JPH0241452U - - Google Patents
Info
- Publication number
- JPH0241452U JPH0241452U JP11898288U JP11898288U JPH0241452U JP H0241452 U JPH0241452 U JP H0241452U JP 11898288 U JP11898288 U JP 11898288U JP 11898288 U JP11898288 U JP 11898288U JP H0241452 U JPH0241452 U JP H0241452U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- leads
- brazing material
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ないし第５図は本考案の集積回路パツケ
ージの一実施例を示す。第１図はパツケージ基盤
にリードフレームをろう付した状態を示す平面図
、第２図はパツケージ基盤の平面図、第３図はろ
う材の平面図、第４図はリードフレームの平面図
、第５図はパツケージ基盤にリードフレームをろ
う付した状態の要部を示す斜視図である。第６図
および第７図は従来の集積回路パツケージを示す
。第６図はパツケージ基盤にリードフレームをろ
う付した状態を示す平面図、第７図はパツケージ
基盤の平面図である。
図中、１…ＩＣパツケージ（集積回路パツケー
ジ）、２…パツケージ基盤、３…リードフレーム
、４…ろう材、２１…導体パターン、３１…リー
ド、３２…ダミーリード、３４…第１方形状部（
余剰ろう材吸収部）、３５…第２方形状部（余剰
ろう材吸収部）。
1 through 5 illustrate one embodiment of the integrated circuit package of the present invention. Fig. 1 is a plan view showing the lead frame brazed to the package base, Fig. 2 is a plan view of the package base, Fig. 3 is a plan view of the brazing material, and Fig. 4 is a plan view of the lead frame. FIG. 5 is a perspective view showing the main parts of the lead frame brazed to the package base. 6 and 7 illustrate conventional integrated circuit packages. FIG. 6 is a plan view showing the lead frame brazed to the package base, and FIG. 7 is a plan view of the package base. In the figure, 1...IC package (integrated circuit package), 2...package base, 3...lead frame, 4...brazing material, 21...conductor pattern, 31...lead, 32...dummy lead, 34...first rectangular portion (
(excess brazing filler metal absorbing section), 35... second rectangular section (excess brazing filler metal absorbing section).
Claims (1)
成された導体パターンに、 外部接続端子としてのリードを複数列設してな
るリード列の両外側に余剰ろう材を吸収するため
のダミーリードを形成したリードフレームを、 ろう付してなる集積回路パツケージにおいて、 前記ダミーリードは、リード幅より幅広の余剰
ろう材吸収部を有することを特徴とする集積回路
パツケージ。[Claim for Utility Model Registration] Multiple rows of leads as external connection terminals are provided on a conductor pattern formed on a package base for mounting an integrated circuit, and excess brazing material is absorbed on both outsides of the lead rows. 1. An integrated circuit package formed by brazing a lead frame on which dummy leads are formed, wherein the dummy leads have surplus brazing material absorbing portions that are wider than the lead width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11898288U JPH0241452U (en) | 1988-09-09 | 1988-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11898288U JPH0241452U (en) | 1988-09-09 | 1988-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241452U true JPH0241452U (en) | 1990-03-22 |
Family
ID=31363815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11898288U Pending JPH0241452U (en) | 1988-09-09 | 1988-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241452U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141256A (en) * | 1983-02-02 | 1984-08-13 | Hitachi Ltd | Brazing method of lead frame |
-
1988
- 1988-09-09 JP JP11898288U patent/JPH0241452U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141256A (en) * | 1983-02-02 | 1984-08-13 | Hitachi Ltd | Brazing method of lead frame |
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