JPH0174603U - - Google Patents
Info
- Publication number
- JPH0174603U JPH0174603U JP1987169994U JP16999487U JPH0174603U JP H0174603 U JPH0174603 U JP H0174603U JP 1987169994 U JP1987169994 U JP 1987169994U JP 16999487 U JP16999487 U JP 16999487U JP H0174603 U JPH0174603 U JP H0174603U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- conductor pattern
- hole
- capacitor
- grounded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
Landscapes
- Waveguides (AREA)
Description
第1図はこの考案の一実施例によるシヨートス
タブを示すものであり、第1図aは断面図、第1
図bは平面図である。第2図は従来のシヨートス
タブを示すものであり、第2図aは断面図、第2
図bは平面図である。
1は誘電体基板、2は導体パターン、3はアー
ス用導体パターン、4は導体リボン、7はワイヤ
、8はコンデンサ、9はポストである。なお、図
中、同一符号は同一、又は相当部分を示す。
Fig. 1 shows a shot stub according to an embodiment of this invention, Fig. 1a is a sectional view, and Fig.
Figure b is a plan view. Figure 2 shows a conventional shot stub, Figure 2a is a sectional view, and Figure 2a is a cross-sectional view.
Figure b is a plan view. 1 is a dielectric substrate, 2 is a conductor pattern, 3 is a grounding conductor pattern, 4 is a conductor ribbon, 7 is a wire, 8 is a capacitor, and 9 is a post. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
と、上記穴の中にある金属ポストと、上記ポスト
上に片側アースされているコンデンサと、上記誘
電体基板上の上記穴周辺に形成したアース用導体
パターンと上記コンデンサのアースされていない
側の電極と上記アース用導体パターンとの間を接
続するワイヤと、上記誘電体基板上に形成した導
体パターンと、上記導体パターン相互を接続する
導体リボンとを備え、上記導体パターンが環状を
なしていることを特徴とするマイクロストリツプ
回路のシヨートスタブ。 A dielectric substrate, a hole formed in the dielectric substrate, a metal post in the hole, a capacitor grounded on one side on the post, and a metal post formed around the hole on the dielectric substrate. A wire connecting a ground conductor pattern, an electrode on the non-grounded side of the capacitor, and the ground conductor pattern, a conductor pattern formed on the dielectric substrate, and a conductor connecting the conductor patterns to each other. A short stub for a microstrip circuit, characterized in that the conductor pattern has a ring shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169994U JPH0174603U (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169994U JPH0174603U (en) | 1987-11-06 | 1987-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0174603U true JPH0174603U (en) | 1989-05-19 |
Family
ID=31460549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987169994U Pending JPH0174603U (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0174603U (en) |
-
1987
- 1987-11-06 JP JP1987169994U patent/JPH0174603U/ja active Pending