CN117812845B - Packaging method of passive component - Google Patents
Packaging method of passive component Download PDFInfo
- Publication number
- CN117812845B CN117812845B CN202410224295.4A CN202410224295A CN117812845B CN 117812845 B CN117812845 B CN 117812845B CN 202410224295 A CN202410224295 A CN 202410224295A CN 117812845 B CN117812845 B CN 117812845B
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- CN
- China
- Prior art keywords
- packaged
- passive component
- plastic
- passive
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052737 gold Inorganic materials 0.000 claims abstract description 36
- 239000010931 gold Substances 0.000 claims abstract description 36
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a packaging method of a passive component, which comprises the following steps: fixing a plurality of passive components to be packaged on a carrier plate; performing plastic packaging on each passive component to be packaged to form a plastic sealing plate for coating each passive component to be packaged; disconnecting each passive component to be packaged from the carrier plate; gold plating is carried out on the surface of the terminal of each passive component to be packaged, which is not covered by the plastic sealing plate; cutting each to-be-packaged passive component subjected to plastic packaging and gold plating to obtain a plurality of independent to-be-packaged passive components subjected to plastic packaging and gold plating; taking out the independent plastic-packaged and gold-plated passive components to be packaged and fixing the passive components on the substrate; and welding leads on the terminals of the to-be-packaged passive components which are independently packaged in a plastic mode and plated with gold, so that the terminals are connected to pins on the substrate through the leads. According to the packaging method of the passive component, the terminal is led out to the pin of the substrate through the lead wire welded on the gold-plated terminal, the lead-out space is adjustable, and the packaging is more convenient.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a packaging method of a passive component.
Background
The passive component is a common component in the electronic device, and the terminals of the passive component are usually a tin terminal and a copper terminal, and the tin and the copper cannot be welded with a lead because of poor metal adhesion, so that when the passive component is packaged, the lead-out area of the terminal is limited, and the packaging is inconvenient.
Disclosure of Invention
The invention aims to provide a packaging method of a passive component, which is characterized in that gold plating is carried out on a terminal of the passive component, so that the terminal after gold plating is led out through a welded lead wire, and the lead-out space is adjustable.
Based on the above object, the present invention provides a method for packaging a passive component, including: the packaging method of the passive component is characterized by comprising the following steps of:
S100: fixing a plurality of passive components to be packaged on a carrier plate;
S200: carrying out plastic packaging on each to-be-packaged passive component fixed on the carrier plate to form a plastic sealing plate for coating each to-be-packaged passive component;
s300: disconnecting each passive component to be packaged from the carrier plate to obtain each passive component to be packaged after being subjected to plastic package by the plastic sealing plate;
S400: gold plating is carried out on the surface of the terminal of each passive component to be packaged from the surface which is not covered by the plastic sealing plate, so that each passive component to be packaged after plastic sealing and gold plating is obtained;
S500: cutting the plastic-packaged and gold-plated passive components to separate the plastic-packaged and gold-plated passive components to obtain a plurality of independent plastic-packaged and gold-plated passive components;
S600: taking out the independent plastic-packaged and gold-plated passive components to be packaged and fixing the passive components on the substrate;
S700: and welding leads on the terminals of the to-be-packaged passive components which are independently packaged in a plastic mode and plated with gold, so that the terminals are connected to pins on the substrate through the leads.
Further, a plurality of positioning structures are arranged on the carrier plate so as to position each passive component to be packaged.
Further, the carrier plate is circular.
Further, the carrier plate is a steel plate or a copper plate.
Further, the step S100 specifically includes:
s110: sticking removable glue on the carrier plate;
s120: and sequentially adhering each passive component to be packaged on the removable adhesive.
Further, the step S300 specifically includes:
and heating the removable glue to melt the removable glue so as to disconnect each passive component to be packaged from the carrier plate, thereby obtaining each passive component to be packaged after plastic packaging.
Further, the step S400 specifically includes:
placing the passive components to be packaged after plastic packaging into electroplating liquid;
and plating gold on the surfaces of the terminals of the passive components to be packaged by an electroless plating method.
Further, the step S500 specifically includes:
Attaching each passive component to be packaged after plastic packaging and gold plating to a standard wafer ring with a blue film;
and cutting the standard wafer ring by using scribing equipment so as to separate each passive component to be packaged after plastic packaging and gold plating.
Further, the blue film is an organic matter having viscosity.
Further, the step S600 specifically includes:
Soldering a material on the substrate;
taking out the independent plastic-packaged and gold-plated passive component to be packaged and placing a terminal of the passive component on the welding material;
Through high temperature baking or normal temperature curing.
According to the packaging method of the passive component, the terminal of the passive component to be packaged is plated with gold, so that the terminal is led out to the pin of the substrate through the lead wire welded on the terminal, the lead-out space is adjustable, and the packaging is more convenient; the plastic-packaged passive components to be packaged are subjected to full-plate gold plating, so that mass production can be realized, and the cost is reduced; the carrier plate separated from each passive component to be packaged after plastic packaging can be recycled, so that the cost is saved.
