JPH0241653Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to improvement of a dot matrix light-emitting display.

Prior Art This type of dot matrix light-emitting display consists of coating a thermosetting resin as a sealing film on the upper surface of a display substrate on which light-emitting elements (semiconductor chips) such as light-emitting diodes are arranged in a matrix. It is composed of

However, with such a structure, there are disadvantages such as the liquid thermosetting resin leaking down from the top surface of the light emitting display substrate when it is coated with the thermosetting resin. The light emitted from the light-emitting elements leaks from each other, causing problems such as poor visibility as a light-emitting display.

Therefore, in order to eliminate such inconveniences, the present applicant proposed, in Utility Application No. 171487/1987, to add transparent materials corresponding to the light emitting parts on the top surface of the display substrate on which the light emitting parts are arranged in a matrix. An insulating plate with holes is bonded and a thermosetting resin is injected and sealed only into the through-holes of the insulating plate to function as a sealing film, and at the same time, the light emitted by each light emitting element is It has a mask plate function to prevent leakage of light and improve the luminous efficiency and visibility of the light emitting display.
Furthermore, in order to prevent the occurrence of distortions and warping that occur during thermal expansion and contraction of the insulating plate and the light-emitting display substrate, we proposed that the insulating plate bonded to the top surface of the display substrate be made of flexible resin. did.

In addition, in Utility Model Application No. 59-171488, for the same purpose, a light-emitting display substrate is provided in which through-holes corresponding to the light-emitting portions are provided on the upper surface of the display substrate on which light-emitting portions are arranged in a matrix. We proposed a method in which insulating plates made of insulating materials with the same thermal expansion and contraction properties are bonded together.

In all of these proposals, when bonding the insulating plate to the top surface of the display substrate, the material is specially selected to minimize the difference in thermal expansion and contraction properties between the display substrate and the insulating plate. This prevents distortion, warping, cracks, etc. from occurring during thermal expansion and contraction.

Problems to be Solved by the Invention The dot matrix light-emitting display of the invention alleviates the effects of stress that occurs during curing and shrinkage of the thermosetting resin for sealing the through holes, and also allows selection of the material of the insulating plate. To provide a dot matrix light-emitting display that can be formed from a normal insulating material without causing any problems, and can also prevent the occurrence of distortion, warping, cracks, etc. due to thermal expansion and contraction caused by temperature changes of an insulating plate. This is a problem to be solved.

Specific Means for Solving the Problems The specific means adopted by the present invention is to attach the light emitting section of the display substrate on the top surface of the display substrate on which the light emitting section consisting of light emitting elements such as light emitting diodes is provided. An insulating plate having a through hole that gradually opens upward is placed on a portion corresponding to the part, and a thermosetting resin is filled into the light emitting part through each of the through holes of the insulating plate to form the display substrate. The insulating plate is partially joined with the filled thermosetting resin, and the thermosetting resin in the through hole is allowed to shrink due to heat between the filled thermosetting resin and the inner peripheral surface of the through hole. It is characterized by having a non-adhesive layer interposed therebetween.

Effects and Effects of the Invention According to the dot matrix light-emitting display of the present invention, the light-emitting substrate and the insulating plate are joined by the so-called anchor effect by the thermosetting resin filled through each of the through holes of the insulating plate. Because of this structure, there is no need to attach the insulating plates to the upper surface of the light-emitting substrate one by one, and the light-emitting display substrate and the insulating plate can be inseparably bonded when filling the thermosetting resin.

In addition, a non-adhesive layer that allows the thermosetting resin to shrink due to heat is interposed on the surface where the thermosetting resin filled through each through hole of the insulating plate contacts the inner peripheral surface of the through hole of the insulating plate. Therefore, stress is not applied to the insulating plate when the thermosetting resin cures and shrinks, and the thermosetting resin is allowed to shrink due to heat, so distortion, warping, cracking, etc. can be effectively prevented.

In addition, if a non-adhesive layer similar to the above is interposed between the insulating plate and the display substrate, thermal expansion and contraction of the insulating plate and the display substrate can be more easily tolerated, so distortion, warping, cracks, etc. A more useful dot matrix light-emitting display material that is less likely to cause this can be obtained.

Embodiment of the invention An embodiment of the invention will be described below with reference to the accompanying drawings.

Figure 1 shows an example in which the present invention is applied to an 8x8 dot matrix light-emitting display, where 1 is a display substrate, 2 is a light-emitting part formed of a semiconductor chip such as a light-emitting diode, and 3 is a light-emitting part. An insulating plate 6 has corresponding through holes 4 drilled therein, and numeral 6 indicates a thermosetting resin filled in the light emitting part 2.

Further, FIG. 2 shows an enlarged view of the light emitting part of the light emitting display shown in FIG. 1.

