JPH0243811B2 - - Google Patents

Info

Publication number
JPH0243811B2
JPH0243811B2 JP60130242A JP13024285A JPH0243811B2 JP H0243811 B2 JPH0243811 B2 JP H0243811B2 JP 60130242 A JP60130242 A JP 60130242A JP 13024285 A JP13024285 A JP 13024285A JP H0243811 B2 JPH0243811 B2 JP H0243811B2
Authority
JP
Japan
Prior art keywords
copper
annealing
rolled
lead frame
cold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60130242A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61288036A (ja
Inventor
Naoyuki Kanehara
Mitsuhiro Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP60130242A priority Critical patent/JPS61288036A/ja
Publication of JPS61288036A publication Critical patent/JPS61288036A/ja
Publication of JPH0243811B2 publication Critical patent/JPH0243811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60130242A 1985-06-15 1985-06-15 リードフレーム材用銅合金 Granted JPS61288036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60130242A JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60130242A JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Publications (2)

Publication Number Publication Date
JPS61288036A JPS61288036A (ja) 1986-12-18
JPH0243811B2 true JPH0243811B2 (cg-RX-API-DMAC7.html) 1990-10-01

Family

ID=15029528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60130242A Granted JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Country Status (1)

Country Link
JP (1) JPS61288036A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5252722B2 (ja) * 2009-03-26 2013-07-31 福田金属箔粉工業株式会社 高強度・高導電性銅合金及びその製造方法
JP6278812B2 (ja) * 2014-04-21 2018-02-14 株式会社Ｓｈカッパープロダクツ 銅合金材、電気自動車用の配電部材及びハイブリッド自動車用の配電部材
EP3770287A4 (en) * 2018-03-20 2021-11-24 Furukawa Electric Co., Ltd. ROLLED WIRE MADE FROM A COPPER ALLOY AND PROCESS FOR MANUFACTURING A ROLLED WIRE MADE FROM A COPPER ALLOY
DE102018122574B4 (de) * 2018-09-14 2020-11-26 Kme Special Products Gmbh Verwendung einer Kupferlegierung
US12618124B2 (en) * 2022-10-04 2026-05-05 Honeywell Federal Manufacturing & Technologies, Llc Oxidation resistant high conductivity copper alloys

Also Published As

Publication number Publication date
JPS61288036A (ja) 1986-12-18

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