JPH0241856Y2 - - Google Patents
Info
- Publication number
- JPH0241856Y2 JPH0241856Y2 JP8858584U JP8858584U JPH0241856Y2 JP H0241856 Y2 JPH0241856 Y2 JP H0241856Y2 JP 8858584 U JP8858584 U JP 8858584U JP 8858584 U JP8858584 U JP 8858584U JP H0241856 Y2 JPH0241856 Y2 JP H0241856Y2
- Authority
- JP
- Japan
- Prior art keywords
- face
- capacitor element
- exterior
- capacitor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 71
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011140 metalized polyester Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8858584U JPS614419U (ja) | 1984-06-14 | 1984-06-14 | チツプ型コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8858584U JPS614419U (ja) | 1984-06-14 | 1984-06-14 | チツプ型コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS614419U JPS614419U (ja) | 1986-01-11 |
| JPH0241856Y2 true JPH0241856Y2 (de) | 1990-11-08 |
Family
ID=30641866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8858584U Granted JPS614419U (ja) | 1984-06-14 | 1984-06-14 | チツプ型コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS614419U (de) |
-
1984
- 1984-06-14 JP JP8858584U patent/JPS614419U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS614419U (ja) | 1986-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5432378A (en) | Subminiature surface mounted circuit protector | |
| US6229688B1 (en) | Chip type solid electrolytic capacitor | |
| US5351026A (en) | Thermistor as electronic part | |
| US4578737A (en) | Synthetic resin film wound capacitor | |
| JPS60225414A (ja) | チツプデバイスとしてのコンデンサおよびその製造方法 | |
| EP0196229B1 (de) | Kondensator für Oberflächenmontage | |
| JPH0241856Y2 (de) | ||
| US4345300A (en) | Recessed circuit module | |
| JPH0888103A (ja) | 面実装電子部品 | |
| JPH0236262Y2 (de) | ||
| JP2673991B2 (ja) | チップ型コンデンサおよびその製造方法 | |
| JPH0236266Y2 (de) | ||
| JP2572739Y2 (ja) | 電力型面実装電子部品 | |
| JPS6225873Y2 (de) | ||
| JPH0236265Y2 (de) | ||
| JPH0236267Y2 (de) | ||
| JPH0328501Y2 (de) | ||
| JPH0711462Y2 (ja) | 電子部品用端子板 | |
| JPH0314035Y2 (de) | ||
| JPH0351962Y2 (de) | ||
| JPH0363805B2 (de) | ||
| JPH0353481Y2 (de) | ||
| JPH0244510Y2 (de) | ||
| JPH0410709Y2 (de) | ||
| JPH0517870Y2 (de) |