JPH0236051U - - Google Patents
Info
- Publication number
- JPH0236051U JPH0236051U JP11605588U JP11605588U JPH0236051U JP H0236051 U JPH0236051 U JP H0236051U JP 11605588 U JP11605588 U JP 11605588U JP 11605588 U JP11605588 U JP 11605588U JP H0236051 U JPH0236051 U JP H0236051U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- package
- lead
- bend
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 3
- 238000005219 brazing Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605588U JPH0236051U (enExample) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605588U JPH0236051U (enExample) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236051U true JPH0236051U (enExample) | 1990-03-08 |
Family
ID=31358262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11605588U Pending JPH0236051U (enExample) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236051U (enExample) |
-
1988
- 1988-09-02 JP JP11605588U patent/JPH0236051U/ja active Pending