JPH0236052U - - Google Patents
Info
- Publication number
- JPH0236052U JPH0236052U JP11605688U JP11605688U JPH0236052U JP H0236052 U JPH0236052 U JP H0236052U JP 11605688 U JP11605688 U JP 11605688U JP 11605688 U JP11605688 U JP 11605688U JP H0236052 U JPH0236052 U JP H0236052U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead
- semiconductor device
- pulled out
- bending portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605688U JPH0236052U (enExample) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605688U JPH0236052U (enExample) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236052U true JPH0236052U (enExample) | 1990-03-08 |
Family
ID=31358264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11605688U Pending JPH0236052U (enExample) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236052U (enExample) |
-
1988
- 1988-09-02 JP JP11605688U patent/JPH0236052U/ja active Pending