JPH0239784Y2 - - Google Patents

Info

Publication number
JPH0239784Y2
JPH0239784Y2 JP1984141307U JP14130784U JPH0239784Y2 JP H0239784 Y2 JPH0239784 Y2 JP H0239784Y2 JP 1984141307 U JP1984141307 U JP 1984141307U JP 14130784 U JP14130784 U JP 14130784U JP H0239784 Y2 JPH0239784 Y2 JP H0239784Y2
Authority
JP
Japan
Prior art keywords
plunger
microwave
mold
pot
microwave generator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984141307U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156016U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984141307U priority Critical patent/JPH0239784Y2/ja
Publication of JPS6156016U publication Critical patent/JPS6156016U/ja
Application granted granted Critical
Publication of JPH0239784Y2 publication Critical patent/JPH0239784Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1984141307U 1984-09-18 1984-09-18 Expired JPH0239784Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984141307U JPH0239784Y2 (enExample) 1984-09-18 1984-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984141307U JPH0239784Y2 (enExample) 1984-09-18 1984-09-18

Publications (2)

Publication Number Publication Date
JPS6156016U JPS6156016U (enExample) 1986-04-15
JPH0239784Y2 true JPH0239784Y2 (enExample) 1990-10-24

Family

ID=30699651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984141307U Expired JPH0239784Y2 (enExample) 1984-09-18 1984-09-18

Country Status (1)

Country Link
JP (1) JPH0239784Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199346A (ja) * 2011-03-21 2012-10-18 Toyota Motor Corp トランスファ成形方法及び成形装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59118418A (ja) * 1982-12-24 1984-07-09 Toshiba Corp 樹脂成形装置

Also Published As

Publication number Publication date
JPS6156016U (enExample) 1986-04-15

Similar Documents

Publication Publication Date Title
IL74471A (en) Process of making injection moldings and injection mold for carrying out the process
JPH0239784Y2 (enExample)
US4370122A (en) Apparatus for runnerless injection compression molding of thermosetting materials
JPS5611236A (en) Method and metallic mold for plastic molding
US4577078A (en) Apparatus for preheating mold resin for a semiconductor device
ES8306452A1 (es) Procedimiento para revestir hermeticamente las armaduras de una pieza de materia plastica armada interiormente.
US2381866A (en) Apparatus for induction heating of molding machines
JPS565746A (en) Hot runner mold for injection molding
JPS5528803A (en) Hot molding apparatus
JPS6216114A (ja) Ｌｉｍ成形金型
RU2037419C1 (ru) Способ изготовления изделий из полимерных термореактивных материалов
GB1196360A (en) Shell Mould and process for Shell Moulding
GB1416870A (en) Injection moulds
JPS56137A (en) Manufacture of container and container thereof
JPS58220715A (ja) ゴムまたは樹脂材料の射出成形方法
JPS5753334A (en) Polyestel resin injection molding machine and polyestel resin molding by said machine
JP2843254B2 (ja) 熱硬化性樹脂の成形金型
JPH0246987Y2 (enExample)
GB1242964A (en) Method of heating moulds for thermoplastics materials and moulds for carrying out the method
JPS574722A (en) Molding method of plastic and metal in one body
JPH04117721U (ja) 熱硬化性樹脂の反応射出成形装置
JPS6473302A (en) Manufacture of optical waveguide
JPS607136A (ja) 半導体素子の樹脂封止装置
JP2859129B2 (ja) 熱硬化性樹脂の成形方法
JPH028887B2 (enExample)