JPH0241449U - - Google Patents

Info

Publication number
JPH0241449U
JPH0241449U JP11899488U JP11899488U JPH0241449U JP H0241449 U JPH0241449 U JP H0241449U JP 11899488 U JP11899488 U JP 11899488U JP 11899488 U JP11899488 U JP 11899488U JP H0241449 U JPH0241449 U JP H0241449U
Authority
JP
Japan
Prior art keywords
shielded
thin film
package
chip
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11899488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11899488U priority Critical patent/JPH0241449U/ja
Publication of JPH0241449U publication Critical patent/JPH0241449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図はシールド付きＩＣの断面図、第２図は
シールド付きＩＣの部分詳細断面図、第３図は一
般的なＩＣの断面図である。 １…パツケージ、２…チツプ、３…リード線、
４…端子、５…導電性シールド薄膜、６…絶縁薄
膜、７…金属膜、ＩＣ…集積回路素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電子回路が集積状に形成されたチツプを密封状
    に保護するためのパツケージの表面に、静電及び
    電磁シールド可能な導電性シールド薄膜を形成し
    たことを特徴とするシールド付きＩＣ。
JP11899488U 1988-09-10 1988-09-10 Pending JPH0241449U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11899488U JPH0241449U (ja) 1988-09-10 1988-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11899488U JPH0241449U (ja) 1988-09-10 1988-09-10

Publications (1)

Publication Number Publication Date
JPH0241449U true JPH0241449U (ja) 1990-03-22

Family

ID=31363838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11899488U Pending JPH0241449U (ja) 1988-09-10 1988-09-10

Country Status (1)

Country Link
JP (1) JPH0241449U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119688A (ja) * 2010-12-02 2012-06-21 Samsung Electronics Co Ltd 積層パッケージ構造物、パッケージオンパッケージ素子、およびパッケージオンパッケージ素子製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4821569B1 (ja) * 1968-10-17 1973-06-29
JPS5030478A (ja) * 1973-07-17 1975-03-26
JPS5223248U (ja) * 1975-08-08 1977-02-18

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4821569B1 (ja) * 1968-10-17 1973-06-29
JPS5030478A (ja) * 1973-07-17 1975-03-26
JPS5223248U (ja) * 1975-08-08 1977-02-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119688A (ja) * 2010-12-02 2012-06-21 Samsung Electronics Co Ltd 積層パッケージ構造物、パッケージオンパッケージ素子、およびパッケージオンパッケージ素子製造方法

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