JPH0238462Y2 - - Google Patents
Info
- Publication number
- JPH0238462Y2 JPH0238462Y2 JP1982033726U JP3372682U JPH0238462Y2 JP H0238462 Y2 JPH0238462 Y2 JP H0238462Y2 JP 1982033726 U JP1982033726 U JP 1982033726U JP 3372682 U JP3372682 U JP 3372682U JP H0238462 Y2 JPH0238462 Y2 JP H0238462Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- chip component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3372682U JPS58135976U (ja) | 1982-03-08 | 1982-03-08 | 部品取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3372682U JPS58135976U (ja) | 1982-03-08 | 1982-03-08 | 部品取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58135976U JPS58135976U (ja) | 1983-09-13 |
| JPH0238462Y2 true JPH0238462Y2 (US08197722-20120612-C00042.png) | 1990-10-17 |
Family
ID=30045262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3372682U Granted JPS58135976U (ja) | 1982-03-08 | 1982-03-08 | 部品取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58135976U (US08197722-20120612-C00042.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Ind Co Ltd | Method of producing electric part mounting substrate |
-
1982
- 1982-03-08 JP JP3372682U patent/JPS58135976U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Ind Co Ltd | Method of producing electric part mounting substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58135976U (ja) | 1983-09-13 |
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