CN108213676B - Novel method for positioning and welding metal device through ceramic metallization - Google Patents
Novel method for positioning and welding metal device through ceramic metallization Download PDFInfo
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- CN108213676B CN108213676B CN201810069045.2A CN201810069045A CN108213676B CN 108213676 B CN108213676 B CN 108213676B CN 201810069045 A CN201810069045 A CN 201810069045A CN 108213676 B CN108213676 B CN 108213676B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/02—Pressure butt welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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Abstract
The invention provides a novel method for positioning and welding a metal device by ceramic metallization, which comprises the following steps: the ceramic metalized product is arranged on the lapping platform; the negative pressure movable suction head sucks out the metal device and moves to a first image acquisition area of the CCD, and the first image acquisition unit acquires an image of a to-be-welded surface of the metal device; the CCD second image acquisition unit is used for acquiring images of a metal coating region of the ceramic metalized product; processing data by using CCD equipment, moving a metal device to the position above a metal coating region by using a negative pressure movable suction head, and enabling the surface to be welded of the metal device to correspond to the metal coating region by position correction; the negative pressure movable suction head moves downwards to enable the metal device to be in extrusion contact with the metal coating area; moving the welding head to the position above the metal device; the welding head moves downwards to enable the metal device to be in extrusion contact with the metal coating area; welding; cooling; the negative pressure movable suction head and the welding head are reset respectively. The invention realizes the accurate and firm connection of the metal device on the ceramic metalized product and has simple operation.
Description
Technical Field
The invention belongs to the technical field of processing and manufacturing of electronic components, particularly relates to a novel method for positioning and welding a metal device by ceramic metallization, and particularly relates to a novel production technology for realizing fixed-point welding of a metal part with precise size by CCD (charge coupled device) image positioning and instantaneous resistance welding.
Background
With the development of communication and manufacturing technologies, ceramic metalized products are developed from military fields to various fields such as civil frequency standards or time scales. Ceramic metalized products are mainly used for LED heat dissipation substrates, ceramic packages, electronic circuit substrates and the like due to excellent erosion resistance, dielectric property and proper thermal expansion coefficient.
Because the surface structure of the ceramic material is different from that of the metal material, the metal and the ceramic are difficult to wet and cannot act with the ceramic to form firm bonding, the sealing of the ceramic and the metal device is realized by firmly adhering a layer of metal film on the surface of the ceramic and connecting the metal film and the metal device by the principle that the metal film is easy to wet.
In order to adapt to smaller and more miniaturized products, the size of ceramic metalized products is continuously reduced, and the ceramic metalized products are gradually developed into precise and miniaturized products. Therefore, the requirements for the positioning accuracy and the connection technology of the positioning metal device are higher and higher on the ceramic metallization product.
In ceramic metallization products produced at home and abroad at present, two modes of fixing through a die or gluing and fixing are mainly adopted for fixing precise metal devices. Among them, the die-fixing metal device has the following problems: (1) the ceramic plate is required to be produced with stronger stability, the ceramic plate is required to have uniform size after being sintered, and the smaller the size of a metal device is, the higher the requirement on the matching size of the die and the ceramic plate is, so as to ensure that the metal device in the die can correspond to the metal coating on the ceramic plate; (2) the requirement on the precision of the die is high, and the manufacturing cost of the die is high; (3) the product has limitations, one die can only be applied to ceramic metalized products of a size corresponding to the die. The adhesive fixing method has the following problems: (1) the requirement on the performance of the glue is high; (2) the adhesive fixation is easily affected by the atmosphere temperature and the like; (3) easily causes influence on the subsequent process and the product performance.
At present, a process method for connecting a ceramic metalized product with a precise metal device, which is convenient, rapid, widely applicable and low in cost, does not exist at home and abroad.
Disclosure of Invention
The invention aims to provide a novel method for positioning and welding a metal device in ceramic metallization, which can realize accurate and firm connection and fixation of the precise metal device on a ceramic metallization product, is simple to operate and does not influence the subsequent treatment of the ceramic metallization product.
