JPH0231140U - - Google Patents
Info
- Publication number
- JPH0231140U JPH0231140U JP11011588U JP11011588U JPH0231140U JP H0231140 U JPH0231140 U JP H0231140U JP 11011588 U JP11011588 U JP 11011588U JP 11011588 U JP11011588 U JP 11011588U JP H0231140 U JPH0231140 U JP H0231140U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- label
- semiconductor device
- tape
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図は従来の樹脂封止型半導体装置の側面図である
。
１……外部リード、２……ラベル、３……モー
ルド樹脂、４……マーキング文字部、５……マー
キング文字。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a side view of a conventional resin-sealed semiconductor device. 1...External lead, 2...Label, 3...Mold resin, 4...Marking character section, 5...Marking character.
Claims (1)
ベルまたはテープまたは塗膜をモールド樹脂表面
に設けた事を特徴とする樹脂封止型半導体装置。 A resin-sealed semiconductor device characterized by having a label, tape, or coating film with low heat absorption and a marking function provided on the surface of a mold resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011588U JPH0231140U (en) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011588U JPH0231140U (en) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231140U true JPH0231140U (en) | 1990-02-27 |
Family
ID=31346981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11011588U Pending JPH0231140U (en) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231140U (en) |
-
1988
- 1988-08-22 JP JP11011588U patent/JPH0231140U/ja active Pending