JPH0241653Y2 - - Google Patents

Info

Publication number

JPH0241653Y2

JPH0241653Y2 JP5719485U JP5719485U JPH0241653Y2 JP H0241653 Y2 JPH0241653 Y2 JP H0241653Y2 JP 5719485 U JP5719485 U JP 5719485U JP 5719485 U JP5719485 U JP 5719485U JP H0241653 Y2 JPH0241653 Y2 JP H0241653Y2

Authority

JP

Japan

Prior art keywords

light

insulating plate

display substrate

thermosetting resin

emitting

Prior art date

1985-04-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 43
• 229920005989 resin Polymers 0.000 claims description 28
• 239000011347 resin Substances 0.000 claims description 28
• 229920001187 thermosetting polymer Polymers 0.000 claims description 27
• 239000011159 matrix material Substances 0.000 claims description 16
• 239000012790 adhesive layer Substances 0.000 claims description 12
• 230000008602 contraction Effects 0.000 claims description 9
• 230000002093 peripheral effect Effects 0.000 claims description 5
• 239000000463 material Substances 0.000 claims description 4
• 239000004809 Teflon Substances 0.000 claims description 3
• 229920006362 Teflon® Polymers 0.000 claims description 3
• 238000000034 method Methods 0.000 claims description 2
• 239000006082 mold release agent Substances 0.000 claims description 2
• 229920001296 polysiloxane Polymers 0.000 claims description 2
• 229920002799 BoPET Polymers 0.000 claims 1
• 230000000694 effects Effects 0.000 description 6
• 238000007789 sealing Methods 0.000 description 6
• 239000004065 semiconductor Substances 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 239000011810 insulating material Substances 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000005336 cracking Methods 0.000 description 1
• 239000012769 display material Substances 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 230000000149 penetrating effect Effects 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 239000011148 porous material Substances 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 239000012780 transparent material Substances 0.000 description 1