The invention adopts the following technical scheme: a novel method for positioning and welding metal devices by ceramic metallization comprises the following steps:
1) fixing the ceramic metalized product on a lapping table;
2) the metal device is sucked out of the feeding groove by the negative pressure movable suction head, the left side part of the upper surface of the metal device is in contact with the surface of the negative pressure movable suction head, and the negative pressure movable suction head can move under the action of the first movement supporting arm;
3) the metal device is moved to a first image acquisition area of the CCD equipment by the negative pressure movable suction head, a first image acquisition unit of the CCD equipment acquires images of a surface to be welded of the metal device, and a layer of uniform solder is arranged on the surface to be welded of the metal device;
4) the upper surface of the ceramic metalized product is provided with a metal coating area, and a second image acquisition unit of the CCD equipment is used for acquiring images of the metal coating area on the ceramic metalized product;
5) the CCD equipment carries out matching processing on the acquired image data of the surface to be welded of the metal device and the image data of the metal coating area, the metal device is moved to the upper part of the metal coating area of the ceramic metalized product by the negative pressure movable suction head, and the position of the metal device is corrected by moving the negative pressure movable suction head and/or the position of the ceramic metalized product is corrected by moving the lapping platform, so that the position of the surface to be welded of the metal device and the position of the metal coating area are matched and corresponding up and down;
6) the negative pressure movable suction head moves downwards to press the metal device downwards and fasten the metal device on the surface of the metal coating area, so that the surface to be welded of the metal device is in extrusion contact with the metal coating area;
7) the welding head can move under the action of a second movement supporting arm, and the second movement supporting arm moves the welding head to the upper part of the right side part of the upper surface of the metal device;
8) the welding head moves downwards, presses and is fastened on the surface of the right side part of the upper surface of the metal device, and the surface to be welded of the metal device is in extrusion contact with the metal coating area at the position of the welding head;
9) applying voltage on the welding head to melt the solder on the surface to be welded of the metal device;
10) cooling for a specific time, and solidifying the solder to weld the metal device on the metal coating region so as to realize the fixed connection of the metal device and the ceramic metalized product;
11) and (3) releasing the negative pressure movable suction head in vacuum, separating the negative pressure movable suction head from the metal device, and respectively restoring the negative pressure movable suction head and the welding head to the original positions.
The metal device has a regular structure or an irregular structure, and the surface to be welded of the metal device and the welding surface of the metal coating region are respectively a plane.
The welding heads comprise a positive welding head and a negative welding head, and in the step 9), the current waveform used for welding is a pulse waveform which slowly rises and slowly falls.
The welding process of the step 8) and the step 9) comprises a welding head pressing stage, a welding delaying stage and a welding stage.
In the step 6), when the metal device is in contact with the ceramic metalized product, the pressing pressure of the negative pressure movable suction head for pressing the metal device downwards is a first pressing pressure, and in the step 8), the pressing pressure of the welding head for pressing the metal device downwards is a second pressing pressure, wherein the first pressing pressure is not less than the second pressing pressure.
In the step 9), in a soldering stage, the solder at a position corresponding to the position of the soldering tip is melted on the surface to be soldered.
The time of the welding head pressing stage is 300-500 ms, the time of the welding delay stage is 0-150 ms, and the time of the welding stage is 30-100 ms.
In the step 6), the first pressing pressure is 0.01 to 0.05MPa, and in the step 8), the second pressing pressure is 0.01 to 0.05 MPa.
The vacuum degree of the negative pressure movable suction head in the process of adsorbing the metal device and driving the metal device to move is-200 to-60 KPa.
The distance between the positive welding head and the negative welding head is 0.05mm, the areas of the positive welding head and the negative welding head are 1 × 0.4mm respectively, and the electrifying voltage of the welding heads is 0.5-3V.
