JPH05329423A - Applying device - Google Patents
Applying deviceInfo
- Publication number
- JPH05329423A JPH05329423A JP14065792A JP14065792A JPH05329423A JP H05329423 A JPH05329423 A JP H05329423A JP 14065792 A JP14065792 A JP 14065792A JP 14065792 A JP14065792 A JP 14065792A JP H05329423 A JPH05329423 A JP H05329423A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- cartridge
- nozzle
- adhesive
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電子回路組立時において
部品を保持するために塗布される接着剤などを塗布する
のに好適に利用される塗布装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus suitably used for applying an adhesive or the like applied to hold a component during electronic circuit assembly.
【0002】[0002]
【従来の技術】従来から、プリント基板(以下、基板と
いう)の組立工程において、ICなどの部品を仮固定す
る際には、基板に接着剤を塗布した後部品を基板に装着
しているが、その接着剤の塗布装置において、近年は部
品の微細化に伴って塗布精度に対する要求が高くなって
きている。2. Description of the Related Art Conventionally, in the process of assembling a printed circuit board (hereinafter referred to as a substrate), when temporarily fixing a component such as an IC, an adhesive is applied to the substrate and then the component is mounted on the substrate. In recent years, in the adhesive coating device, the demand for coating accuracy has increased with the miniaturization of parts.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、従来の
塗布装置では塗布位置の微調整手段を備えていないため
一定以上に塗布精度を高めるのは困難であり、特に接着
剤を充填したカートリッジを交換した場合に起こるわず
かな機械的ずれを調整することができないため、部品の
微小化に対応した塗布精度を確保するのが困難であり、
塗布位置の極くわずかなずれによって部品の電極に接着
剤が付着し、半田付け不良を起こすという問題が発生し
てきた。However, it is difficult to increase the coating accuracy above a certain level because the conventional coating apparatus does not have means for finely adjusting the coating position. Particularly, the cartridge filled with the adhesive is replaced. Since it is not possible to adjust the slight mechanical deviation that occurs in some cases, it is difficult to ensure coating accuracy that corresponds to the miniaturization of parts,
There has been a problem that the adhesive adheres to the electrode of the component due to the slightest deviation of the coating position, resulting in defective soldering.
【0004】本発明は上記従来の問題点に鑑み、カート
リッジのノズルによる塗布位置を読み取って高精度の塗
布を可能にした塗布装置を提供することを目的とする。In view of the above-mentioned conventional problems, it is an object of the present invention to provide a coating apparatus capable of reading a coating position by a nozzle of a cartridge and coating with high precision.
【0005】[0005]
【課題を解決するための手段】本発明の塗布装置は、塗
布材料を充填したカートリッジと、塗布対象のワークを
保持する手段と、カートリッジを保持してワークに対し
てXY方向及びθ方向に駆動する手段と、塗布位置及び
形状を検出する手段と、検出結果によりカートリッジの
先端のノズル位置をXY方向及びθ方向に位置制御する
手段とを備えたことを特徴とする。A coating apparatus according to the present invention comprises a cartridge filled with a coating material, a means for holding a work to be coated, a cartridge holding the cartridge and driving the work in XY and θ directions. Means, a means for detecting the coating position and the shape, and a means for controlling the position of the nozzle at the tip of the cartridge in the XY and θ directions according to the detection result.
【0006】[0006]
【作用】本発明は上記した構成によって、材料切れ等に
よりカートリッジを交換・着脱した時にそのノズルによ
る塗布位置を検出し、X、Y、θのずれ量を位置補正す
ることにより常に安定した高精度塗布を実現することが
できる。According to the present invention, with the above-described structure, when the cartridge is exchanged / removed due to a material shortage or the like, the coating position by the nozzle is detected, and the X, Y, and θ deviation amounts are position-corrected, so that stable and high-accuracy is always achieved. Application can be achieved.
【0007】[0007]
【実施例】以下、本発明の一実施例の塗布装置について
図1〜図6を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A coating apparatus according to an embodiment of the present invention will be described below with reference to FIGS.
【0008】図1は本発明の一実施例における塗布装置
の概略構成を示すものである。1は基板4に塗布すべき
接着剤11を充填したカートリッジ、2はカートリッジ
1の先端に形成された接着剤の塗布ノズル、3は塗布さ
れた接着剤の位置・形状を検出する認識カメラである。
カートリッジ1及び認識カメラ3はX軸テーブル6上に
配置されている。また、塗布ノズル2の塗布方向θはθ
軸駆動手段8(具体構成は図示せず、その回転軸芯のみ
示す。)にてその軸芯回りに自在に制御可能に構成され
ている。一方、接着剤を塗布する対象である基板4、及
び接着剤を捨て打ちして認識カメラ3にて検出する捨て
打ちエリア5がY軸テーブル7上に配置されている。FIG. 1 shows a schematic structure of a coating apparatus according to an embodiment of the present invention. Reference numeral 1 is a cartridge in which a substrate 4 is filled with an adhesive 11 to be applied, 2 is an adhesive application nozzle formed at the tip of the cartridge 1, and 3 is a recognition camera for detecting the position and shape of the applied adhesive. ..
