A (en) | 1986-03-17 | 1988-05-05 | Reinforced dielectric sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038470U JPH0246061Y2 (US07655688-20100202-C00086.png) | 1986-03-17 | 1986-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62166671U JPS62166671U (US07655688-20100202-C00086.png) | 1987-10-22 |
JPH0246061Y2 true JPH0246061Y2 (US07655688-20100202-C00086.png) | 1990-12-05 |
Family
ID=12526127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986038470U Expired JPH0246061Y2 (US07655688-20100202-C00086.png) | 1986-03-17 | 1986-03-17 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4857381A (US07655688-20100202-C00086.png) |
EP (1) | EP0304516A1 (US07655688-20100202-C00086.png) |
JP (1) | JPH0246061Y2 (US07655688-20100202-C00086.png) |
GB (1) | GB2208971B (US07655688-20100202-C00086.png) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089674A (en) * | 1990-04-25 | 1992-02-18 | Microtel Pacific Research Limited | Hydrostatic pressure sensor |
GB9020428D0 (en) * | 1990-09-19 | 1990-10-31 | Gore W L & Ass Uk | Thermal control materials |
US5097099A (en) * | 1991-01-09 | 1992-03-17 | Amp Incorporated | Hybrid branch cable and shield |
GB2255676B (en) * | 1991-05-08 | 1995-09-27 | Fuji Electric Co Ltd | Metallic printed board |
JP2601128B2 (ja) * | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | 回路形成用基板の製造方法および回路形成用基板 |
WO1994007348A1 (en) * | 1992-09-24 | 1994-03-31 | Hughes Aircraft Company | Dielectric vias within multilayer 3-dimensional structures/substrates |
US5354603A (en) * | 1993-01-15 | 1994-10-11 | Minnesota Mining And Manufacturing Company | Antifouling/anticorrosive composite marine structure |
US5484641A (en) * | 1993-11-01 | 1996-01-16 | Rotter; Martin J. | Process for fixing plastic reinforcing pins into non-woven filamentary material and product produced by the process |
US5449427A (en) * | 1994-05-23 | 1995-09-12 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
US5571608A (en) * | 1994-07-15 | 1996-11-05 | Dell Usa, L.P. | Apparatus and method of making laminate an embedded conductive layer |
US5733639A (en) * | 1995-06-30 | 1998-03-31 | Poly Circuits/M-Wave | Circuit board assembly with foam substrate and method of making same |
JP2003136623A (ja) * | 2001-08-22 | 2003-05-14 | Tdk Corp | モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法 |
US8125341B2 (en) * | 2007-12-10 | 2012-02-28 | Checkpoint Systems, Inc. | Resonant tag with reinforced deactivation dimple |
KR101057088B1 (ko) * | 2011-02-16 | 2011-08-16 | (주) 우주케이에프씨 | 환형도체를 사용한 플렉시블 플랫 케이블 |
CN102260378B (zh) * | 2011-05-06 | 2013-03-20 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2789076A (en) * | 1953-09-21 | 1957-04-16 | Frieder | Laminated ballistic fabric |
FR1206380A (fr) * | 1958-08-14 | 1960-02-09 | Etude Des Panneaux Polyvalents | Procédé de fabrication de panneaux et panneaux ainsi fabriqués |
US3446692A (en) * | 1964-06-01 | 1969-05-27 | Pullman Inc | Insulated panel and method of making same |
US3614848A (en) * | 1964-06-09 | 1971-10-26 | Pullman Inc | Foam structural element |
US4518737A (en) * | 1978-12-26 | 1985-05-21 | Rogers Corporation | Dielectric material and method of making the dielectric material |
US4451527A (en) * | 1981-07-28 | 1984-05-29 | Minnesota Mining And Manufacturing Company | Conformable metal-clad laminate |
US4452657A (en) * | 1982-09-15 | 1984-06-05 | The Boeing Company | Composite integral web stiffening method |
US4514450A (en) * | 1983-11-01 | 1985-04-30 | Union Carbide Corporation | Peg supported thermal insulation panel |
US4591659A (en) * | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
JPS60169904U (ja) * | 1984-04-20 | 1985-11-11 | 株式会社 潤工社 | ストリップラインケーブル |
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
US4680220A (en) * | 1985-02-26 | 1987-07-14 | W. L. Gore & Associates, Inc. | Dielectric materials |
JPH0220857Y2 (US07655688-20100202-C00086.png) * | 1985-11-06 | 1990-06-06 |
-
1986
- 1986-03-17 JP JP1986038470U patent/JPH0246061Y2/ja not_active Expired
-
1987
- 1987-08-22 GB GB8719883A patent/GB2208971B/en not_active Expired - Fee Related
- 1987-08-24 EP EP87307452A patent/EP0304516A1/en not_active Withdrawn
-
1988
- 1988-05-05 US US07/190,458 patent/US4857381A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB2208971A (en) | 1989-04-19 |
JPS62166671U (US07655688-20100202-C00086.png) | 1987-10-22 |
US4857381A (en) | 1989-08-15 |
GB2208971B (en) | 1991-05-01 |
EP0304516A1 (en) | 1989-03-01 |
GB8719883D0 (en) | 1987-09-30 |
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