The invention has the following beneficial effects:
(1) the CCD positioning and resistance welding process is adopted to realize the accurate and reliable fixed connection of the precise metal device and the ceramic metalized product;
(2) the application range is wide, and the device can be suitable for connecting and fixing various precise metal devices and ceramic metalized products;
(3) the process has the advantages of high welding speed, low cost, no pollution, high positioning precision and no influence on the subsequent processing of ceramic metalized products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the structure of the present invention after the surface to be soldered is matched with the position of the metal coating on the ceramic metallized product;
fig. 3 is a schematic diagram of the welding stage of the present invention.
Detailed Description
In order to make the technical purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention are further described below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 3, the present invention utilizes the CCD positioning technology and the principle of resistance welding technology to weld a metal device 1 on a ceramic metalized product 2, the lower surface of the metal device 1 is a surface to be welded, the surface to be welded has uniform solder, the upper surface of the ceramic metalized product 2 has a metal coating region 3, and the device involved in the welding production process includes: a mounting table 4, a CCD device, a suction head 5 and a welding head 6.
Wherein, the carrying platform 4 can horizontally move under the action of the controller, thereby correcting the position of the ceramic metalized product; the CCD equipment comprises a first image acquisition unit 7 and a second image acquisition unit 8, wherein the first image acquisition unit 7 is used for acquiring image information of a surface to be welded of the metal device 1, and the second image acquisition unit 8 is used for acquiring image information of the metal coating region 3; the suction head 5 is connected to a first moving supporting arm 51, and the first moving supporting arm 51 can drive the suction head 5 to move; the welding head 6 is connected to a second movable supporting arm 61, the second movable supporting arm 61 can drive the welding head 6 to move, and the welding head 6 comprises a positive welding head 62 and a negative welding head 63.
The novel method for positioning and welding the metal device by ceramic metallization comprises the following steps:
1) fixing the ceramic metalized product 2 on the lapping table 4;
2) the negative pressure movable suction head 5 sucks the metal device 1 from the feeding groove, tightly sucks the metal device 1 on the negative pressure movable suction head 5, the left side part 11 of the upper surface of the metal device 1 is contacted with the surface of the negative pressure movable suction head 5, and the negative pressure movable suction head 5 can move under the action of the first movement supporting arm 51;
3) the metal device 1 is moved to a first image acquisition area of a CCD (charge coupled device) device by a negative pressure movable suction head 5, a first image acquisition unit 7 (such as a CCD first camera) of the CCD device acquires images of a surface to be welded of the metal device 1 (optical image acquisition in the embodiment), the range of a light reflection area of the surface to be welded of the metal device 1 is identified by the first image acquisition unit 7 according to the light reflection rate of the surface to be welded of the metal device 1, the appearance shape and the size of the surface to be welded of the metal device 1 are determined, the central coordinate of the surface to be welded of the metal device 1 is determined, and a layer of uniform solder is arranged on the surface to be welded of the metal device 1;
4) the upper surface of the ceramic metalized product 2 is provided with a metal coating area 3, a second image acquisition unit 8 (such as a CCD second camera) of the CCD device performs image acquisition (optical image acquisition, metal coating photosensitive area search in this embodiment) on the metal coating area 3 on the ceramic metalized product 2, the second image acquisition unit 8 identifies the range of the light reflection area of the metal coating area 3 according to the light reflection rate of the metal coating area 3, determines the appearance shape and size of the metal coating area 3, and determines the center coordinate of the metal coating area 3;
5) the CCD equipment carries out matching processing on the collected image data of the surface to be welded of the metal device 1 and the image data of the metal coating area 3, on one hand, the matching processing is carried out on the appearance shape and the size of the surface to be welded of the metal device 1 and the appearance shape and the size of the metal coating area 3, on the other hand, the matching processing is carried out on the central coordinate of the surface to be welded of the metal device 1 and the central coordinate of the metal coating area 3, then, the control device controls the negative pressure movable suction head 5 to move the metal device 1 to the upper part of the metal coating area 3 of the ceramic metalized product 2 according to the data, the position of the metal device 1 is corrected by moving the negative pressure movable suction head 5 and/or the position of the ceramic metalized product 2 is corrected by moving the lapping carrier 4, so that the position of the surface to be welded of the metal device 1 is matched and corresponds to the position of the metal coating region 3 up and down;
