JPH0369263U - - Google Patents
Info
- Publication number
- JPH0369263U JPH0369263U JP13017789U JP13017789U JPH0369263U JP H0369263 U JPH0369263 U JP H0369263U JP 13017789 U JP13017789 U JP 13017789U JP 13017789 U JP13017789 U JP 13017789U JP H0369263 U JPH0369263 U JP H0369263U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- main surfaces
- conductor layers
- electronic component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の電子部品の要部を示す図で、
イはその平面図、ロはその断面図、第２図は従来
の電子部品の要部を示す図で、イはその平面図、
ロはその断面図である。
１……絶縁基板、２……導体層、３……スルー
ホール、４……スルーホール電極。
Figure 1 is a diagram showing the main parts of the electronic component of the present invention.
A is its plan view, B is its cross-sectional view, Figure 2 is a diagram showing the main parts of a conventional electronic component, A is its plan view,
B is a sectional view thereof. 1...Insulating substrate, 2...Conductor layer, 3...Through hole, 4...Through hole electrode.
Claims (1)
電気的に接続されてなる電子部品であつて、 前記両主面の導体層の少なくとも一部が絶縁基
板の厚み方向に互いに対向するように形成される
とともに、絶縁基板の両主面の互いに対向する導
体層部分に複数個のスルーホールが形成され、そ
のそれぞれのスルーホール内周面に形成されたス
ルーホール電極によつて両主面の導体層が電気的
に接続されていることを特徴とする電子部品。[Claims for Utility Model Registration] An electronic component in which conductor layers formed on both main surfaces of an insulating substrate are electrically connected to each other, wherein at least a portion of the conductor layers on both main surfaces are formed on the insulating substrate. A plurality of through holes are formed so as to face each other in the thickness direction, and are formed in the mutually facing conductor layer portions on both main surfaces of the insulating substrate, and each through hole is formed on the inner peripheral surface of each through hole. An electronic component characterized in that conductor layers on both principal surfaces are electrically connected by electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017789U JPH0369263U (en) | 1989-11-08 | 1989-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017789U JPH0369263U (en) | 1989-11-08 | 1989-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369263U true JPH0369263U (en) | 1991-07-09 |
Family
ID=31677768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13017789U Pending JPH0369263U (en) | 1989-11-08 | 1989-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369263U (en) |
-
1989
- 1989-11-08 JP JP13017789U patent/JPH0369263U/ja active Pending