JPH024142B2 - - Google Patents

Info

Publication number
JPH024142B2
JPH024142B2 JP55064117A JP6411780A JPH024142B2 JP H024142 B2 JPH024142 B2 JP H024142B2 JP 55064117 A JP55064117 A JP 55064117A JP 6411780 A JP6411780 A JP 6411780A JP H024142 B2 JPH024142 B2 JP H024142B2
Authority
JP
Japan
Prior art keywords
package
heating
heating block
dual
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55064117A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56161648A (en
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6411780A priority Critical patent/JPS56161648A/ja
Publication of JPS56161648A publication Critical patent/JPS56161648A/ja
Publication of JPH024142B2 publication Critical patent/JPH024142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Die Bonding (AREA)
JP6411780A 1980-05-16 1980-05-16 Heating block for pellet fitting device Granted JPS56161648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Publications (2)

Publication Number Publication Date
JPS56161648A JPS56161648A (en) 1981-12-12
JPH024142B2 true JPH024142B2 (enExample) 1990-01-26

Family

ID=13248796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6411780A Granted JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Country Status (1)

Country Link
JP (1) JPS56161648A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617286Y2 (ja) * 1984-10-18 1994-05-02 日本電気株式会社 ヒ−タブロック
JPS61176126A (ja) * 1985-01-31 1986-08-07 Nec Corp ダイボンデイング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54768U (enExample) * 1977-06-06 1979-01-06
JPS5527619A (en) * 1978-08-17 1980-02-27 Mitsubishi Electric Corp Die bonding device
JPS5548938A (en) * 1978-10-05 1980-04-08 Toshiba Corp Manufacturing of semiconductor device

Also Published As

Publication number Publication date
JPS56161648A (en) 1981-12-12

Similar Documents

Publication Publication Date Title
US5850071A (en) Substrate heating equipment for use in a semiconductor fabricating apparatus
ES2112328T3 (es) Aparato enfriador para elementos electronicos y de ordenador.
DE10392912B4 (de) Werkstück-Einspannvorrichtung mit Temperatursteuerbaueinheit mit Abstandshaltern zwischen Schichten, die einen Zwischenraum für thermoelektrische Module schaffen und Verfahren zum Halten eines Werkstücks
CN107297592A (zh) 焊线机夹具系统
BR8007816A (pt) Processo de granulacao e aparelho para o aumento de granulos revestiveis com um liquido aderente e solidificavel,com base no principio de granulacao em um leito de esguicho
DE102004043523A1 (de) Halbleitervorrichtung mit Wärmeabstrahlplatte und Anheftteil
JPH024142B2 (enExample)
US5263632A (en) Apparatus for positioning integrated circuit packages for tinning
DE69703381T2 (de) Erwärmung eines proben-trägers
CN100464620C (zh) 散热装置
JPS55103746A (en) Semiconductor power supply assembly and method of manufacturing same
CN211728203U (zh) 一种调速模块打mosfet上螺丝的机构及系统
EP0130643B1 (en) Device for soldering an element to a print substrate
JPS6439090A (en) Substrate for reflow
Xu et al. An integrated methodology for surface mount PCB configuration
KR940003584B1 (ko) 반도체 조립장치
JPH051107Y2 (enExample)
JP2010089146A (ja) 熱盤、及び、プレス装置
JPS60195946A (ja) ヒ−トブロツク
JP2519829B2 (ja) 加熱装置およびそれを用いた実装方法
KR940007177Y1 (ko) 플렉시블 프리히팅 장치
KR100238044B1 (ko) 반도체 칩 부착을 위한 접착제 도포방법
JPH06826Y2 (ja) 密着型温度調節器
JPS63177429A (ja) 半導体部品の封止方法
JPS61156815A (ja) 半導体ウエ−ハ熱処理装置