JPH0244520Y2 - - Google Patents
Info
- Publication number
- JPH0244520Y2 JPH0244520Y2 JP1986121209U JP12120986U JPH0244520Y2 JP H0244520 Y2 JPH0244520 Y2 JP H0244520Y2 JP 1986121209 U JP1986121209 U JP 1986121209U JP 12120986 U JP12120986 U JP 12120986U JP H0244520 Y2 JPH0244520 Y2 JP H0244520Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- support block
- pellet
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121209U JPH0244520Y2 (US06566495-20030520-M00011.png) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121209U JPH0244520Y2 (US06566495-20030520-M00011.png) | 1986-08-07 | 1986-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327044U JPS6327044U (US06566495-20030520-M00011.png) | 1988-02-22 |
| JPH0244520Y2 true JPH0244520Y2 (US06566495-20030520-M00011.png) | 1990-11-27 |
Family
ID=31010263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986121209U Expired JPH0244520Y2 (US06566495-20030520-M00011.png) | 1986-08-07 | 1986-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244520Y2 (US06566495-20030520-M00011.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2798654B2 (ja) * | 1996-06-27 | 1998-09-17 | 山口日本電気株式会社 | ボンディング装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291039A (ja) * | 1986-06-10 | 1987-12-17 | Shinkawa Ltd | ボンデイング装置 |
-
1986
- 1986-08-07 JP JP1986121209U patent/JPH0244520Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291039A (ja) * | 1986-06-10 | 1987-12-17 | Shinkawa Ltd | ボンデイング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327044U (US06566495-20030520-M00011.png) | 1988-02-22 |
