JPH02303571A - Dispenser and method for controlling dispenser - Google Patents
Dispenser and method for controlling dispenserInfo
- Publication number
- JPH02303571A JPH02303571A JP12091789A JP12091789A JPH02303571A JP H02303571 A JPH02303571 A JP H02303571A JP 12091789 A JP12091789 A JP 12091789A JP 12091789 A JP12091789 A JP 12091789A JP H02303571 A JPH02303571 A JP H02303571A
- Authority
- JP
- Japan
- Prior art keywords
- dispenser
- substrate
- adhesive substance
- trial
- discharge rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000005303 weighing Methods 0.000 claims abstract description 12
- 238000005259 measurement Methods 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims description 26
- 238000012360 testing method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）に集土の利用分野
本発明は基板に粘着性物質を塗布するディスペンサ装置
及びその制御方法に関する。粘着性物質としては半田ペ
ーストや接着剤といったものを挙げることができ、１１
０１路基板に電子部品を装置する工程に利用司能である
〇
（ロ）従来の技術
リードレス電子部品をＮ路基板に固定するときには、半
田ペーストや接着剤といった固定用の媒体を前もって基
板に塗布しておく必要がある。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Application of Soil Collection The present invention relates to a dispenser device for applying an adhesive substance to a substrate and a control method thereof. Examples of adhesive substances include solder paste and adhesives, and 11
01 It is used in the process of mounting electronic components on a N-way board.〇 (B) Conventional technology When fixing leadless electronic components to an N-way board, a fixing medium such as solder paste or adhesive is applied to the board in advance. It needs to be applied.
塗布手段としてはスクリーン印刷装置やシリンジ状ディ
スペンサを使う。スクリーン印刷装置にしてもディスベ
ン、すにしても、過不足のない塗布量を維持し続けるこ
とが求めらｎる。ディスペンサについては、光フアイバ
光電センサにより塗布済接着剤の量を判定する構成が特
開昭６２−８８２７５号公報において提案さｎている。A screen printing device or a syringe-like dispenser is used as the application means. Whether it is a screen printing device or a dispenser, it is required to maintain the right amount of coating. Regarding the dispenser, a configuration in which the amount of applied adhesive is determined using an optical fiber photoelectric sensor has been proposed in Japanese Patent Laid-Open No. 62-88275.
また「捨て打ち」の手法もディスペンサの使用現場では
良く行われてきた。「捨て打ち」というのは、第２図に
示すように、基板１の電子部品装着領域２（斜線部分）
の外側に特別な余白部分８を設け、この余白部分３に粘
着性物質４（半田ペースト、接着剤）を何Ｎか試し打ち
し、吐出状態が安定したところで電子部品装着領域２へ
の塗布作業を開始する、という手法である。塗布から塗
布までの時間的間隔が長くなると、ディスペンサのノズ
ル先端の粘着性物質が変質し、基板に規定量付着させる
のが困難になるが、この手法を採用していれば、実際電
子部品の固定に使用する分については常に安定した吐出
状態を確保することができる。試し打ちを何同行うかは
経験に基づき定める。Additionally, the "throw away" method has often been used in the field where dispensers are used. As shown in Figure 2, "discarding" means the electronic component mounting area 2 (shaded area) of the board 1.
A special margin 8 is provided on the outside of the blank space 3, and a certain number of N of adhesive substance 4 (solder paste, adhesive) is test applied to this margin 3, and when the discharge condition becomes stable, the application work is performed to the electronic component mounting area 2. This is a method of starting. If the time interval between applications is long, the adhesive substance at the tip of the dispenser nozzle will deteriorate, making it difficult to deposit the specified amount on the board, but if this method is adopted, it will actually be possible to A stable discharge state can always be ensured for the portion used for fixation. The number of trial shots to be performed will be determined based on experience.
（ハ）発明が解決しようとする課鵬
上記した粘着性物質の試し打ちは、これまでは基板その
ものに余白部分を設けて行って来た。。(c) Problems to be Solved by the Invention Up to now, the above-mentioned test application of the adhesive substance has been carried out by providing a blank space on the substrate itself. .
