CN218277198U

CN218277198U - LED lamp panel production facility and LED lamp panel

Info

Publication number: CN218277198U
Application number: CN202221647216.3U
Authority: CN
Inventors: 蓝荣南; 吴春光
Original assignee: Qstech Co Ltd
Current assignee: Qstech Co Ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2023-01-10
Anticipated expiration: 2032-06-28

Abstract

The utility model belongs to the technical field of display device makes, a LED lamp plate production facility and LED lamp plate is disclosed. The LED lamp panel production equipment comprises a printing device, a glue dispensing device, a chip mounting device and a welding device which are sequentially arranged. The printing device prints solder paste on the circuit board; dispensing at a dispensing position on the circuit board by a dispensing device; the LED lamp beads are pasted on the circuit board by the paster device, and the LED lamp beads are covered with the dispensing positions and connected with the glue at the dispensing positions; the pins of the LED lamp beads are welded with the circuit board by the welding device; the dispensing device comprises a dispensing assembly, the dispensing assembly comprises a rubber cylinder, a feeding pipe and a nozzle, the nozzle is connected with the rubber cylinder through the feeding pipe, an electromagnetic valve for controlling the nozzle to be opened and closed is arranged at the nozzle, and the number of times that the nozzle is opened by the electromagnetic valve in a dispensing process is adjustable. The utility model discloses but the total colloidal mass of position department is glued to the point to accurate control spout, prevents that the colloid of solidification not before the welding from flowing to the pin department of LED lamp pearl, guarantees the reflow soldering quality.

Description

LED lamp plate production facility and LED lamp plate

Technical Field

The utility model relates to a display device makes technical field, especially relates to a LED lamp plate production facility and LED lamp plate.

Background

In the LED lamp panel, the pins of the LED lamp beads are connected with the circuit board through reflow soldering, but because the LED lamp beads are very small, the connection strength of the pins and the circuit board is lower, and the LED lamp beads positioned at the edge of the circuit board are easy to collide in the production, transportation and screen installation processes to cause lamp dropping. For solving the problem of lamp falling, the current can be glued between the bottom surface of LED lamp pearl and circuit board point to improve the joint strength of LED lamp pearl and circuit board. The bottom surface of the LED lamp beads is a side surface of the LED lamp beads facing the circuit board. The specific process flow is as follows: firstly, printing solder paste on a circuit board, then dispensing at the mounting position of the LED lamp beads on the circuit board, then pasting the LED lamp beads on the circuit board, finally, carrying out reflow soldering on the pins of the LED lamp beads and the circuit board, and simultaneously, curing the colloid by heat in the soldering process. When the LED lamp beads are connected with the circuit board in a welding mode through the pins, the LED lamp beads are further bonded with the circuit board, and therefore the connection strength of the LED lamp beads and the circuit board is improved.

Because the space between LED lamp pearl and the circuit board is less, required some glue volume is less, but the precision of some glue volume is difficult to control now for uncured colloid flows to pin department before reflow soldering, and then influences subsequent reflow soldering.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an aim at: the utility model provides a LED lamp plate production facility, the lamp is difficult for falling to the LED lamp pearl of its production, and can the accurate control of dispensing volume, and the colloid of solidifying can not flow to pin department before reflow soldering, does not influence subsequent reflow soldering.

To achieve the purpose, the embodiment of the utility model adopts the following technical proposal:

the utility model provides a LED lamp plate production facility, the LED lamp plate includes circuit board and LED lamp pearl, LED lamp plate production facility is including setting gradually:

the printing device is used for printing solder paste on the circuit board;

the glue dispensing device is used for dispensing glue at a glue dispensing position on the circuit board;

the surface mounting device is used for mounting the LED lamp beads on the circuit board, and the LED lamp beads cover the dispensing positions and are connected with the glue at the dispensing positions;

the welding device is used for welding the pins of the LED lamp beads with the circuit board;

the dispensing device comprises a dispensing assembly, the dispensing assembly comprises a rubber cylinder, a feeding pipe and a nozzle, the nozzle is connected with the rubber cylinder through the feeding pipe, the nozzle is provided with an electromagnetic valve for controlling the opening and closing of the nozzle, and the frequency of opening the nozzle by the electromagnetic valve is adjustable in one-time dispensing process.