6) the negative pressure movable suction head 5 moves downwards to press the metal device 1 downwards, and the metal device 1 is fastened on the surface of the metal coating area 3, so that the surface to be welded of the metal device 1 is in extrusion contact with the metal coating area 3;
7) the welding head 6 can move under the action of the second movement supporting arm 61, the second movement supporting arm 61 moves the welding head 6 to the position above the right side part 12 of the upper surface of the metal device 1, the right side part 12 of the upper surface of the metal device is opposite to the left side part 11 of the upper surface, and the right side part 12 of the upper surface of the metal device is not overlapped with the left side part 11 of the upper surface;
8) the welding head 6 moves downwards, presses and fastens on the surface of the right side part 12 of the upper surface of the metal device, and enables the surface to be welded of the metal device 1 to be in pressing contact with the metal coating area 3 at the position of the welding head 6;
9) applying voltage on the welding head 6 to melt the solder on the surface to be welded of the metal device 1;
10) cooling for a specific time, and solidifying the solder to weld the metal device 1 on the metal coating region 3, so as to realize the fixed connection of the metal device 1 and the ceramic metalized product 2;
11) the vacuum of the negative pressure movable suction head 5 is released, the negative pressure movable suction head 5 is separated from the metal device 1, and the negative pressure movable suction head 5 and the welding head 6 are respectively restored.
In this embodiment, the metal device 1 may have a regular structure or an irregular structure, but both the surface to be welded of the metal device 1 and the welding surface of the metal plating region 3 need to be planes, so as to ensure that the surface to be welded of the metal device 1 and the welding surface of the metal plating region 3 are in full contact, thereby achieving a welding effect.
The metal device 1 may have various shapes such as a ring shape, a square shape, and a circle shape, and the metal plating region 3 may have various shapes such as a ring shape, a square shape, and a circle shape.
The CCD equipment carries out matching processing on the acquired image data of the surface to be welded of the metal device 1 and the image data of the metal coating area 3, the automation equipment carries out correction matching on the position of the metal device 1 and the position of the ceramic metalized product 2, the carrying platform 4 automatically adjusts the position in the horizontal direction to adjust the position of the ceramic metalized product 2, so that the position of the metal coating area 3 is adjusted, the metal device 1 is moved to the position above the metal coating area 3 by the negative pressure movable suction head 5, and the negative pressure movable suction head 5 can also rotate clockwise or anticlockwise to correct the position of the metal device 1 as shown in figure 2, so that the position of the metal device 1 is vertically matched with the position of the metal coating area 3. After the position matching, the negative pressure movable suction head 5 is pressed downwards, so that the metal device 1 is contacted with the metal coating area 3 at a certain pressure.
In this embodiment, the current waveform used for welding is a pulse waveform that gradually rises and falls, so as to ensure that the performance of the metal device product is not affected by welding and that the welding is free from crack embrittlement.
The welding process of the step 8) and the step 9) comprises a welding head pressing stage, a welding delaying stage and a welding stage. As shown in fig. 3, after the metal device 1 is pressed down by the welding head 6 and the metal device 1 is contacted with the metal coating region 3 at a certain pressure, and after a certain time delay, the welding is performed, wherein the welding delay can ensure that the metal device 1 is sufficiently contacted with the metal coating region 3, so that the pressure between the surface to be welded of the metal device 1 and the metal coating region 3 is uniformly distributed, and then the welding is performed, thereby ensuring the smooth completion of the welding and the welding quality.
When the metal device 1 is in contact with the ceramic metalized product 2, the pressing pressure of the negative pressure movable suction head 5 for pressing the metal device 1 downwards is a first pressing pressure, the pressing pressure of the welding head 6 in the pressing stage and the pressing pressure of the welding head 6 for pressing the metal device 1 downwards is a second pressing pressure, and the first pressing pressure is not less than the second pressing pressure.
