JPH0234180B2 - - Google Patents

Info

Publication number
JPH0234180B2
JPH0234180B2 JP62292005A JP29200587A JPH0234180B2 JP H0234180 B2 JPH0234180 B2 JP H0234180B2 JP 62292005 A JP62292005 A JP 62292005A JP 29200587 A JP29200587 A JP 29200587A JP H0234180 B2 JPH0234180 B2 JP H0234180B2
Authority
JP
Japan
Prior art keywords
heat dissipation
wiring board
package
semiconductor device
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62292005A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63146455A (ja
Inventor
Kanji Ootsuka
Masao Sekihashi
Tamotsu Usami
Michiaki Furukawa
Fumyuki Kobayashi
Masakatsu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP29200587A priority Critical patent/JPS63146455A/ja
Publication of JPS63146455A publication Critical patent/JPS63146455A/ja
Publication of JPH0234180B2 publication Critical patent/JPH0234180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP29200587A 1987-11-20 1987-11-20 半導体装置 Granted JPS63146455A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29200587A JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29200587A JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13163478A Division JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Publications (2)

Publication Number Publication Date
JPS63146455A JPS63146455A (ja) 1988-06-18
JPH0234180B2 true JPH0234180B2 (enrdf_load_stackoverflow) 1990-08-01

Family

ID=17776296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29200587A Granted JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS63146455A (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
JPH0815841B2 (ja) * 1985-07-19 1996-02-21 新家工業株式会社 スポークハグ組立体の移送装置

Also Published As

Publication number Publication date
JPS63146455A (ja) 1988-06-18

Similar Documents

Publication Publication Date Title
KR100310398B1 (ko) 열전도체를구비한패드어레이반도체소자및그제조방법
JP2548350B2 (ja) テープ自動結合に使用される熱放散相互接続テープ
TW319905B (enrdf_load_stackoverflow)
JP3526788B2 (ja) 半導体装置の製造方法
JP3879033B2 (ja) 積層型半導体パッケージ及びその製造方法
JPH0777247B2 (ja) 半導体装置の製造方法
JPH05211281A (ja) 段状電子装置パッケージ
TWI447871B (zh) 用於連接積體電路晶片至電源與接地電路之裝置
JPH0777258B2 (ja) 半導体装置
JPH08107166A (ja) 放熱用フィン
US6509642B1 (en) Integrated circuit package
JP3253154B2 (ja) 半導体装置用パッケージ及び半導体装置
JPS6220701B2 (enrdf_load_stackoverflow)
JP3544283B2 (ja) 電子部品用パッケージ
JPH03174749A (ja) 半導体装置
JPH0234180B2 (enrdf_load_stackoverflow)
JPS6220702B2 (enrdf_load_stackoverflow)
JP2810130B2 (ja) 半導体パッケージ
JP3521931B2 (ja) 半導体装置及びその製造方法
JPH02132847A (ja) セラミックス放熱フィン付半導体装置
JPH08222668A (ja) Ｉｃパッケージ
JP2000114442A (ja) 電子部品用パッケージ
JPS6211014Y2 (enrdf_load_stackoverflow)
JP2000138340A (ja) ハイブリッドモジュール
JP2007157801A (ja) 半導体モジュールとその製造方法