ところがこれでは、電子部品装着に関与しない部分の面
積が増え、基板上のスペース効率が悪くなる。本発明は
この問題を解決しようとするものである。また、粘着性
物質の吐出量をより正確に制御しようとするものである
。However, this increases the area of portions that are not involved in mounting electronic components, resulting in poor space efficiency on the board. The present invention seeks to solve this problem. It is also an attempt to more accurately control the amount of adhesive material discharged.
に）課題を解決するための手段
本発明では、作業対象たる基板とは別個に、粘着性物質
の試し打ち板を用意する。B) Means for Solving the Problems In the present invention, a test board made of an adhesive material is prepared separately from the substrate to be worked on.
更にこの試し打ち板に付着した粘着性物質の山積を画像
認識装置により計測し、その計測結果に基づき粘着性物
質の吐出量を調整するものとする。Further, the amount of adhesive material adhering to this test plate is measured by an image recognition device, and the amount of adhesive material to be discharged is adjusted based on the measurement result.
あるいは、試し打ら板を秤量装置１こより支持しスこの
秤量装置により粘着性物質の単位吐出重量をＶ！関しそ
の計測結果に基づき粘着性物質の吐出量を調整するもの
とする。Alternatively, the test plate is supported by one weighing device and the unit discharge weight of the sticky substance is measured by this weighing device V! The amount of adhesive material to be discharged shall be adjusted based on the measurement results.
（ホ）作 用
上記構成により、基板そのものに試し打ち用のスペース
を確保する必要がなくなり、基板全域を電子部品装着に
あてることが可能になる・また、画像認識装置または秤
量装置により試し打ち時の吐出量を計測し、それに基づ
き吐出量を調整するので、基板には当初から適量の粘着
性物質が塗布さｎる。(E) Effect With the above configuration, it is no longer necessary to secure a space for test driving on the board itself, and the entire board can be used for mounting electronic components.In addition, the image recognition device or weighing device can be used for test driving. Since the discharge amount is measured and the discharge amount is adjusted based on the measured amount, an appropriate amount of adhesive substance is applied to the substrate from the beginning.
（へ）実施例
第１図において、ｌＯは作業対象たる基板、１１はその
表面に塗布される粘着性物質を示す。(F) Embodiment In FIG. 1, 10 indicates a substrate to be worked on, and 11 indicates an adhesive substance to be applied to the surface thereof.
２０はシリンジ状のディスペンサである。ディスペンサ
２０はロボットアーム又はζｎに類するものに支持さｎ
、空間円を移動する。２１はディスペンサ２０の内圧を
変化させてディスペンサ２０から粘着性物質１１を押し
出し、あるいは押し出しを停止させろ電空変換レギュレ
ータである。３０は試し打ち板であり、秤量装置ｔ８１
に支持さｎる。４０は画像認識装置で、こｎは試し打ち
板８０の表鈎を監視するカメラ４１と、カメラ４１から
の画像情報を処理する画像処理袋＠４２とにより構成さ
れる。電空変換レギュレータ２１．秤量装置１８１．及
び画像処理装置４２は、いずｎも制゛御装＠５０に接続
し、制御装置５０にデータを送り、あるいは制御装置１
！５０から指令を受は取る。20 is a syringe-shaped dispenser. The dispenser 20 is supported on a robot arm or the like.
, move the space circle. Reference numeral 21 denotes an electro-pneumatic conversion regulator that changes the internal pressure of the dispenser 20 to push out the adhesive substance 11 from the dispenser 20 or stop the pushing out. 30 is a test board, and weighing device t81
Supported by Reference numeral 40 denotes an image recognition device, which is composed of a camera 41 that monitors the front hook of the test board 80, and an image processing bag @42 that processes image information from the camera 41. Electro-pneumatic conversion regulator 21. Weighing device 181. and the image processing device 42 are both connected to the control device @50 and send data to the control device 50, or the control device 1
! Receives orders from 50.