The embodiment of the utility model provides a beneficial effect does:

the utility model provides a LED lamp plate production facility, printing device are used for printing tin cream on the circuit board; the glue dispensing device is used for dispensing glue at a glue dispensing position on the circuit board; the surface mounting device is used for mounting the LED lamp beads on the circuit board, and the LED lamp beads cover the dispensing positions and are connected with the glue body at the dispensing positions; the colloid is positioned between the bottom surface of the LED lamp bead and the circuit board, and the colloid is not cured at the moment; the welding device is used for welding the pins of the LED lamp beads with the circuit board, and the heat generated in the welding process enables the colloid to be solidified. The rubber cylinder is filled with rubber. The colloid is conveyed to the nozzle through the feeding pipe and can be sprayed to the dispensing position on the circuit board through the nozzle. The nozzle is provided with an electromagnetic valve for controlling the opening and the closing of the nozzle. When the electromagnetic valve opens the nozzle, the colloid is sprayed out from the nozzle. The frequency of opening the nozzle of the solenoid valve is adjustable in the process of dispensing once, so, under the condition that the amount of glue is sprayed out by the nozzle once and is fixed, the opening frequency of the nozzle in the process of dispensing once is controlled, so that the total amount of glue sprayed to a glue dispensing position can be accurately controlled, the glue dispensing amount is prevented from being too much, the uncured glue flows to the pin of the LED lamp bead before welding, namely, the interval between the glue and the pin of the LED lamp bead is small but not in contact, and the subsequent reflow soldering quality is ensured.

The embodiment of the utility model provides a another aim at: the utility model provides a LED lamp plate, LED lamp pearl is difficult for dropping from the circuit board, and the welding quality of pin and circuit board is high.

To achieve the purpose, the embodiment of the utility model adopts the following technical scheme:

the utility model provides a LED lamp plate adopts foretell LED lamp plate production facility to make.

The utility model discloses beneficial effect does:

the utility model provides an among the LED lamp plate, the colloid between LED lamp pearl and the circuit board can not influence the reflow soldering of pin and circuit board, and welding quality is high.

Drawings

Fig. 1 is a schematic view of an LED lamp panel provided in an embodiment of the present invention;

fig. 2 is a schematic view of a dispensing assembly according to an embodiment of the present invention;

fig. 3 is a schematic view of a nozzle for continuously spraying colloid according to an embodiment of the present invention;

fig. 4 is a schematic diagram illustrating a plurality of punctiform colloids stacked on a circuit board according to an embodiment of the present invention.

Reference numerals:

1. a rubber cylinder; 2. a feed pipe; 3. a nozzle; 4. an electromagnetic valve; 5. an optical positioning assembly; 6. an air duct; 7. a drive assembly;

100. a circuit board; 200.LED lamp beads; 210. a pin; 300. and (3) colloid.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The embodiment provides LED lamp plate production equipment for producing LED lamp plates. As shown in fig. 1, the LED lamp panel includes a circuit board 100 and a plurality of LED lamp beads 200 disposed on a side surface of the circuit board 100. The pins 210 of the LED lamp beads 200 are connected to the circuit board 100 by reflow soldering. The LED lamp panel production facility of this embodiment is including printing device, adhesive deposite device, paster device and the welding set who sets gradually. The printing apparatus is used to print solder paste on the circuit board 100. The dispensing device is used for dispensing at a dispensing position on the circuit board 100. The surface mounting device is used for mounting the LED lamp beads 200 on the circuit board 100, and the LED lamp beads 200 are covered with the dispensing positions and connected with the glue 300 at the dispensing positions; the adhesive 300 is located between the bottom surface of the LED lamp bead 200 (i.e., a side surface of the LED lamp bead 200 facing the circuit board 100) and the circuit board 100, and the adhesive 300 is not cured. The welding device is used for welding the pins 210 of the LED lamp beads 200 with the circuit board 100, and meanwhile, the heat generated in the welding process enables the colloid 300 to be solidified.

For the LED lamp panel produced by the LED lamp panel production equipment of the embodiment, the LED lamp beads 200 are welded with the circuit board 100 and are simultaneously bonded with the circuit board 100 through the colloid 300, so that the connection strength of the LED lamp beads 200 and the circuit board 100 is improved, and the lamp falling condition is reduced; because the colloid 300 is positioned on the bottom surface of the LED lamp bead 200, the colloid 300 does not affect the display effect, so that the LED lamp bead 200 which is arranged on the edge of the circuit board 100 and is easy to be out of light is only required to be dispensed with glue, the using amount of the colloid 300 is saved, and the production efficiency is improved; the colloid 300 is cured by heat generated by reflow soldering, a heating curing device and a curing procedure do not need to be specially arranged, the production cost is reduced, and the production efficiency is improved; the adhesive deposite device sets up between printing device and paster device, if the point is unqualified, can directly rework and wipe colloid 300 (can adopt the dustless cloth that dips in the alcohol to clean), later print again, the point is glued can, reduce the waste product.

