JPH0244370U - - Google Patents

Info

Publication number
JPH0244370U
JPH0244370U JP12385788U JP12385788U JPH0244370U JP H0244370 U JPH0244370 U JP H0244370U JP 12385788 U JP12385788 U JP 12385788U JP 12385788 U JP12385788 U JP 12385788U JP H0244370 U JPH0244370 U JP H0244370U
Authority
JP
Japan
Prior art keywords
spacer
ground structure
frame ground
metal substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12385788U
Other languages
Japanese (ja)
Other versions
JPH0648902Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988123857U priority Critical patent/JPH0648902Y2/en
Publication of JPH0244370U publication Critical patent/JPH0244370U/ja
Application granted granted Critical
Publication of JPH0648902Y2 publication Critical patent/JPH0648902Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による金属基板のフレームグラ
ンド構造の一実施例を示す断面図、第２図は該実
施例の適用例を示す断面図、第３図は本考案の他
の実施例を示す断面図、第４図は該実施例の適用
例を示す断面図、第５図は従来の金属基板のフレ
ームグランド構造を示す断面図である。 FIG. 1 is a cross-sectional view showing an embodiment of a metal substrate frame ground structure according to the present invention, FIG. 2 is a cross-sectional view showing an application example of the embodiment, and FIG. 3 is a cross-sectional view showing another embodiment of the present invention. 4 is a sectional view showing an example of application of this embodiment, and FIG. 5 is a sectional view showing a conventional frame ground structure of a metal substrate.

Claims (1)

【実用新案登録請求の範囲】 １ 金属ベース上に絶縁層が形成され、該絶縁層
上に回路パターンが形成される金属基板の前記金
属ベースと回路パターンとを接続するフレームグ
ランド構造において、半田付け可能な材質からな
る間座を前記金属ベース部に嵌着し、かつ該間座
を前記回路パターンに半田付けして電気的、機械
的に接続したことを特徴とする金属基板のフレー
ムグランド構造。 ２ 請求項１において、前記間座を前記金属ベー
スに対して嵌着する代わりに螺着したことを特徴
とする金属基板のフレームグランド構造。 ３ 請求項１または２において、前記間座の中央
に貫通穴を設け、該貫通穴の一方より雌ねじ溝を
設けたことを特徴とする金属基板のフレームグラ
ンド構造。 ４ 請求項１または２において、前記間座の中央
に貫通穴を設け、該貫通穴の双方より雌ねじ溝を
設けたことを特徴とする金属基板のフレームグラ
ンド構造。 ５ 請求項１ないし４のいずれかにおいて、前記
間座の半田付け部分の反基板側近傍の周囲に周方
向に溝を設けたことを特徴とする金属基板のフレ
ームグランド構造。 ６ 請求項１ないし５のいずれかにおいて、前記
間座の金属基板への当接部の外径は、半田付けさ
れる基板のパターンの内側径と同等または該内側
径より小さいことを特徴とする金属基板のフレー
ムグランド構造。[Claims for Utility Model Registration] 1. In a frame ground structure connecting the metal base and the circuit pattern of a metal substrate in which an insulating layer is formed on a metal base and a circuit pattern is formed on the insulating layer, soldering A frame ground structure for a metal substrate, characterized in that a spacer made of a suitable material is fitted into the metal base portion, and the spacer is soldered to the circuit pattern to electrically and mechanically connect it. 2. The frame ground structure for a metal substrate according to claim 1, wherein the spacer is screwed onto the metal base instead of being fitted onto the metal base. 3. The frame ground structure for a metal substrate according to claim 1, wherein a through hole is provided in the center of the spacer, and a female thread groove is provided from one side of the through hole. 4. The frame ground structure for a metal substrate according to claim 1, wherein a through hole is provided in the center of the spacer, and female thread grooves are provided from both sides of the through hole. 5. The frame ground structure for a metal substrate according to claim 1, wherein a groove is provided in the circumferential direction around the soldering portion of the spacer near the side opposite to the substrate. 6. In any one of claims 1 to 5, the outer diameter of the contact portion of the spacer to the metal substrate is equal to or smaller than the inner diameter of the pattern of the substrate to be soldered. Frame ground structure of metal substrate.
JP1988123857U 1988-09-20 1988-09-20 Frame ground structure of metal board Expired - Lifetime JPH0648902Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988123857U JPH0648902Y2 (en) 1988-09-20 1988-09-20 Frame ground structure of metal board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988123857U JPH0648902Y2 (en) 1988-09-20 1988-09-20 Frame ground structure of metal board

Publications (2)

Publication Number Publication Date
JPH0244370U true JPH0244370U (en) 1990-03-27
JPH0648902Y2 JPH0648902Y2 (en) 1994-12-12

Family

ID=31373092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988123857U Expired - Lifetime JPH0648902Y2 (en) 1988-09-20 1988-09-20 Frame ground structure of metal board

Country Status (1)

Country Link
JP (1) JPH0648902Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294234A (en) * 2007-05-24 2008-12-04 Densei Lambda Kk Circuit board, and manufacturing method therefor
JP2009267174A (en) * 2008-04-25 2009-11-12 Tdk-Lambda Corp Conduction structure of metal core board

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4967948U (en) * 1972-09-26 1974-06-13
JPS5461256U (en) * 1977-10-07 1979-04-27
JPS57594U (en) * 1980-05-29 1982-01-05
JPS5749432U (en) * 1980-09-04 1982-03-19
JPS5754305U (en) * 1980-09-11 1982-03-30
JPS5836619U (en) * 1981-09-04 1983-03-10 ポツプリベツト・フアスナ−株式会社 blind nut
JPS58138368U (en) * 1982-03-13 1983-09-17 株式会社フジクラ enamel board
JPS59146607U (en) * 1983-01-19 1984-10-01 ポツプリベツト・フアスナ−株式会社 blind nut
JPS6147243A (en) * 1984-08-11 1986-03-07 松下電工株式会社 Metallic-base laminated plate
JPS6335809U (en) * 1986-08-22 1988-03-08
JPS6377188A (en) * 1986-09-19 1988-04-07 松下電工株式会社 Metal base printed wiring board

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4967948U (en) * 1972-09-26 1974-06-13
JPS5461256U (en) * 1977-10-07 1979-04-27
JPS57594U (en) * 1980-05-29 1982-01-05
JPS5749432U (en) * 1980-09-04 1982-03-19
JPS5754305U (en) * 1980-09-11 1982-03-30
JPS5836619U (en) * 1981-09-04 1983-03-10 ポツプリベツト・フアスナ−株式会社 blind nut
JPS58138368U (en) * 1982-03-13 1983-09-17 株式会社フジクラ enamel board
JPS59146607U (en) * 1983-01-19 1984-10-01 ポツプリベツト・フアスナ−株式会社 blind nut
JPS6147243A (en) * 1984-08-11 1986-03-07 松下電工株式会社 Metallic-base laminated plate
JPS6335809U (en) * 1986-08-22 1988-03-08
JPS6377188A (en) * 1986-09-19 1988-04-07 松下電工株式会社 Metal base printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294234A (en) * 2007-05-24 2008-12-04 Densei Lambda Kk Circuit board, and manufacturing method therefor
JP2009267174A (en) * 2008-04-25 2009-11-12 Tdk-Lambda Corp Conduction structure of metal core board

Also Published As

Publication number Publication date
JPH0648902Y2 (en) 1994-12-12

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