JPH0584222B2 - - Google Patents
Info
- Publication number
- JPH0584222B2 JPH0584222B2 JP25011385A JP25011385A JPH0584222B2 JP H0584222 B2 JPH0584222 B2 JP H0584222B2 JP 25011385 A JP25011385 A JP 25011385A JP 25011385 A JP25011385 A JP 25011385A JP H0584222 B2 JPH0584222 B2 JP H0584222B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- electrode
- glass layer
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 47
- 239000011521 glass Substances 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 99
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25011385A JPS62109664A (ja) | 1985-11-08 | 1985-11-08 | サ−マルヘツド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25011385A JPS62109664A (ja) | 1985-11-08 | 1985-11-08 | サ−マルヘツド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62109664A JPS62109664A (ja) | 1987-05-20 |
| JPH0584222B2 true JPH0584222B2 (enrdf_load_stackoverflow) | 1993-12-01 |
Family
ID=17203020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25011385A Granted JPS62109664A (ja) | 1985-11-08 | 1985-11-08 | サ−マルヘツド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62109664A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5200760A (en) * | 1990-09-28 | 1993-04-06 | Tohoku Pioneer Electronic Corporation | Thermal head for a thermal printer |
| US5666149A (en) * | 1991-01-22 | 1997-09-09 | Ngk Insulators, Ltd. | End-contact type thermal recording head having heat-generating portion on thin-walled end portion of ceramic substrate |
| US5909234A (en) * | 1991-01-22 | 1999-06-01 | Ngk Insulators, Ltd. | End-contact type thermal recording head having heat-generating portion on thin-walled end portion of ceramic substrate |
-
1985
- 1985-11-08 JP JP25011385A patent/JPS62109664A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62109664A (ja) | 1987-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4651168A (en) | Thermal print head | |
| JPH0584222B2 (enrdf_load_stackoverflow) | ||
| JPH0584221B2 (enrdf_load_stackoverflow) | ||
| JPH0334469B2 (enrdf_load_stackoverflow) | ||
| US5081471A (en) | True edge thermal printhead | |
| JPH0582303B2 (enrdf_load_stackoverflow) | ||
| JPH0584228B2 (enrdf_load_stackoverflow) | ||
| JPH10125508A (ja) | チップサーミスタ及びその製造方法 | |
| JPH0582304B2 (enrdf_load_stackoverflow) | ||
| JP3652831B2 (ja) | 発熱装置およびその製造方法 | |
| JPH0380434B2 (enrdf_load_stackoverflow) | ||
| JPS62104774A (ja) | サ−マルヘツドおよびその製造方法 | |
| JPS6125550B2 (enrdf_load_stackoverflow) | ||
| CN113386469B (zh) | 热敏打印头及其制造方法 | |
| JPH0584225B2 (enrdf_load_stackoverflow) | ||
| JPH0586756B2 (enrdf_load_stackoverflow) | ||
| JP4360602B2 (ja) | サーマルヘッドおよびその製造方法、ならびにサーマルプリンタ | |
| JP2582397B2 (ja) | 薄膜型サーマルヘッド | |
| JPH0528183B2 (enrdf_load_stackoverflow) | ||
| JPH07205465A (ja) | サーマルヘッド及びその製造方法 | |
| JP2564555B2 (ja) | 厚膜型サ−マルヘッドの製造方法 | |
| JPH05330110A (ja) | サーマルヘッドの製造方法 | |
| JPS63130366A (ja) | サ−マルヘツド | |
| JP2551773B2 (ja) | サ−マルヘツド | |
| JPH0421459A (ja) | 通電方式記録ヘッド |