It should be noted that the pin 210 is located on a side of the bottom surface of the LED lamp bead 200; there is a gap between the bottom surface of the LED lamp bead 200 and the circuit board 100, and the colloid 300 is located in this gap. After dispensing, the thickness of the uncured adhesive 300 is larger than the gap between the bottom surface of the LED lamp bead 200 and the circuit board 100; during subsequent mounting, the bottom surface of the LED lamp bead 200 is in contact with the uncured colloid 300 and extrudes the colloid 300. Illustratively, the gap between the bottom surface of the LED lamp bead 200 and the circuit board 100 is 0.1mm, and the thickness of the uncured adhesive 300 after dispensing is 0.15mm.

Further, as shown in fig. 1 and fig. 2, the dispensing device includes a dispensing assembly, the dispensing assembly includes a rubber cylinder 1, a feeding pipe 2 and a nozzle 3, and the nozzle 3 is connected to the rubber cylinder 1 through the feeding pipe 2. The glue cylinder 1 is filled with glue 300. The glue 300 is transported to the nozzle 3 through the feeding tube 2, and can be sprayed to the dispensing position on the circuit board 100 by the nozzle 3. The nozzle 3 is provided with an electromagnetic valve 4 for controlling the opening and closing of the nozzle. When the electromagnetic valve 4 opens the nozzle 3, the colloid 300 is sprayed out from the nozzle 3; when the electromagnetic valve 4 closes the nozzle 3, the colloid 300 cannot be sprayed from the nozzle 3. The times of opening the nozzle 3 by the electromagnetic valve 4 in one dispensing process can be adjusted. Under the condition that the amount of the glue 300 sprayed by the nozzle 3 once is certain, the total amount of the glue 300 sprayed to one glue dispensing position can be accurately controlled by controlling the opening times of the nozzle 3 in one glue dispensing process, so that the glue 300 which is not solidified before welding can be prevented from flowing to the pins 210 of the LED lamp beads 200 due to excessive glue dispensing amount, namely although the interval between the glue 300 and the pins 210 of the LED lamp beads 200 is small, the glue 300 and the pins 210 are not in contact, and the subsequent reflow welding quality is ensured. Illustratively, the uncured gel 300 is spaced more than 0.1mm from the leads 210 of the LED lamp bead 200.

It can be understood that the nozzle 3 with a small size (i.e. a small glue spraying amount) is selected as far as possible, and the precise control of the glue spraying amount is realized through a small number of times of spraying. Illustratively, the nozzle 3 is 0.1mm in size.

In this embodiment, the solenoid valve 4 is a piezoelectric ceramic valve. The piezoelectric ceramic valve works based on the inverse voltage effect of the piezoelectric ceramic, the piezoelectric ceramic has extremely low heat productivity in the working process, the piezoelectric ceramic can generate high-frequency vibration, the piezoelectric ceramic is connected with the firing pin, the firing pin is arranged at the nozzle 3 and can reciprocate at high speed under the action of the piezoelectric ceramic with high-frequency vibration, so that the nozzle 3 is switched on and off at high frequency, the colloid 300 is accurately output, high-precision dispensing operation is realized, and the size of the colloid 300 can be accurately controlled.

The dispensing device of this embodiment still includes the controller, and the controller is connected with piezoceramics valve electricity, and the controller can send a plurality of pulse signals to piezoceramics valve, and when piezoceramics valve received a pulse signal, nozzle 3 was opened, spouts to glue once. The piezoelectric ceramic valve generates high-frequency vibration under the control of a plurality of pulse signals so as to realize the accurate control of the dispensing amount. It can be understood that the height and size of the glue 300 at a dispensing position can be controlled by controlling the number of pulse signals sent by the controller to the piezo-ceramic valve during a dispensing process. Fig. 3 is a schematic diagram of the nozzle 3 being opened multiple times to continuously spray the dispensing point with the dispensing point 300 under the action of multiple continuous pulse signals. Fig. 4 is a schematic diagram of a plurality of point-shaped colloids 300 stacked on the circuit board 100 to form a cone-shaped colloid 300.