The cartridge 1 and the recognition camera 3 are arranged on the X-axis table 6. Further, the application direction θ of the application nozzle 2 is θ
The shaft drive means 8 (a specific structure is not shown, only its rotation axis is shown) is freely controllable around the axis. On the other hand, the substrate 4 to which the adhesive is applied and the discarding area 5 in which the adhesive is discarded and detected by the recognition camera 3 are arranged on the Y-axis table 7.
【0009】図2に代表的な塗布ノズル2による接着剤
形状を示す。また、その塗布形状及び位置は塗布方向θ
によって変化する。FIG. 2 shows a shape of an adhesive agent using a typical coating nozzle 2. In addition, the application shape and position are in the application direction θ.
It depends on.
【0010】図3に制御ブロック図を示す。認識カメラ
3により接着剤の塗布位置及び形状を認識し、演算部9
にてX、Y、θの各軸の補正演算を行い、その結果に基
づいてドライバー10にてX軸テーブル6、Y軸テーブ
ル7、θ軸駆動手段8を制御する。FIG. 3 shows a control block diagram. The recognition camera 3 recognizes the application position and shape of the adhesive, and the arithmetic unit 9
The X, Y, and θ axes are corrected and calculated, and the driver 10 controls the X axis table 6, the Y axis table 7, and the θ axis drive means 8 based on the results.
【0011】図4の(a)、(b)、(c)に塗布方向
θを、0°と90°と−90°に変化させた時に塗布ノ
ズル2による塗布位置がずれる様子を示す。即ち、機械
的ばらつきによりθ=0°のときでも(a)に示すよう
に僅かに塗布位置のばらつきa、傾き角αを有してい
る。塗布方向θを変化させると機械的偏心等により塗布
ノズル2の先端がずれてくるため、塗布方向θをθ=9
0°にすると、(b)に示すように塗布位置のばらつき
がb1 、傾き角がβ1 (=90°+α)となり、θ=−
90°にすると、(c)に示すように塗布位置のばらつ
きがb2 、傾き角がβ2 (=90°−α)となる。尚、
塗布方向θを変化させる範囲は基板に装着する部品の方
向に対応しているため、−90°から+90°の範囲で
対応すれば良い。FIGS. 4A, 4B and 4C show how the coating position of the coating nozzle 2 is displaced when the coating direction θ is changed to 0 °, 90 ° and −90 °. That is, due to mechanical variations, even when θ = 0 °, there is a slight variation in coating position a and an inclination angle α as shown in (a). When the coating direction θ is changed, the tip of the coating nozzle 2 is displaced due to mechanical eccentricity or the like.
When it is set to 0 °, as shown in (b), the dispersion of the coating position is b 1 , the inclination angle is β 1 (= 90 ° + α), and θ = −
When the angle is 90 °, the variation in the coating position is b 2 and the inclination angle is β 2 (= 90 ° -α) as shown in (c). still,
Since the range in which the coating direction θ is changed corresponds to the direction of the component mounted on the substrate, it may be supported in the range from −90 ° to + 90 °.
【0012】図5に、塗布方向θの変化により塗布位置
のばらつき量Δ(X,Y)が変化する状態を示す。即
ち、図5は横軸に塗布方向θ、縦軸に塗布位置のばらつ
き量Δ(X,Y)をとっており、塗布方向θがθ=0°
とθ=90°の間では塗布位置のばらつき量Δ(X,
Y)はaとb1 の間で比例的に変化し、θ=0°とθ=
−90°の間では塗布位置のばらつき量Δ(X,Y)は
aとb2 の間で比例的に変化する状態を示している。FIG. 5 shows a state in which the variation amount Δ (X, Y) of the coating position changes due to the change of the coating direction θ. That is, in FIG. 5, the horizontal axis represents the coating direction θ and the vertical axis represents the variation amount Δ (X, Y) of the coating position, and the coating direction θ is θ = 0 °.
And θ = 90 °, the dispersion amount Δ (X,
Y) changes proportionally between a and b 1 , and θ = 0 ° and θ =
In the range of −90 °, the variation Δ (X, Y) of the coating position changes proportionally between a and b 2 .
【0013】次に、図6のフローチャートを参照して制
御方法を説明する。Next, the control method will be described with reference to the flowchart of FIG.
