JPH0231781Y2 - - Google Patents
Info
- Publication number
- JPH0231781Y2 JPH0231781Y2 JP14386084U JP14386084U JPH0231781Y2 JP H0231781 Y2 JPH0231781 Y2 JP H0231781Y2 JP 14386084 U JP14386084 U JP 14386084U JP 14386084 U JP14386084 U JP 14386084U JP H0231781 Y2 JPH0231781 Y2 JP H0231781Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- resin
- chip
- type electrolytic
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14386084U JPH0231781Y2 (es) | 1984-09-22 | 1984-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14386084U JPH0231781Y2 (es) | 1984-09-22 | 1984-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159336U JPS6159336U (es) | 1986-04-21 |
| JPH0231781Y2 true JPH0231781Y2 (es) | 1990-08-28 |
Family
ID=30702151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14386084U Expired JPH0231781Y2 (es) | 1984-09-22 | 1984-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231781Y2 (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2829858B2 (ja) * | 1988-04-01 | 1998-12-02 | 日本ケミコン株式会社 | チップ形コンデンサおよびその製造方法 |
| JP2551570Y2 (ja) * | 1989-03-29 | 1997-10-22 | 日本ケミコン 株式会社 | チップ形コンデンサ |
-
1984
- 1984-09-22 JP JP14386084U patent/JPH0231781Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159336U (es) | 1986-04-21 |
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