JPH0239841B2 - - Google Patents
Info
- Publication number
- JPH0239841B2 JPH0239841B2 JP59092125A JP9212584A JPH0239841B2 JP H0239841 B2 JPH0239841 B2 JP H0239841B2 JP 59092125 A JP59092125 A JP 59092125A JP 9212584 A JP9212584 A JP 9212584A JP H0239841 B2 JPH0239841 B2 JP H0239841B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- resistor
- hardness
- heating resistor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000010408 film Substances 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 8
- 239000007772 electrode material Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims description 4
- 235000019589 hardness Nutrition 0.000 description 21
- 239000000463 material Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59092125A JPS60235403A (ja) | 1984-05-09 | 1984-05-09 | 薄膜抵抗器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59092125A JPS60235403A (ja) | 1984-05-09 | 1984-05-09 | 薄膜抵抗器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60235403A JPS60235403A (ja) | 1985-11-22 |
| JPH0239841B2 true JPH0239841B2 (enrdf_load_stackoverflow) | 1990-09-07 |
Family
ID=14045705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59092125A Granted JPS60235403A (ja) | 1984-05-09 | 1984-05-09 | 薄膜抵抗器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60235403A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62148275A (ja) * | 1985-12-24 | 1987-07-02 | Futaki Itsuo | サ−マルヘツド |
| JP2593646B2 (ja) * | 1986-05-08 | 1997-03-26 | 三菱電機株式会社 | 電子部品 |
| JP6209040B2 (ja) * | 2013-09-30 | 2017-10-04 | 東芝ホクト電子株式会社 | サーマルヘッド |
-
1984
- 1984-05-09 JP JP59092125A patent/JPS60235403A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60235403A (ja) | 1985-11-22 |
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