In an optional embodiment, the dispensing assembly further comprises an air compressor and an air duct 6, and the air compressor is connected with the glue cylinder 1 through the air duct 6. The air compressor machine is ventilated to packing element 1 through air duct 6, and colloid 300 in packing element 1 gets into feed pipe 2 under the effect of gas pressure to spout by the nozzle 3 department of opening finally.

In an alternative embodiment, the dispensing apparatus further comprises a driving assembly 7 connected to the dispensing assembly, and the driving assembly 7 is configured to drive the dispensing assembly to the dispensing station. When the dispensing assembly moves to the dispensing station, the nozzle 3 sprays the glue 300 to the dispensing station of the circuit board 100. The driving assembly 7 includes an X-direction driving member, a Y-direction driving member, and a Z-direction driving member. The X-direction driving piece is used for driving the dispensing assembly to move along the X direction. The Y-direction driving piece is used for driving the dispensing assembly to move along the Y direction. The Z-direction driving piece is used for driving the dispensing component to move along the Z direction. Exemplarily, the output end of the X-direction driving piece is connected with the dispensing assembly, the output end of the Y-direction driving piece is connected with the shell of the X-direction driving piece, and the output end of the Z-direction driving piece is connected with the shell of the Y-direction driving piece. The X-direction driving member, the Y-direction driving member, and the Z-direction driving member are motors, cylinders, or oil cylinders, and the like, and are not limited herein.

In an alternative embodiment, the dispensing apparatus further comprises an optical positioning component 5, and the optical positioning component 5 is used for identifying the dispensing position on the circuit board 100. The circuit board 100 is transferred from the printing apparatus to the dispensing apparatus by a transfer assembly (e.g. a conveyor belt), but the position of the circuit board 100 is not precise enough, and the dispensing position to be dispensed on the circuit board 100 needs to be precisely positioned by the optical positioning assembly 5. Illustratively, the optical positioning assembly 5 includes a CCD camera, which photographs the circuit board 100 and transmits the photographed image information to the controller, which analyzes the received image information to accurately identify the dispensing positions on the circuit board 100. Specifically, the controller may identify the MARK point on the circuit board 100 and use the MARK point as the dispensing position. The driving assembly 7 is electrically connected with the controller, and after the controller identifies the dispensing position, the controller sends a control signal to the driving assembly 7, so that the driving assembly 7 drives the dispensing assembly to accurately move to the dispensing position, and the nozzle 3 sprays the glue 300 to the dispensing position.

In an optional embodiment, the LED lamp panel production equipment further includes a detection device, the detection device is disposed between the dispensing device and the mounting device, and the detection device is configured to detect solder paste and the quality of the glue 300 at the dispensing position. And when the thickness and the uniformity of the solder paste, or the shape and the thickness of the colloid 300 and other factors are unqualified, reworking and repairing. Through setting up check out test set and in time discovering printing defective products and some defective products, prevent to scrap because of unable reworking after paster and the welding. Illustratively, the detection device is an SPI device.

In an alternative embodiment, the glue 300 used for dispensing is a single-component glue 300, and the whole components are uniform without stirring.

In an alternative embodiment, the glue 300 used for dispensing is liquid at room temperature, so that good fluidity can be maintained, and the nozzle 3 is prevented from being blocked during use.

This embodiment still provides an LED lamp plate, adopts foretell LED lamp plate production facility to make. This LED lamp plate includes circuit board 100 and a plurality of LED lamp pearl 200. A plurality of LED beads 200 are distributed in an array on a side of the circuit board 100. LED lamp pearl 200 is high with circuit board 100's joint strength, and difficult emergence is fallen the lamp in transportation, transport and installation. The colloid 300 is located between the bottom surface of the LED lamp bead 200 (i.e., a side surface of the LED lamp bead 200 facing the circuit board 100) and the circuit board 100, and the colloid 300 and the pins 210 of the LED lamp bead 200 are arranged at intervals, so that the colloid 300 does not affect the reflow soldering of the pins 210 and the circuit board 100, and the soldering quality is high.