The first pressing pressure and the second pressing pressure can be set to different values according to the hardness of different metal devices, and the second pressing pressure is designed to be small so as to ensure that the metal devices are not damaged due to high temperature and the like generated in instant welding.
In the welding stage, the welding head 6 is electrified, the current flow path is the positive welding head 62, the metal device 1 and the negative welding head 63, the metal device 1 has a resistor, and the instantaneous high temperature generated by the resistor when the current flows enables the solder which is easier to melt on the bottom surface of the metal device 1 to melt. The movable welding head instantly presses the molten solder under high voltage to realize the welding of the precise metal device.
In this embodiment, in the step 9), in the welding stage, the solder at the position corresponding to the position of the soldering tip is melted on the surface to be welded. And after the solder on the surface to be welded near the position of the welding head is melted and solidified, the welding between the surface to be welded of the metal device 1 and the metal coating region 3 is completed, and the connection and fixation of the metal device 1 and the ceramic metalized product 2 are realized.
In this embodiment, the area of the metal plating layer region 3 is larger than the area of the surface to be welded of the metal device 1, so as to ensure that the surface to be welded of the metal device 1 can be in full contact with the metal plating layer region 3.
In the embodiment, the time of the welding head pressing stage is 300-500 ms, the time of the welding delay stage is 0-150 ms, and the time of the welding stage is 30-100 ms.
In this embodiment, the first pressing pressure is 0.01 to 0.05MPa, and the second pressing pressure is 0.01 to 0.05 MPa.
In the embodiment, the vacuum degree of the negative pressure movable suction head in the processes of adsorbing the metal device and driving the metal device to move is-200 to-60 KPa, so that the metal device 1 is ensured not to deviate in the process of being sucked by the negative pressure movable suction head 5 and the process of moving the metal device 1, and the stability of the position of the metal device 1 on the negative pressure movable suction head 5 is ensured. The vacuum level can be set according to the shape and quality of the metal component 1.
In the embodiment, the distance between the positive welding head and the negative welding head is 0.05mm, and the electrifying voltage of the welding heads is 0.5-3V.
In the embodiment, the connecting area between the metal coating area of the ceramic metalized product and the surface to be welded of the metal device is less than 3.5 × 3.0.0 mm, the area of the metal coating area is less than 3.0 × 2.2.2 mm, the size of the metal device can be less than 2.5 × 2.0.0 mm, the welding area of resistance welding reaches 1.0 × 1.0.0 mm, the metal device with the side length range of 1.0-5.0 mm and the thickness range of 0.1-2.0 mm can be welded, and the welding of the precise metal device, the small metal device and the ceramic metalized product is realized.
The first embodiment is as follows:
the ceramic metalized product (3.0 × 2.2.2 mm) distributed with a square metal coating area is placed on a lapping table and fixed, the vacuum pump pressure of a negative pressure movable suction head sucking a square metal device (2.8 × 2.0.2.0 2.0 × 0.15.15 mm) is-85 KPa (determined by the shape and quality of the metal device), after image acquisition and matching positioning are carried out by a CCD (charge coupled device), the product is placed for 600ms under the downward pressure of the negative pressure movable suction head, the product is pressed down by a welding head for 100ms after the negative pressure movable suction head is pressed down, after 50ms welding delay, the welding head is electrified with 1.5V high pressure, welding is carried out for 50ms, then 100ms welding flux is solidified, finally, the negative pressure movable suction head and the welding head are lifted away from the metal device, and welding and fixing is finished.
The process takes 2.4s from the material taking to the end of the installation and fixation of the metal device, and the fixation strength reaches 0.07 MPa.
