JPH064379Y2 - Dot matrix light emitting display - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement of a dot matrix light emitting display body formed by using light emitting elements such as light emitting diodes.

2. Description of the Related Art This type of light-emitting display is one in which any of the light-emitting elements arranged in a matrix is turned on and turned on so that any character, symbol, or pattern can be displayed as a dot pattern. .

The basic structure of such a matrix display has a structure in which a semiconductor element is arranged at the overlapping portion of a plurality of upper electrodes and lower electrodes arranged in a three-dimensional lattice shape with an insulating layer interposed therebetween.

For example, referring to FIG. 4 and FIG. 5, a general structure thereof is shown. Two insulating substrates 10 in which an upper electrode 100 and a lower electrode 101 are arranged in multiple rows in parallel with each other on their surfaces are shown.
2, 103 are attached to each other so that the upper and lower electrodes 100 and 101 are in a three-dimensional lattice shape to form a matrix light emitting display substrate 1 (hereinafter, simply referred to as “matrix substrate”). The through hole 1 is formed in a portion of the matrix substrate 1 where the upper electrode 100 and the lower electrode 101 overlap.
04 is drilled, the semiconductor chips 105 constituting the light emitting element are arranged in each of the through holes 104, and finally, the entire upper surface of the matrix substrate 1 including the through holes 104 of the semiconductor chip 105 exposed is transparent. The protective film 107 has a structure in which a continuous protective film 107 made of a thermosetting resin is coated and protected. Reference numeral 106 is a bonding wire for connecting the semiconductor chip 105 to the upper electrode 100, and reference numeral 108 is a silver paste for conductively connecting the lower side of the semiconductor chip 105 to the lower electrode 101.

However, in the case of such a structure, in the manufacturing process, that is, after the light emitting element is arranged on the matrix substrate 1, the light transmitting thermosetting resin is heat cured on the upper surface thereof to form the continuous protective film 107. In such a case, there is a difference between the thermal expansion characteristics of the matrix substrate 1 and the thermal expansion characteristics of the thermosetting resin that forms the protective film 107.
In many cases, peeling of No. 07 from the matrix substrate 1 and cracking or distortion of the protective film 107 result in defective products.
The commercial value is halved.

In addition, such defects become remarkable when the matrix substrate 1 is enlarged, and thus not only hinder the commercialization of a large-sized dot matrix light emitting display body, but also such distortion and warpage occur. After manufacturing, there is a problem in that the commercial value is halved due to, for example, a temperature difference between summer and winter, or when the light emitting element is heated by electricity.

Problems to be Solved by the Invention The present invention solves the above problems and has a simple structure to prevent the occurrence of defects such as warpage due to the difference in the thermal expansion characteristics of the materials as described above. It is an object of the present invention to provide a dot matrix light emitting display which can be prevented.

Means for Solving the Problems In order to solve the above problems, the dot matrix light emitting display of the present invention comprises a plurality of upper electrodes and lower electrodes arranged in a three-dimensional lattice pattern with an insulating layer interposed therebetween. On the polymerized part of
On the upper surface of the matrix substrate on which the light emitting elements are arranged, an insulating plate made of silicon rubber having perforated holes corresponding to the light emitting elements is bonded, and the translucency is provided to each of the through holes. The gist of the invention is to inject and seal the thermosetting resin.

The operation and effect of the invention In the dot matrix light emitting display of the present invention, an insulating plate made of silicon rubber having perforations corresponding to the light emitting elements is bonded to the upper surface of the matrix substrate on which the light emitting elements are arranged. A structure in which a thermosetting resin having a light-transmitting property is injected and sealed in each of the through holes, and the following characteristic actions and effects can be obtained from the structural characteristics.

(1) Since the insulating plate made of silicon rubber absorbs the expansion and contraction of the dot matrix substrate due to the temperature change at the time of manufacturing or thereafter, problems such as warpage, distortion and separation of the insulating plate from the matrix substrate do not occur. .

(2) Since the insulating plate made of silicon rubber absorbs the shrinkage of the thermosetting resin when the thermosetting resin injected into the through holes is cured, problems such as warpage and distortion do not occur.

Therefore, the dot-matrix light emitting display of the present invention not only improves the commercial value, but also has the advantage that the dot-matrix light emitting display can be manufactured in a significantly larger size than the conventional products.

Embodiments of the Invention An embodiment of the dot matrix light emitting display of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing a matrix substrate 1 and an insulating plate 2 which constitute a dot matrix light emitting display of the present invention, FIG. 2 is an enlarged view of a part of FIG. 1, and FIG. 3 shows an insulating plate. It is a principal part longitudinal cross-sectional view in the joined state.