The display substrate 1 is made of a so-called copper-clad laminate, which is made by bonding copper foil to both the upper and lower surfaces of an insulating substrate.The copper foil bonded to both the upper and lower surfaces of an insulating substrate is etched to form a conductive pattern, and the conductive patterns intersect in three dimensions. Semiconductor chips 2a, such as light emitting diodes, are placed at predetermined locations.
2a to form a light emitting section 2, and such light emitting sections 2 are arranged in a matrix on the upper surface of the display substrate 1. Note that such a light emitting unit 2
In FIG. 2, which shows the details of the
This is a cathode-side electrode section separated from an anode-side electrode section 22 by a dotted line, and semiconductor chips 2a, 2a are attached to the upper surface of the cathode-side electrode section using silver paste or the like to form a light-emitting section 2. The upper parts of the semiconductor chips 2a, 2a are connected to the conductive plating part 22a of the anode side electrode part 22 via bonding wires 8, 8, and the cathode side electrode part 21 is provided on the back side of the display substrate 1 through a through hole 7. It is connected to an electrode section (shown as 21' in FIG. 3).

On the other hand, the insulating plate 3 is formed with through holes 4 corresponding to the number of light emitting parts 2, and each of the through holes 4 forms a non-adhesive layer 5 on the inner peripheral surface, as shown in FIG. It further has an opening that gradually opens upward.

The light emitting part 2 and the through hole 4 are placed on the upper surface of the display substrate 1 in a state where the insulating plate 3 is not bonded, and the light emitting part 2 is aligned with the through hole 4.
It is filled with a thermosetting resin 6 (for example, epoxy resin or the like is suitable) having porosity to seal the pores.

The lower part of the sealing part formed by the thermosetting resin 6 filled in the through hole 4 in this way
As clearly shown in the figure, a light emitting part 2 provided on a display substrate 1 is bonded to the display substrate 1 and an insulating plate 3 using a thermosetting material filled in the through holes 4 of the insulating plate 3. Since it is partially joined by resin 6,
The display substrate 1 and the insulating plate 3 have a structure that does not easily cause stress between them even when they are expanded and contracted by heat.

In such an embodiment, the non-adhesive layer 5 is formed on the inner circumferential surface of the through hole 4 of the insulating plate 3 before filling the through hole 4 with the thermosetting resin 6. It is desirable to form it by pasting a film such as a film, or by applying a mold release agent such as silicone or Teflon to the inner peripheral surface of the through hole 4.

FIG. 4 particularly shows another example of the light emitting display substrate, and the light emitting section 2 has a structure as shown in FIG. 3, similar to the above embodiment.

What is shown in FIG. 4 is the light emitting section 2.
The display substrate provided with is separated into individual segment bodies 1', and during manufacturing, these segment bodies 1' are separated from the conductive pattern 11.
The dot matrix light emitting display substrate is constructed by bonding the insulating substrates 11 with each other on the upper surface thereof to form one dot matrix light emitting display substrate.

Further, FIG. 5 shows an example in which a mask substrate 7 is further provided on the upper surface of the insulating plate 3, and in such a case, the through hole 4 is formed by penetrating the insulating plate 3 and the mask substrate 7. The non-adhesive layer 5 is also formed over both. The thermosetting resin 6 is sealed in the through hole 4, and the lower part of the sealing part formed by the thermosetting resin 6 is bonded to the upper surface of the light emitting part 2 of the display substrate 1, as described above. This is similar to the embodiment.

In addition to the embodiments described above, it is also desirable to provide a non-adhesive layer 9 on the contact surface between the display substrate 1 and the insulating plate 3, as shown in FIG. Now, the bonding wire 8 and the anode side electrode part 2 are placed on the upper surface of the anode side electrode 22.
A non-adhesive layer 9 made of a film or a release agent as described above is formed in such a manner as not to impede the connection with the film 2. In such an embodiment, the display substrate 1
This also has the effect of allowing movement of the insulating plate 3 during thermal contraction, thereby further increasing the effect of preventing the occurrence of distortions and cracks that occur during thermal contraction.

Furthermore, the insulating plate used in the present invention is not only one in which a thermosetting resin is sealed in the through hole and used as a sealing film, but also a mask for improving the visibility of the light emitting display. This includes those used as substrates, and the term "insulating board" as used in the present invention includes such a concept.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a partially enlarged perspective view showing the structure of the light emitting part, Fig. 3 is an enlarged vertical sectional view of the light emitting part which is the main part of the present invention, FIG. 4 is a perspective view showing another example of a light emitting display substrate applicable to the present invention, and FIGS. 5 and 6 are enlarged longitudinal sectional views of a light emitting part showing still other examples of the present invention. Explanation of symbols: In the figure, 1 is a display substrate, 2 is
3 is a light emitting part, 3 is an insulating plate, 4 is a through hole thereof, 5 and 9 are non-adhesive layers, and 6 is a thermosetting resin.

Claims (1)

[Claims for Utility Model Registration] 1. On the upper surface of a display substrate on which a light-emitting section comprising a light-emitting element such as a light-emitting diode is disposed, a portion of the display substrate corresponding to the light-emitting section gradually opens upwardly. An insulating plate having open through holes is placed thereon, and a thermosetting resin is filled into the light emitting part through each through hole of the insulating plate to fill the display substrate and the insulating plate. The method is characterized in that a non-adhesive layer is interposed between the filled thermosetting resin and the inner peripheral surface of the through hole to allow thermal contraction of the thermosetting resin in the through hole. A dot matrix light emitting display. 2. The dot matrix luminescent display according to claim 1, wherein the non-adhesive layer is formed of a film material such as PET film or Teflon film. 3. The dot matrix light-emitting display according to claim 1, wherein the non-adhesive layer is formed by applying a mold release agent such as silicone or Teflon.