The second embodiment is as follows:
as shown in fig. 2 and fig. 3, a ceramic metalized product (2.0 × 1.8.8 mm) distributed with a circular metal coating area is placed on a lapping table and fixed, the vacuum pump pressure of a negative pressure movable suction head sucking a metal circular device (with the inner diameter of 1.0mm, the outer diameter of 1.4mm and the height of 0.15 mm) is-55 KPa, after image acquisition and matching positioning of a CCD device, the product is placed under the negative pressure movable suction head for 600ms, the negative pressure movable suction head is pressed down by a welding head for 100ms after being pressed down, after 50ms welding delay, the welding head (comprising an anode welding head 62 and a cathode welding head 63) is energized with 1.0V high pressure, welding is carried out for 35ms, then 100ms welding flux is solidified, and finally, the negative pressure movable suction head and the metal device are lifted off, and welding and fixing is finished.
The process takes 1.3s from the material taking to the end of the installation and fixation of the metal device, and the fixation strength reaches 0.1 MPa.
In the invention, the resistance welding technology is innovatively used in the welding process of the ceramic metallization layer and the metal device, and the ceramic metallization layer is more conveniently and directly welded on the ceramic metallization layer in the process of placing the precise metal device, so that the cost is lower, and the fixing strength is stronger.
According to the invention, the welding of the precise metal device and the ceramic metalized product is realized, and the technology for fixedly connecting the metal device is further improved. By introducing the resistance welding technology, the optimized combination, the reasonable positioning and the accurate control of the running time between the devices are controlled in the connection process, the reasonable welding voltage, time and welding pressure are adjusted, and the novel ceramic metallization welding process is designed and prepared.
In the invention, the CCD positioning and resistance welding process which is relatively cheap and easy to operate is selected as the fixing of the precise metal device, so that the production cost of the material is obviously reduced compared with the fixed welding for manufacturing the consumable graphite mould, and the method is more convenient and pollution-free compared with the dispensing and fixing. The process does not need a die for support, the shearing strength of the welded product is high, the metal device is stable and is not easy to deviate, and the subsequent processing of the ceramic metalized product is not influenced.
Compared with the current domestic and foreign technologies, the product prepared by the technology of the invention can be applied to various ceramic metalized surface welding products, and has the advantages of high welding speed, low cost, no pollution, high positioning precision and the like.
Finally, it should be noted that: the above embodiments are merely illustrative and not restrictive of the technical solutions of the present invention, and any equivalent substitutions and modifications or partial substitutions made without departing from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A novel method for positioning and welding metal devices by ceramic metallization is characterized by comprising the following steps:
1) fixing the ceramic metalized product on a lapping table;
2) the metal device is sucked out of the feeding groove by the negative pressure movable suction head, the left side part of the upper surface of the metal device is in contact with the surface of the negative pressure movable suction head, and the negative pressure movable suction head can move under the action of the first movement supporting arm;
3) the metal device is moved to a first image acquisition area of the CCD equipment by the negative pressure movable suction head, a first image acquisition unit of the CCD equipment acquires images of a surface to be welded of the metal device, and a layer of uniform solder is arranged on the surface to be welded of the metal device;
4) the upper surface of the ceramic metalized product is provided with a metal coating area, and a second image acquisition unit of the CCD equipment is used for acquiring images of the metal coating area on the ceramic metalized product;
5) the CCD equipment carries out matching processing on the acquired image data of the surface to be welded of the metal device and the image data of the metal coating area, the metal device is moved to the upper part of the metal coating area of the ceramic metalized product by the negative pressure movable suction head, and the position of the metal device is corrected by moving the negative pressure movable suction head and/or the position of the ceramic metalized product is corrected by moving the lapping platform, so that the position of the surface to be welded of the metal device and the position of the metal coating area are matched and corresponding up and down;
6) the negative pressure movable suction head moves downwards to press the metal device downwards and fasten the metal device on the surface of the metal coating area, so that the surface to be welded of the metal device is in extrusion contact with the metal coating area;
7) the welding head can move under the action of a second movement supporting arm, and the second movement supporting arm moves the welding head to the upper part of the right side part of the upper surface of the metal device;
8) the welding head moves downwards, presses and is fastened on the surface of the right side part of the upper surface of the metal device, and the surface to be welded of the metal device is in extrusion contact with the metal coating area at the position of the welding head;
9) applying voltage on the welding head to melt the solder on the surface to be welded of the metal device;
10) cooling for a specific time, and solidifying the solder to weld the metal device on the metal coating region so as to realize the fixed connection of the metal device and the ceramic metalized product;
11) and (3) releasing the negative pressure movable suction head in vacuum, separating the negative pressure movable suction head from the metal device, and respectively restoring the negative pressure movable suction head and the welding head to the original positions.
