JPH0233438U - - Google Patents
Info
- Publication number
- JPH0233438U JPH0233438U JP10998388U JP10998388U JPH0233438U JP H0233438 U JPH0233438 U JP H0233438U JP 10998388 U JP10998388 U JP 10998388U JP 10998388 U JP10998388 U JP 10998388U JP H0233438 U JPH0233438 U JP H0233438U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- multilayer wiring
- wiring structure
- wiring conductor
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す断面図
、平面図、第２図、第３図は本考案の他の実施例
を示す断面図、第４図ａ，ｂは従来の膜集積回路
における多層配線構造の一例を示す断面図、平面
図である。
１……セラミツク基板、１１……凹み、２，４
，６……導体パターン、３，５……絶縁層。なお
図中同一符号は同一または相当する部分を示す。
Figures 1a and b are cross-sectional views and plan views showing one embodiment of the present invention, Figures 2 and 3 are cross-sectional views showing other embodiments of the present invention, and Figures 4a and b are sectional views of conventional FIG. 1 is a cross-sectional view and a plan view showing an example of a multilayer wiring structure in a film integrated circuit. 1... Ceramic substrate, 11... Recess, 2, 4
, 6... conductor pattern, 3, 5... insulating layer. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
構造部分の最下部の配線導体パターンと該配線導
体パターン上の絶縁層部分を基板に設けた凹み内
に納めたことを特徴とする膜集積回路。 A film integrated circuit having a multilayer wiring structure, characterized in that a lowermost wiring conductor pattern of a multilayer wiring structure part and an insulating layer part on the wiring conductor pattern are housed in a recess provided in a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998388U JPH0233438U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998388U JPH0233438U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233438U true JPH0233438U (en) | 1990-03-02 |
Family
ID=31346727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10998388U Pending JPH0233438U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233438U (en) |
-
1988
- 1988-08-24 JP JP10998388U patent/JPH0233438U/ja active Pending