JPH0252472U - - Google Patents
Info
- Publication number
- JPH0252472U JPH0252472U JP13265488U JP13265488U JPH0252472U JP H0252472 U JPH0252472 U JP H0252472U JP 13265488 U JP13265488 U JP 13265488U JP 13265488 U JP13265488 U JP 13265488U JP H0252472 U JPH0252472 U JP H0252472U
- Authority
- JP
- Japan
- Prior art keywords
- chip substrate
- internal electrodes
- conductive layer
- laminated ceramic
- ceramic dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は、この考案の一実施例の一部破断側面
図、第２図は、等価回路図、第３図ａ、第３図ｂ
及び第３図ｃは、それぞれ実装時の工程図、第４
図は、従来のチツプ抵抗器の概略構造図である。
１……積層セラミツク誘電体からなるチツプ基
板、２……内部電極、３……導電層、４……外部
電極、６……複合回路部品。
Fig. 1 is a partially cutaway side view of an embodiment of this invention, Fig. 2 is an equivalent circuit diagram, Fig. 3a, Fig. 3b
and Fig. 3c are the process diagrams at the time of mounting, and Fig. 4
The figure is a schematic structural diagram of a conventional chip resistor. DESCRIPTION OF SYMBOLS 1... Chip substrate made of laminated ceramic dielectric material, 2... Internal electrode, 3... Conductive layer, 4... External electrode, 6... Composite circuit component.
Claims (1)
コンデンサ用の内部電極を、チツプ基板表面に導
電層をそれぞれ形成し、これらの内部電極と導電
層が接続される一対の外部電極をチツプ基板の両
側面にそれぞれ形成してなる複合回路部品。 Internal electrodes for capacitors are formed inside a chip substrate made of laminated ceramic dielectric, and a conductive layer is formed on the surface of the chip substrate, and a pair of external electrodes to which these internal electrodes and conductive layers are connected are formed on both sides of the chip substrate. Composite circuit parts formed by each.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13265488U JPH0252472U (en) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13265488U JPH0252472U (en) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252472U true JPH0252472U (en) | 1990-04-16 |
Family
ID=31389819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13265488U Pending JPH0252472U (en) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252472U (en) |
-
1988
- 1988-10-11 JP JP13265488U patent/JPH0252472U/ja active Pending