JPS6149422A - レジスト塗布装置 - Google Patents

レジスト塗布装置

Info

Publication number
JPS6149422A
JPS6149422A JP17188484A JP17188484A JPS6149422A JP S6149422 A JPS6149422 A JP S6149422A JP 17188484 A JP17188484 A JP 17188484A JP 17188484 A JP17188484 A JP 17188484A JP S6149422 A JPS6149422 A JP S6149422A
Authority
JP
Japan
Prior art keywords
resist
nozzle
tube
dropping
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17188484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241895B2 (enrdf_load_stackoverflow
Inventor
Toru Okuma
徹 大熊
Yukio Takashima
高島　幸男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP17188484A priority Critical patent/JPS6149422A/ja
Publication of JPS6149422A publication Critical patent/JPS6149422A/ja
Publication of JPH0241895B2 publication Critical patent/JPH0241895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP17188484A 1984-08-17 1984-08-17 レジスト塗布装置 Granted JPS6149422A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17188484A JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17188484A JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Publications (2)

Publication Number Publication Date
JPS6149422A true JPS6149422A (ja) 1986-03-11
JPH0241895B2 JPH0241895B2 (enrdf_load_stackoverflow) 1990-09-19

Family

ID=15931579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17188484A Granted JPS6149422A (ja) 1984-08-17 1984-08-17 レジスト塗布装置

Country Status (1)

Country Link
JP (1) JPS6149422A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227437A (ja) * 1988-03-07 1989-09-11 Tokyo Electron Ltd 現像装置
JP2002350414A (ja) * 2001-05-28 2002-12-04 Miura Co Ltd 溶存酸素濃度の測定方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227437A (ja) * 1988-03-07 1989-09-11 Tokyo Electron Ltd 現像装置
JP2002350414A (ja) * 2001-05-28 2002-12-04 Miura Co Ltd 溶存酸素濃度の測定方法

Also Published As

Publication number Publication date
JPH0241895B2 (enrdf_load_stackoverflow) 1990-09-19

Similar Documents

Publication Publication Date Title
US5066616A (en) Method for improving photoresist on wafers by applying fluid layer of liquid solvent
US4068019A (en) Spin coating process for prevention of edge buildup
WO1989006378A1 (en) Use of particular mixtures of ethyl lactate and methyl ethyl ketone to remove undesirable peripheral material (e.g. edge beads) from photoresist-coated substrates
JPS6149422A (ja) レジスト塗布装置
US6592939B1 (en) System for and method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption
US20100247770A1 (en) Method for applying coating liquid, method for forming coated film, method for forming a pattern by using the same, and method for manufacturing semiconductor device
JP2874155B2 (ja) レジスト現像装置
JPH0629204A (ja) レジスト現像方法及び装置
EP0403086B1 (en) Method for improving deposit of photoresist on wafers
JPS60226125A (ja) レジスト膜の形成方法
JPH1124282A (ja) レジスト現像装置及び現像方法
JP2802636B2 (ja) 塗布装置及び塗布方法
JP2871747B2 (ja) 処理装置
JPH08194316A (ja) フォトレジストの塗布方法
JPH0632675Y2 (ja) 半導体製造用塗布装置
JPS60193339A (ja) レジスト膜塗布方法
JPH05123632A (ja) 液状塗布物質の塗布方法
JPS6315250A (ja) フォトマスク上の粒状物質を減少させる方法およびその装置
JPS60160614A (ja) レジスト塗布方法および装置
JPH05228413A (ja) 塗布装置
JPS59100524A (ja) レジスト塗布方法
JPH0632673Y2 (ja) レジスト塗布装置
KR101043650B1 (ko) 코팅장비의 코터 척
JPS60137017A (ja) レジスト塗布装置
JPH03157919A (ja) 半導体製造装置