JPH0236051U - - Google Patents
Info
- Publication number
- JPH0236051U JPH0236051U JP11605588U JP11605588U JPH0236051U JP H0236051 U JPH0236051 U JP H0236051U JP 11605588 U JP11605588 U JP 11605588U JP 11605588 U JP11605588 U JP 11605588U JP H0236051 U JPH0236051 U JP H0236051U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- package
- lead
- bend
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 3
- 238000005219 brazing Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図の側面図、第３図は従来のパツケージの平
面図、第４図は第３図の側面図、第５図は本考案
の他の実施例の平面図、第６図は第５図の側面図
である。
１……半導体素子、２……リード、３……半導
体素子、４……リード、５……半導体素子、６…
…リード。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a side view of Fig. 1, Fig. 3 is a plan view of a conventional package, Fig. 4 is a side view of Fig. 3, Fig. 5 6 is a plan view of another embodiment of the present invention, and FIG. 6 is a side view of FIG. 5. 1...Semiconductor element, 2...Lead, 3...Semiconductor element, 4...Lead, 5...Semiconductor element, 6...
...Lead.
Claims (1)
の上面に平行に複数のリードを水平に引出し、所
定の距離にある第１の折曲部で前記リードを下方
に折曲げ、さらに該パツケージの底面とほぼ同じ
高さに設けた第２の折曲部で前記リードを水平方
向に折曲げ、該第２の折曲部からリード先端間に
ろう付け部を設ける表面実装形の半導体素子パツ
ケージにおいて、前記第２の折曲部でのリードの
曲げ方向を互い違いに反対方向に異ならしめるこ
とにより前記複数のリード先端を２列に整形する
ことを特徴とする半導体素子パツケージ。 Pull out a plurality of leads horizontally from opposite sides of the package parallel to the top surface of the package, bend the leads downward at a first bend at a predetermined distance, and then pull out the leads approximately parallel to the bottom surface of the package. In a surface mount type semiconductor device package, the lead is bent horizontally at a second bending portion provided at a height, and a brazing portion is provided between the second bending portion and the tip of the lead. 1. A semiconductor device package, characterized in that the leads are bent in opposite directions alternately at the bending portions of the leads, thereby shaping the tips of the plurality of leads into two rows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605588U JPH0236051U (en) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605588U JPH0236051U (en) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236051U true JPH0236051U (en) | 1990-03-08 |
Family
ID=31358262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11605588U Pending JPH0236051U (en) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236051U (en) |
-
1988
- 1988-09-02 JP JP11605588U patent/JPH0236051U/ja active Pending