JPS56161648A - Heating block for pellet fitting device - Google Patents

Heating block for pellet fitting device

Info

Publication number
JPS56161648A
JPS56161648A JP6411780A JP6411780A JPS56161648A JP S56161648 A JPS56161648 A JP S56161648A JP 6411780 A JP6411780 A JP 6411780A JP 6411780 A JP6411780 A JP 6411780A JP S56161648 A JPS56161648 A JP S56161648A
Authority
JP
Japan
Prior art keywords
width
pellet
grooves
package
measure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6411780A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024142B2 (enExample
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6411780A priority Critical patent/JPS56161648A/ja
Publication of JPS56161648A publication Critical patent/JPS56161648A/ja
Publication of JPH024142B2 publication Critical patent/JPH024142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP6411780A 1980-05-16 1980-05-16 Heating block for pellet fitting device Granted JPS56161648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Publications (2)

Publication Number Publication Date
JPS56161648A true JPS56161648A (en) 1981-12-12
JPH024142B2 JPH024142B2 (enExample) 1990-01-26

Family

ID=13248796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6411780A Granted JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Country Status (1)

Country Link
JP (1) JPS56161648A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6172844U (enExample) * 1984-10-18 1986-05-17
JPS61176126A (ja) * 1985-01-31 1986-08-07 Nec Corp ダイボンデイング装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54768U (enExample) * 1977-06-06 1979-01-06
JPS5527619A (en) * 1978-08-17 1980-02-27 Mitsubishi Electric Corp Die bonding device
JPS5548938A (en) * 1978-10-05 1980-04-08 Toshiba Corp Manufacturing of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54768U (enExample) * 1977-06-06 1979-01-06
JPS5527619A (en) * 1978-08-17 1980-02-27 Mitsubishi Electric Corp Die bonding device
JPS5548938A (en) * 1978-10-05 1980-04-08 Toshiba Corp Manufacturing of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6172844U (enExample) * 1984-10-18 1986-05-17
JPS61176126A (ja) * 1985-01-31 1986-08-07 Nec Corp ダイボンデイング装置

Also Published As

Publication number Publication date
JPH024142B2 (enExample) 1990-01-26

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