【0014】カートリッジ1を着脱したり、接着剤切れ
でカートリッジ1を交換した場合、上記のように機械的
ばらつきや偏心等により塗布位置が僅かながら変化する
ことになる。そこで、捨て打ちエリア5にθ=0°で捨
て打ちし、その塗布された状態を認識カメラ3にて塗布
ノズル2の中心a及び傾きαを計測する。同じように捨
て打ちエリア5に前回と異なる場所にθ=90°で捨て
打ちして認識カメラ3にて塗布ノズル2の中心b1 及び
傾きβ1 を計測する。同様に、θ=−90°で塗布ノズ
ル2の中心b2 及び傾きβ2 を計測する。かくして、任
意の塗布方向θにおけるずれ量Δ(X,Y)及び傾きΔ
θは次式で表されるため、演算部9により各塗布点につ
いてその塗布方向θに従って演算し、そのずれ量だけ位
置補正を行う。When the cartridge 1 is attached or detached, or when the cartridge 1 is replaced by running out of the adhesive, the coating position slightly changes due to the mechanical variations and eccentricity as described above. Therefore, the discarding is performed in the discarding area 5 at θ = 0 °, and the coated state is measured by the recognition camera 3 for the center a and the inclination α of the coating nozzle 2. Similarly, in the discarding area 5, a different location from the previous time is ejected at θ = 90 °, and the recognition camera 3 measures the center b 1 and the inclination β 1 of the coating nozzle 2. Similarly, the center b 2 and the inclination β 2 of the coating nozzle 2 are measured at θ = −90 °. Thus, the deviation amount Δ (X, Y) and the inclination Δ in the arbitrary coating direction θ
Since θ is represented by the following equation, the calculation unit 9 calculates each application point according to the application direction θ, and corrects the position by the deviation amount.
【0015】 Δ(X,Y)=a+(b1 −a)θ/90 ( 0
≦θ≦90) Δ(X,Y)=a−(b2 −a)θ/90 (−90
<θ<0 ) Δθ =αΔ (X, Y) = a + (b 1 −a) θ / 90 (0
≦ θ ≦ 90) Δ (X, Y) = a− (b 2 −a) θ / 90 (−90
<Θ <0) Δθ = α
【0016】[0016]
【発明の効果】本発明によれば、以上のように塗布材料
を充填したカートリッジと、塗布対象のワークを保持す
る手段と、カートリッジを保持してワークに対してXY
方向及びθ方向に駆動する手段と、塗布位置及び形状を
検出する手段と、検出結果によりカートリッジの先端の
ノズル位置をXY方向及びθ方向に位置制御する手段と
を備えることにより、材料切れ等によるカートリッジの
交換、着脱時に塗布ノズルの位置を検出し、X、Y、θ
のずれ量を位置補正することにより常に安定した高精度
塗布を実現できる。According to the present invention, the cartridge filled with the coating material as described above, the means for holding the work to be coated, and the XY for the work while holding the cartridge.
Direction and θ direction, means for detecting the coating position and shape, and means for position control of the nozzle position of the tip of the cartridge in the XY direction and θ direction according to the detection result, so as to prevent the material from running out. Detects the position of the coating nozzle when replacing or attaching / removing the cartridge, and X, Y, θ
By correcting the deviation amount of the position, it is possible to always realize stable and high-precision coating.
【図1】本発明の一実施例における塗布装置の概略構成
を示す斜視図である。FIG. 1 is a perspective view showing a schematic configuration of a coating apparatus according to an embodiment of the present invention.
【図2】同実施例における代表的な接着剤の塗布形状と
塗布方向によるその変化を示す説明図である。FIG. 2 is an explanatory diagram showing a coating shape of a representative adhesive and its change depending on a coating direction in the example.
【図3】同実施例の制御ブロック図である。FIG. 3 is a control block diagram of the embodiment.
【図4】同実施例において塗布ノズルを所定の塗布方向
に向けた場合の塗布位置のずれを示し、(a)は塗布方
向θが0°の場合、(b)は塗布方向θが90°の場
合、(c)は塗布方向θが−90°の場合の塗布位置の
ずれ量を示す説明図である。4A and 4B show the deviation of the coating position when the coating nozzle is directed in a predetermined coating direction in the same embodiment. FIG. 4A shows a case where the coating direction θ is 0 °, and FIG. In the case (2), (c) is an explanatory diagram showing the amount of deviation of the application position when the application direction θ is −90 °.
【図5】同実施例において塗布方向により塗布位置がず
れる様子の説明図である。FIG. 5 is an explanatory diagram showing how the coating position is displaced depending on the coating direction in the example.
