JPH0241895B2 - - Google Patents

Info

Publication number
JPH0241895B2
JPH0241895B2 JP17188484A JP17188484A JPH0241895B2 JP H0241895 B2 JPH0241895 B2 JP H0241895B2 JP 17188484 A JP17188484 A JP 17188484A JP 17188484 A JP17188484 A JP 17188484A JP H0241895 B2 JPH0241895 B2 JP H0241895B2
Authority
JP
Japan
Prior art keywords
resist
nozzle
dropping
thin tube
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17188484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6149422A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17188484A priority Critical patent/JPS6149422A/ja
Publication of JPS6149422A publication Critical patent/JPS6149422A/ja
Publication of JPH0241895B2 publication Critical patent/JPH0241895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP17188484A 1984-08-17 1984-08-17 レジスト塗布装置 Granted JPS6149422A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17188484A JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17188484A JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Publications (2)

Publication Number Publication Date
JPS6149422A JPS6149422A (ja) 1986-03-11
JPH0241895B2 true JPH0241895B2 (enrdf_load_stackoverflow) 1990-09-19

Family

ID=15931579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17188484A Granted JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Country Status (1)

Country Link
JP (1) JPS6149422A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2558490B2 (ja) * 1988-03-07 1996-11-27 東京エレクトロン株式会社 現像装置
JP4586302B2 (ja) * 2001-05-28 2010-11-24 三浦工業株式会社 溶存酸素濃度の測定方法

Also Published As

Publication number Publication date
JPS6149422A (ja) 1986-03-11

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