上記装置においては、基板１０への塗布作業を開始する
前にまず試し打ら板３０に粘着性物質１１を試し打ちす
る。そしてその試し打ちの吐出量を計測する。計測は、
画像認識装置４０または秤量装置３１を使用して行う。In the above-mentioned apparatus, before starting the coating work on the substrate 10, the adhesive substance 11 is first test-shot onto the test-stamping plate 30. Then, the discharge amount of the trial shot is measured. The measurement is
This is carried out using the image recognition device 40 or the weighing device 31.
画像認識装置４０を使用する場合は、カメラ４１でとら
えた粘着性物質１１の画像を画像処理装置４２で処理し
て塗布面積を求めろ。秤量装置８１を使用するときは、
試し打ら前後の試し打ち板８０の重量を比較することに
より、粘着性物質１１の単位吐出重量を求める。面積デ
ータないし亜斌データはいすｎも制御装置５０に送られ
、そのデータに基づき制御装ｆｉ６０は電空変換レギュ
レータ２１０制御鰍を決定する。試し打ちの結果、粘着
性物質１１の吐出量が設定範囲にないことが判明したと
きは、ディスペンサ２０の吐出量を調整して再度試し打
ちを行う。吐出量が設定範囲におさまるまで試し打ちを
繰り返し、所望の結果か得られてから基板ＩＯへの塗布
作業を開始する。試し打ちは、必ずしも全部の基板ｌＯ
につき行う必要はない。一定紋数毎に試し打ち工程を挿
入して吐出量をチェックするようにすれば十分である。When using the image recognition device 40, the image of the adhesive substance 11 captured by the camera 41 is processed by the image processing device 42 to obtain the applied area. When using the weighing device 81,
By comparing the weights of the test plate 80 before and after the test shot, the unit discharge weight of the adhesive substance 11 is determined. The area data or space data is also sent to the control device 50, and based on the data, the control device fi60 determines the control direction of the electro-pneumatic conversion regulator 210. As a result of the trial shot, if it is found that the discharge amount of the adhesive substance 11 is not within the set range, the discharge amount of the dispenser 20 is adjusted and the trial shot is performed again. Trial shots are repeated until the discharge amount falls within the set range, and after the desired result is obtained, the coating work on the substrate IO is started. Trial run does not necessarily include all boards.
There is no need to do so. It is sufficient to check the ejection amount by inserting a trial punching process every certain number of patterns.
但し、基板の機種替え等のため長い休止時間が生じるよ
うな場合には、作業再開時に必ず試し打ちを行うように
する必要がある。試し打ち板３０にはマトリックス状に
試し打ち点を設定し、その試し打ち点が埋め尽さｎるか
、あるいはその少し前の時点で、試し打ち板８０の交換
を要する旨の管轄を制御装置から発させるようにする。However, if there is a long downtime due to changing the type of board, etc., it is necessary to make sure to perform a test drive when restarting work. Trial hitting points are set in a matrix on the trial hitting board 30, and when the trial hitting points are filled up or a little before that time, the control device is in charge of requiring replacement of the trial hitting board 80. Let it emanate from the
（ト）発明の効果
本発明によｎば、粘着性物質の試し打ちをするスペース
を基板に設ける必要がないので、基板向を電子部品装着
に有効利用することができる。(G) Effects of the Invention According to the present invention, there is no need to provide a space on the board for testing an adhesive substance, so the orientation of the board can be effectively utilized for mounting electronic components.
また画像認識装置ないし秤量装置で吐出量を１確に計測
し、規定通りの吐出量が得られるよう調整するようにし
たから、基板には常に適正量の粘着性物質が塗布さｎる
。In addition, since the discharge amount is precisely measured using an image recognition device or a weighing device and adjusted to obtain the prescribed discharge amount, the appropriate amount of adhesive substance is always applied to the substrate.
第１図は本発明に係るディスペンサ装置の楕成例を示す
概略構成図、第２図は従来行われて来た試し打ち手法を
説明する基板平面図である。
１０・・・基板、１１・・・粘着性物質、２０・・・デ
ィスペンサ、３０・・・試し打ち板、４０・・・画線認
識装置、８１・・・秤量装置。FIG. 1 is a schematic configuration diagram showing an elliptical example of a dispenser device according to the present invention, and FIG. 2 is a board plan view illustrating a conventional test method. DESCRIPTION OF SYMBOLS 10... Substrate, 11... Adhesive substance, 20... Dispenser, 30... Trial punching board, 40... Line recognition device, 81... Weighing device.
