JPH0244931Y2 - - Google Patents

Info

Publication number
JPH0244931Y2
JPH0244931Y2 JP1984190382U JP19038284U JPH0244931Y2 JP H0244931 Y2 JPH0244931 Y2 JP H0244931Y2 JP 1984190382 U JP1984190382 U JP 1984190382U JP 19038284 U JP19038284 U JP 19038284U JP H0244931 Y2 JPH0244931 Y2 JP H0244931Y2
Authority
JP
Japan
Prior art keywords
solder
printed circuit
circuit board
soldering
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984190382U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61107468U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984190382U priority Critical patent/JPH0244931Y2/ja
Publication of JPS61107468U publication Critical patent/JPS61107468U/ja
Application granted granted Critical
Publication of JPH0244931Y2 publication Critical patent/JPH0244931Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1984190382U 1984-12-14 1984-12-14 Expired JPH0244931Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984190382U JPH0244931Y2 (enrdf_load_stackoverflow) 1984-12-14 1984-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984190382U JPH0244931Y2 (enrdf_load_stackoverflow) 1984-12-14 1984-12-14

Publications (2)

Publication Number Publication Date
JPS61107468U JPS61107468U (enrdf_load_stackoverflow) 1986-07-08
JPH0244931Y2 true JPH0244931Y2 (enrdf_load_stackoverflow) 1990-11-28

Family

ID=30747833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984190382U Expired JPH0244931Y2 (enrdf_load_stackoverflow) 1984-12-14 1984-12-14

Country Status (1)

Country Link
JP (1) JPH0244931Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5199974B2 (ja) * 2009-10-07 2013-05-15 Ｆａシンカテクノロジー株式会社 半田付け装置の半田切り方法及びこれに用いるパレット装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51152645U (enrdf_load_stackoverflow) * 1975-05-30 1976-12-06

Also Published As

Publication number Publication date
JPS61107468U (enrdf_load_stackoverflow) 1986-07-08

Similar Documents

Publication Publication Date Title
JPH0244931Y2 (enrdf_load_stackoverflow)
US20110139855A1 (en) Residual oxygen measurement and control in wave soldering process
JP2002305372A (ja) 部分半田付け装置及び方法
US20070068994A1 (en) Soldering apparatus
JPS6231839B2 (enrdf_load_stackoverflow)
JPH04379B2 (enrdf_load_stackoverflow)
JPH10126049A (ja) 後付け半田装置
JPH0244930Y2 (enrdf_load_stackoverflow)
JPS62228Y2 (enrdf_load_stackoverflow)
JP3339220B2 (ja) 電子部品の半田付け装置
KR102306369B1 (ko) 인쇄회로기판 솔더링 장치
KR100217337B1 (ko) 반도체 노광설비의 웨이퍼 스테이지 오일 공급장치
JPS61207556A (ja) 溶融金属のメニスカスコ−テイングにおける浴面制御方法
JPH08153956A (ja) プリント基板への半田供給方法及び装置
KR0152867B1 (ko) 자석을 이용한 에스엠씨 마운터
SU1428536A1 (ru) Устройство дл распайки па ных соединений
JPS63273400A (ja) 電子部品実装装置
JPH10128203A (ja) 液体の微量塗布方法
SU1235678A1 (ru) Устройство дл пайки монтажных соединений
JPH0395989A (ja) 印刷配線板のコーティング装置
KR950005431A (ko) 쿼드플랫패키지(qfp)자동납땜장치
JPS61285794A (ja) 印刷配線基板の製造方法
KR100225892B1 (ko) 납땜 용제 도포 방법
JPH07101799B2 (ja) プリント配線板布線機
JPH11245027A (ja) はんだ付け装置