【図6】同実施例におけるカートリッジの交換・着脱時
の動作・演算のフローチャートである。FIG. 6 is a flowchart of operations / calculations at the time of replacement / attachment / detachment of the cartridge in the embodiment.
1 カートリッジ 2 塗布ノズル 3 認識カメラ 6 X軸テーブル 7 Y軸テーブル 8 θ軸駆動手段 9 演算部 1 Cartridge 2 Coating Nozzle 3 Recognition Camera 6 X-Axis Table 7 Y-Axis Table 8 θ-Axis Driving Means 9 Computing Unit
Claims (1)
布対象のワークを保持する手段と、カートリッジを保持
してワークに対してXY方向及びθ方向に駆動する手段
と、塗布位置及び形状を検出する手段と、検出結果によ
りカートリッジの先端のノズル位置をXY方向及びθ方
向に位置制御する手段とを備えたことを特徴とする塗布
装置。1. A cartridge filled with a coating material, a means for holding a work to be coated, a means for holding the cartridge and driving the work in XY and θ directions, and detecting a coating position and shape. An applicator comprising: a means and a means for controlling the position of the nozzle at the tip of the cartridge in the XY and θ directions based on the detection result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14065792A JPH05329423A (en) | 1992-06-01 | 1992-06-01 | Applying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14065792A JPH05329423A (en) | 1992-06-01 | 1992-06-01 | Applying device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05329423A true JPH05329423A (en) | 1993-12-14 |
Family
ID=15273743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14065792A Pending JPH05329423A (en) | 1992-06-01 | 1992-06-01 | Applying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05329423A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003001175A (en) * | 2001-06-21 | 2003-01-07 | Toshiba Corp | Painting device, painting method and method for manufacturing display device |
WO2003061357A1 (en) * | 2001-12-27 | 2003-07-24 | New System Srl | System to form a layering of electronically-interactive material |
KR100673308B1 (en) * | 2005-02-01 | 2007-01-24 | 주식회사 탑 엔지니어링 | Paste Dispenser and Method for Controlling the same |
JP2007152164A (en) * | 2005-12-01 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | Coating apparatus and adjustment method for pitches of nozzles in the apparatus |
JP2009050853A (en) * | 2008-11-10 | 2009-03-12 | Shibaura Mechatronics Corp | Paste coating method and apparatus |
US7548798B2 (en) | 2003-06-20 | 2009-06-16 | Top Engineering, Co., Ltd. | Paste dispenser and method for controlling the same |
US8291854B2 (en) * | 2003-04-17 | 2012-10-23 | Translumina Gmbh | Device for applying active substances to surfaces of medical implants, in particular stents |
WO2020049858A1 (en) * | 2018-09-03 | 2020-03-12 | パナソニックIpマネジメント株式会社 | Liquid agent supply device and liquid agent supply method |
-
1992
- 1992-06-01 JP JP14065792A patent/JPH05329423A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003001175A (en) * | 2001-06-21 | 2003-01-07 | Toshiba Corp | Painting device, painting method and method for manufacturing display device |
JP4675505B2 (en) * | 2001-06-21 | 2011-04-27 | 株式会社東芝 | Coating device, coating method, and display device manufacturing method |
WO2003061357A1 (en) * | 2001-12-27 | 2003-07-24 | New System Srl | System to form a layering of electronically-interactive material |
US7757628B2 (en) | 2001-12-27 | 2010-07-20 | New System Srl | System for depositing electronically interactive liquefied material onto a support surface |
US8196544B2 (en) | 2001-12-27 | 2012-06-12 | Cesare Fumo | System for depositing liquid material onto a substrate |
US8291854B2 (en) * | 2003-04-17 | 2012-10-23 | Translumina Gmbh | Device for applying active substances to surfaces of medical implants, in particular stents |
US7548798B2 (en) | 2003-06-20 | 2009-06-16 | Top Engineering, Co., Ltd. | Paste dispenser and method for controlling the same |
KR100673308B1 (en) * | 2005-02-01 | 2007-01-24 | 주식회사 탑 엔지니어링 | Paste Dispenser and Method for Controlling the same |
JP2007152164A (en) * | 2005-12-01 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | Coating apparatus and adjustment method for pitches of nozzles in the apparatus |
JP2009050853A (en) * | 2008-11-10 | 2009-03-12 | Shibaura Mechatronics Corp | Paste coating method and apparatus |
WO2020049858A1 (en) * | 2018-09-03 | 2020-03-12 | パナソニックIpマネジメント株式会社 | Liquid agent supply device and liquid agent supply method |
JPWO2020049858A1 (en) * | 2018-09-03 | 2021-08-12 | パナソニックIpマネジメント株式会社 | Liquid agent supply device and liquid agent supply method |
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