JPH0246029Y2 - - Google Patents
Info
- Publication number
- JPH0246029Y2 JPH0246029Y2 JP9074585U JP9074585U JPH0246029Y2 JP H0246029 Y2 JPH0246029 Y2 JP H0246029Y2 JP 9074585 U JP9074585 U JP 9074585U JP 9074585 U JP9074585 U JP 9074585U JP H0246029 Y2 JPH0246029 Y2 JP H0246029Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- resin
- chip
- exterior case
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000011888 foil Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9074585U JPH0246029Y2 (de) | 1985-06-15 | 1985-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9074585U JPH0246029Y2 (de) | 1985-06-15 | 1985-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61207024U JPS61207024U (de) | 1986-12-27 |
| JPH0246029Y2 true JPH0246029Y2 (de) | 1990-12-05 |
Family
ID=30646012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9074585U Expired JPH0246029Y2 (de) | 1985-06-15 | 1985-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246029Y2 (de) |
-
1985
- 1985-06-15 JP JP9074585U patent/JPH0246029Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61207024U (de) | 1986-12-27 |
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