JPH0234822Y2 - - Google Patents

Info

Publication number
JPH0234822Y2
JPH0234822Y2 JP1985097088U JP9708885U JPH0234822Y2 JP H0234822 Y2 JPH0234822 Y2 JP H0234822Y2 JP 1985097088 U JP1985097088 U JP 1985097088U JP 9708885 U JP9708885 U JP 9708885U JP H0234822 Y2 JPH0234822 Y2 JP H0234822Y2
Authority
JP
Japan
Prior art keywords
plate
heat
holder
resist film
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985097088U
Other languages
English (en)
Japanese (ja)
Other versions
JPS625635U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985097088U priority Critical patent/JPH0234822Y2/ja
Publication of JPS625635U publication Critical patent/JPS625635U/ja
Application granted granted Critical
Publication of JPH0234822Y2 publication Critical patent/JPH0234822Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
JP1985097088U 1985-06-26 1985-06-26 Expired JPH0234822Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985097088U JPH0234822Y2 (cs) 1985-06-26 1985-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985097088U JPH0234822Y2 (cs) 1985-06-26 1985-06-26

Publications (2)

Publication Number Publication Date
JPS625635U JPS625635U (cs) 1987-01-14
JPH0234822Y2 true JPH0234822Y2 (cs) 1990-09-19

Family

ID=30963661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985097088U Expired JPH0234822Y2 (cs) 1985-06-26 1985-06-26

Country Status (1)

Country Link
JP (1) JPH0234822Y2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12070234B2 (en) 2015-10-29 2024-08-27 Medtronic Xomed, Inc. Method and apparatus to reduce vibration

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101877403B1 (ko) * 2016-01-12 2018-07-13 에이피시스템 주식회사 기판 처리 장치 및 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142972A (en) * 1976-05-25 1977-11-29 Toshiba Corp Semiconductor production device
JPS5726433A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Bake of photoresist or the like and apparatus therefor
JPS5961027A (ja) * 1982-09-29 1984-04-07 Toshiba Corp 半導体基板加熱装置
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12070234B2 (en) 2015-10-29 2024-08-27 Medtronic Xomed, Inc. Method and apparatus to reduce vibration

Also Published As

Publication number Publication date
JPS625635U (cs) 1987-01-14

Similar Documents

Publication Publication Date Title
TW414932B (en) A substrate heating equipment, a method of heating a substrate and a method of dealing a substrate
JPH0234822Y2 (cs)
TWI711104B (zh) 加熱器區塊及利用所述加熱器區塊的基板熱處理裝置
JPS61198735A (ja) フラツシユランプアニ−ル装置
JPH0369111A (ja) 熱処理方法及び熱処理装置
CN102839420A (zh) 结晶装置、结晶方法以及热处理系统
JP2003037147A (ja) 基板搬送装置及び熱処理方法
JP3026305B2 (ja) 加熱処理方法
JP2519577Y2 (ja) ウエハー搬送アーム
JP3977275B2 (ja) 熱処理装置
JP3695677B2 (ja) 基板処理方法および装置
JPH0566571A (ja) レジストのベーキング方法
JP2691907B2 (ja) 加熱方法及び処理装置及び処理方法
JPH10284569A (ja) ウエハ搬送装置
JP2003037109A (ja) 熱処理装置
JPS6113373B2 (cs)
US4588379A (en) Configuration for temperature treatment of substrates, in particular semi-conductor crystal wafers
JPH036018A (ja) 半導体装置製造用ランプアニール装置
KR20140023743A (ko) 코일형 열선을 갖는 반도체 가열장치
JP2987184B2 (ja) 熱処理装置及び熱処理方法
JP2000077348A (ja) 半導体ウェハの熱処理法及び保持装置
JP2003194478A (ja) 熱処理装置
JPH025295B2 (cs)
JPH1116818A (ja) ベーキング装置
JPS6245113A (ja) 半導体装置製造装置