Claims (3)
物質を塗布するものにおいて、 作業対象たる前記基板とは別個に、粘着性物質の試し打
ち板を用意したことを特徴とするディスペンサ装置。(1) A dispenser device for applying an adhesive substance to a predetermined location on the surface of a substrate using a dispenser, characterized in that a test plate for applying the adhesive substance is prepared separately from the substrate to be worked on.
物質を塗布するものにおいて、 作業対象たる前記基板とは別個に、粘着性物質の試し打
ち板を用意し、この試し打ち板に付着した粘着性物質の
面積を画像認識装置により計測し、その計測結果に基づ
き粘着性物質の吐出量を調整することを特徴とするディ
スペンサ制御方法。(2) When applying an adhesive substance to a predetermined location on the surface of a board using a dispenser, a trial plate of the adhesive substance is prepared separately from the substrate to be worked on, and the adhesive adhered to the trial plate is prepared. A dispenser control method characterized by measuring the area of a substance using an image recognition device and adjusting the discharge amount of the adhesive substance based on the measurement result.
物質を塗布するものにおいて、 作業対象たる前記基板とは別個に、粘着性物質の試し打
ち板を用意し、この試し打ち板を秤量装置により支持し
、この秤量装置により粘着性物質の単位吐出重量を計測
し、その計測結果に基づき粘着性物質の吐出量を調整す
ることを特徴とするディスペンサ制御方法。(3) When applying an adhesive substance to a predetermined location on the surface of a substrate using a dispenser, a trial plate of the adhesive substance is prepared separately from the substrate to be worked on, and this trial plate is supported by a weighing device. A dispenser control method comprising: measuring a unit discharge weight of the adhesive substance using the weighing device, and adjusting the discharge amount of the adhesive substance based on the measurement result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1120917A JP2865310B2 (en) | 1989-05-15 | 1989-05-15 | Dispenser device and dispenser control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1120917A JP2865310B2 (en) | 1989-05-15 | 1989-05-15 | Dispenser device and dispenser control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02303571A true JPH02303571A (en) | 1990-12-17 |
| JP2865310B2 JP2865310B2 (en) | 1999-03-08 |
Family
ID=14798190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1120917A Expired - Lifetime JP2865310B2 (en) | 1989-05-15 | 1989-05-15 | Dispenser device and dispenser control method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2865310B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3045773A1 (en) * | 1980-12-04 | 1982-07-08 | Lotte Co., Ltd., Tokyo | Gas-developing chewing gum - contg. carbonate salt in granules to protect from premature reaction |
| EP0854759A4 (en) * | 1995-10-13 | 2000-11-29 | Nordson Corp | Flip chip underfill system and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135561A (en) * | 1987-08-27 | 1989-05-29 | Fuji Kikai Seizo Kk | Apparatus for applying highly viscous fluid |
| JPH01307470A (en) * | 1988-06-06 | 1989-12-12 | Matsushita Electric Ind Co Ltd | Coating applicator for viscous fluid |
-
1989
- 1989-05-15 JP JP1120917A patent/JP2865310B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135561A (en) * | 1987-08-27 | 1989-05-29 | Fuji Kikai Seizo Kk | Apparatus for applying highly viscous fluid |
| JPH01307470A (en) * | 1988-06-06 | 1989-12-12 | Matsushita Electric Ind Co Ltd | Coating applicator for viscous fluid |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3045773A1 (en) * | 1980-12-04 | 1982-07-08 | Lotte Co., Ltd., Tokyo | Gas-developing chewing gum - contg. carbonate salt in granules to protect from premature reaction |
| EP0854759A4 (en) * | 1995-10-13 | 2000-11-29 | Nordson Corp | Flip chip underfill system and method |
| US6541304B1 (en) | 1995-10-13 | 2003-04-01 | Nordson Corporation | Method of dispensing a viscous material |
| US6955946B2 (en) | 1995-10-13 | 2005-10-18 | Nordson Corporation | Flip chip underfill system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2865310B2 (en) | 1999-03-08 |
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