As shown in the figure, the light emitting display of the present invention is a light emitting device 1
No. 05 is arranged on the upper surface of the matrix substrate 1 and the through holes 200
A matrix substrate 1 is a structure in which insulating plates 2 perforated are joined together, and the matrix substrate 1 is etched on both upper and lower surfaces of a copper-clad laminate in which copper foil is firmly bonded on the upper and lower surfaces of a glass epoxy plate. Then, the copper foil is peeled off at appropriate places to provide the upper electrode 100 and the lower electrode 101, which are arranged in a three-dimensional lattice pattern, and the cross-shaped conductive portion 111 described later. That is, the latter cross-shaped conductive portion 111 is equivalent to the upper electrode 1
00 and the lower electrode 101 are provided inside an insulating portion 110 formed in a part of the upper electrode where the lower electrode 101 overlaps with the lower electrode 101 via a through hole 109 provided in the center thereof.
Are linked to. And, such a cross-shaped conductive portion 1
The surface of 11 is plated, and the portion surrounding the cross-shaped conductive portion 111 via the insulating portion 110 is plated in a ring shape to form a conductive portion 112.

In addition, although the glass epoxy copper clad laminate is used as the material of the matrix substrate 1 in the above-described embodiments, the present invention is not limited to this, and a laminated sheet such as a paper phenol copper clad laminate or You may comprise using the composite plate as shown in FIGS.

On the other hand, the light-emitting element 105 is formed of a semiconductor chip, and this semiconductor chip is fixed to the projecting pieces of the above-mentioned cross-shaped conductive portion 111 facing each other one by one using silver paste (not shown) or the like. The upper portion thereof is connected to the ring-shaped conductive portion 112 formed on the upper electrode 100 by the wire bonding 106.

As a semiconductor chip constituting the light emitting element 105 used in the present invention, a pn junction body of gallium phosphide (Gap), gallium arsenide (GaAs) or the like known as a light emitting diode is preferably adopted.

On the other hand, the insulating plate 2 is formed by forming through holes 200 corresponding to the light emitting elements 105 arranged on the matrix substrate 1, and is made of heat resistant silicon rubber.

Further, the through holes 200 formed in the insulating plate 2 should not block the light flux emitted from the light emitting elements 105 provided on the matrix substrate 1, but distortion or warpage may occur when the matrix substrate 1 is thermally contracted. In order to effectively prevent the above, it is desirable that the pore size be made small.

In forming the through-holes 200 of the insulating plate 2, in order to improve the luminous flux emitted from the light-emitting element 105 and prevent light from leaking to an adjacent portion to obtain clearer light emission,
It is particularly desirable to coat the inner surface of each of the through holes 200 with white or silver paint or to form the insulating plate 2 itself from a material having a good light reflection efficiency. Thus, the dot matrix light emitting display of the present invention having such a structure has the insulating plate 2 on the upper surface of the matrix substrate 1.
Are joined together, and a thermosetting resin having a light-transmitting property is injected into each through hole 200 of the insulating plate 2 to form a protective film 107 (see FIG. 3) and sealing is performed to complete the product. . At the time of use, for example, a positive electrode is connected to the upper electrode 100 and a negative electrode is connected to the lower electrode 101, and a dynamic drive circuit is used to select a combination of these two types of electrodes. 105 is energized and turned on to display an arbitrary character, symbol, or pattern in a dot pattern.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a matrix substrate and an insulating plate showing an embodiment of the dot matrix light emitting display of the present invention.
1 is an enlarged view of a portion of FIG. 1, FIG. 3 is a partially enlarged sectional view of a dot matrix light emitting display body of the same embodiment, and FIG. 4 is a partial perspective view of a conventional general dot matrix light emitting display body, FIG. 5 is a partially enlarged sectional view thereof. (Explanation of reference numerals) In the figure, 1 is a matrix substrate, 100 is an upper electrode,
101 is a lower electrode, 105 is a light emitting element, 2 is an insulating plate,
Reference numeral 200 is the through hole, and 107 is a protective film formed of a translucent thermosetting resin.

Claims (1)

[Scope of utility model registration request] 1. An upper surface of a dot matrix light emitting display substrate in which a light emitting element is arranged in a superposed portion of a plurality of upper electrodes and a lower electrode arranged in a three-dimensional lattice shape with an insulating layer interposed therebetween. Insulating plates made of silicon rubber having perforations corresponding to the light-emitting elements are joined, and a thermosetting resin having translucency is injected into each of the perforations and sealed. A dot-matrix light-emitting display characterized by the above.