2. The method of claim 1, wherein the metal device has a regular structure or an irregular structure, and the surface to be welded of the metal device and the surface to be welded of the metal plating layer are both planar.
3. The method for ceramic metallization positioning welding of metal devices as claimed in claim 2, wherein said welding head comprises a positive welding head and a negative welding head, and in said step 9), the current waveform used for welding is a pulse waveform with gradual rising and gradual falling.
4. The method for the ceramic metallization positioning welding of the metal device according to the claim 3, characterized in that the welding process of the step 8) and the step 9) comprises a welding head pressing stage, a welding delaying stage and a welding stage.
5. The method for the ceramic metallization positioning welding of the metal device according to the claim 4, characterized in that, in the step 6), the pressing pressure of the negative pressure movable suction head to the metal device is the first pressing pressure when the metal device is contacted with the ceramic metallization product, and in the step 8), the pressing pressure of the welding head to the metal device is the second pressing pressure when the welding head is pressed down, and the first pressing pressure is not less than the second pressing pressure.
6. The method for positioning and welding metal devices through ceramic metallization according to claim 5, wherein in the step 9), in the welding stage, the solder at the position corresponding to the position of the welding head on the surface to be welded is melted.
7. The method for the ceramic metallization positioning welding of the metal device as claimed in claim 4, wherein the time of the welding head pressing stage is 300-500 ms, the time of the welding delay stage is 0-150 ms, and the time of the welding stage is 30-100 ms.
8. The method for novel ceramic metallized tack welding of metal devices according to claim 5, wherein in step 6) the first pressure is 0.01 to 0.05MPa and in step 8) the second pressure is 0.01 to 0.05 MPa.
9. The method for novel ceramic metalized positioning welding of metal devices as claimed in any one of claims 3 to 8, wherein the vacuum degree of the negative pressure movable suction head during the process of adsorbing the metal devices and driving the metal devices to move is-200 to-60 KPa.
10. The method for the ceramic metallization positioning welding of the metal device as claimed in claim 9, wherein the distance between the positive welding head and the negative welding head is 0.05mm, the area of the positive welding head and the area of the negative welding head are both 1 mm × 0.4.4 mm, and the energizing voltage of the positive welding head and the negative welding head is 0.5V-3V.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810069045.2A CN108213676B (en) | 2018-01-24 | 2018-01-24 | Novel method for positioning and welding metal device through ceramic metallization |
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| CN201810069045.2A CN108213676B (en) | 2018-01-24 | 2018-01-24 | Novel method for positioning and welding metal device through ceramic metallization |
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| CN108213676A CN108213676A (en) | 2018-06-29 |
| CN108213676B true CN108213676B (en) | 2020-06-26 |
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| CN113828954B (en) * | 2021-10-22 | 2022-11-01 | 中国科学院空天信息创新研究院 | Metal-ceramic sealing method and metal-ceramic composite structure |
| CN114799689B (en) * | 2022-04-29 | 2023-02-14 | 中国科学院西安光学精密机械研究所 | Microsphere adsorption positioning device and method for laser processing |
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Address after: 452470 Dengfeng industrial cluster, Zhengzhou City, Henan Province Patentee after: China Gold Technology (Henan) Co.,Ltd. Address before: 452470 Dengfeng industrial cluster, Zhengzhou City, Henan Province Patentee before: ZHENGZHOU DENGFENG POWER GALAXY TECHNOLOGY Co.,Ltd. |