In an optional embodiment, the circuit board 100 is rectangular, the LED lamp beads 200 include a first LED lamp bead and a second LED lamp bead, the first LED lamp bead is disposed along an edge of the circuit board 100, the second LED lamp bead is disposed inside the first LED lamp bead, and the colloid 300 is disposed between the first LED lamp bead and the circuit board 100. Because the lamp falls mainly to take place at the first LED lamp pearl that is located circuit board 100 edge, consequently some glue between first LED lamp pearl and circuit board 100, the optional no point glue that does not take place between second LED lamp pearl and circuit board 100, saves colloid 300 quantity to improve production efficiency. Specifically, one, two or more rows of LED beads 200 parallel to the side of the circuit board 100 may be set as the first LED beads according to the size of the circuit board 100.

In the description herein, it is to be understood that the terms "upper" and "upper" are used herein as terms of orientation or positional relationship with respect to the drawings, and are used for convenience of description and simplicity of operation, but do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

In the description herein, references to the description of "an embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art will recognize that the embodiments described in the present specification can be combined as a whole to form other embodiments as would be understood by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive step, and these embodiments are all intended to fall within the scope of the present invention.

Claims

1. The utility model provides a LED lamp plate production facility, LED lamp plate include circuit board (100) and LED lamp pearl (200), its characterized in that, LED lamp plate production facility is including setting gradually:

a printing device for printing solder paste on the circuit board (100);

the glue dispensing device is used for dispensing glue at a glue dispensing position on the circuit board (100);

the surface mounting device is used for mounting the LED lamp beads (200) on the circuit board (100), and the LED lamp beads (200) are covered with the dispensing positions and are connected with the glue bodies (300) at the dispensing positions;

the welding device is used for welding pins (210) of the LED lamp beads (200) with the circuit board (100);

the glue dispensing device comprises a glue dispensing assembly, the glue dispensing assembly comprises a glue cylinder (1), a feeding pipe (2) and a nozzle (3), the nozzle (3) is connected with the glue cylinder (1) through the feeding pipe (2), an electromagnetic valve (4) for controlling the opening and the closing of the nozzle (3) is arranged at the nozzle (3), and the number of times that the electromagnetic valve (4) is opened the nozzle (3) is adjustable in a glue dispensing process.

2. The LED lamp panel production equipment of claim 1, wherein the electromagnetic valve (4) is a piezoelectric ceramic valve.

3. The LED lamp panel production equipment of claim 2, wherein the dispensing device further comprises a controller, the controller is electrically connected with the piezoelectric ceramic valve, the controller can send a plurality of pulse signals to the piezoelectric ceramic valve, and when the piezoelectric ceramic valve receives one pulse signal, the nozzle (3) is opened.

4. The LED lamp panel production equipment according to claim 1, wherein the dispensing assembly further comprises an air compressor and an air duct (6), and the air compressor is connected with the rubber cylinder (1) through the air duct (6).

5. The LED lamp panel production equipment according to claim 1, wherein the dispensing device further comprises a driving assembly (7) connected with the dispensing assembly, the driving assembly (7) is used for driving the dispensing assembly to a dispensing station, and the driving assembly (7) comprises:

the X-direction driving piece is used for driving the dispensing assembly to move along the X direction;

the Y-direction driving piece is used for driving the dispensing assembly to move along the Y direction;

and the Z-direction driving piece is used for driving the dispensing assembly to move along the Z direction.

6. The LED lamp panel production equipment according to claim 1, wherein the dispensing device further comprises an optical positioning assembly (5), and the optical positioning assembly (5) is used for identifying the dispensing positions on the circuit board (100).

7. The LED lamp panel production equipment according to any one of claims 1 to 6, further comprising detection equipment, wherein the detection equipment is arranged between the dispensing device and the chip mounting device, and is used for detecting the quality of the solder paste and the glue (300) at the dispensing position.

8. An LED lamp panel, characterized in that, adopt the LED lamp panel production facility of any one of claims 1-7 to make.

9. The LED lamp panel according to claim 8, wherein the colloid (300) is spaced from the pins (210) of the LED lamp beads (200).

10. The LED lamp panel of claim 8 or 9, wherein the circuit board (100) is rectangular, the LED lamp beads (200) include a first LED lamp bead and a second LED lamp bead, the first LED lamp bead is disposed along an edge of the circuit board (100), the second LED lamp bead is disposed inside the first LED lamp bead, and the colloid (300) is disposed between the first LED lamp bead and the circuit board (100).