JPH0239071B2 - - Google Patents
Info
- Publication number
- JPH0239071B2 JPH0239071B2 JP62327212A JP32721287A JPH0239071B2 JP H0239071 B2 JPH0239071 B2 JP H0239071B2 JP 62327212 A JP62327212 A JP 62327212A JP 32721287 A JP32721287 A JP 32721287A JP H0239071 B2 JPH0239071 B2 JP H0239071B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- parallel
- soldering
- lead wires
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327212A JPH01169885A (ja) | 1987-12-25 | 1987-12-25 | ハンダ付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327212A JPH01169885A (ja) | 1987-12-25 | 1987-12-25 | ハンダ付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01169885A JPH01169885A (ja) | 1989-07-05 |
| JPH0239071B2 true JPH0239071B2 (enExample) | 1990-09-04 |
Family
ID=18196568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62327212A Granted JPH01169885A (ja) | 1987-12-25 | 1987-12-25 | ハンダ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169885A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272699A (ja) * | 1988-09-07 | 1990-03-12 | Taiyo Yuden Co Ltd | 混成集積回路におけるリード電極とリード線の半田付け方法 |
-
1987
- 1987-12-25 JP JP62327212A patent/JPH01169885A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01169885A (ja) | 1989-07-05 |
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