Drawings
FIG. 1 is a method of packaging a passive component according to an embodiment of the invention;
FIG. 2 is a cross-sectional view of a plurality of passive components to be packaged according to an embodiment of the invention after being mounted on a carrier;
Fig. 3 is a schematic structural diagram of a packaged passive component fixed on a carrier board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a carrier board according to an embodiment of the present invention after the carrier board is disconnected from each passive component to be packaged.
Detailed Description
Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, an embodiment of the present invention provides a method for packaging a passive component, including the following steps:
s100: and fixing a plurality of passive components to be packaged on the carrier plate.
In some embodiments, the passive component may be a mounted component, and further may be a resistor, a capacitor, an inductor, or a crystal oscillator. The passive component has two terminals, both of which are copper terminals or tin terminals.
In some embodiments, the carrier plate may be a circular plate, for example, a 6-inch, 8-inch or 12-inch circular plate, so as to be matched with an existing chip mounter, and facilitate chip mounting by using the chip mounter.
In some embodiments, the carrier plate may be a metal plate, such as a steel plate or a copper plate, for recycling.
In some embodiments, a plurality of positioning structures (such as positioning grooves) may be disposed on the carrier, so as to position each passive component to be packaged, so that each passive component to be packaged is regularly arranged on the carrier, and the influence of too small interval between each passive components to be packaged on the subsequent cutting process is avoided.
In some embodiments, each passive component to be packaged may be adhered to the carrier by a removable adhesive (e.g., a double sided adhesive) so as to facilitate subsequent removal and recovery of the carrier.
In some embodiments, step S100 specifically includes:
S110: sticking removable glue on the carrier plate;
s120: and sequentially adhering the passive components to be packaged on the removable adhesive (for example, sequentially adhering the passive components to be packaged on the removable adhesive through a chip mounter).
As shown in fig. 2, the removable adhesive 20 is adhered to the carrier 10, and the passive components 30 to be packaged are adhered to the removable adhesive 20 and are arranged at intervals.
S200: the passive components 30 to be packaged, which are fixed on the carrier plate 10, are subjected to plastic packaging to form a plastic sealing plate for coating the passive components 30 to be packaged.
In some embodiments, the carrier 10 with the passive components 30 to be packaged secured may be placed in a mold and then molten plastic injected to complete the molding. As shown in fig. 3, after plastic packaging, a plastic sealing plate 40 is formed, and the plastic sealing plate 40 wraps each passive component 30 to be packaged from a side far away from the carrier plate 10 and is fixed with each passive component 30 to be packaged. The plastic sealing plate 40 has the same shape as the carrier plate 10, and may be circular, for example.
S300: and disconnecting each passive component 30 to be packaged from the carrier plate 10 to obtain each passive component 30 to be packaged, which is covered by the plastic sealing plate 40, namely each passive component 30 to be packaged after being plastic sealed by the plastic sealing plate.
In some embodiments, the removable glue 20 may be heated by light or other means to melt the removable glue 20 and disconnect each passive component 30 to be packaged from the carrier plate 10.
As shown in fig. 4, after the carrier 10 and each passive component 30 to be packaged are disconnected, each passive component 30 to be packaged is fixed to the plastic sealing plate 40 and forms a whole, that is, each passive component 30 to be packaged after plastic packaging, one surface (hereinafter referred to as a first surface) of each passive component 30 to be packaged is covered by the plastic sealing plate 40, and the other surface (the surface connected to the carrier 10, hereinafter referred to as a second surface) is not covered, but is exposed, so that the exposed terminals are plated with gold. After detachment, the carrier 10 can be recycled for fixing the next batch of passive components to be packaged, and each passive component to be packaged 30 after plastic packaging is used for the subsequent process.
S400: the surface of the terminal of each passive component 30 to be packaged, which is not covered by the plastic cover plate 40, is plated with gold, so as to obtain each passive component 30 to be packaged after plastic packaging and gold plating.
In some embodiments, electroless plating may be used to plate NiAu (electroless nickel gold) or NiPdAu (nickel palladium gold) on the terminal surfaces of each passive component 30 to be packaged to achieve gold plating. Specifically, the whole body formed by the passive components 30 to be packaged after plastic packaging can be placed into an electroplating solution, and then gold plating is performed on the surfaces of the terminals of the passive components 30 to be packaged by an electroless plating method. For example, the surface of the non-plastic package is faced upwards, and then each passive component 30 to be packaged after plastic package is put into electroplating solution, and the concentration of the solution is controlled to be 0.03um, so that the lead wire is conveniently welded. Because each passive component 30 to be packaged and the plastic sealing plate 40 are fixed together and form a whole, the whole plate gold plating can be carried out on each passive component 30 to be packaged after plastic packaging, batch gold plating is realized, and the cost is reduced.
S500: and cutting the plastic-packaged and gold-plated passive components 30 to separate the plastic-packaged and gold-plated passive components 30 from each other, so as to obtain a plurality of independent plastic-packaged and gold-plated passive components 30.
In some embodiments, step S500 specifically includes:
And pasting each passive component 30 to be packaged after plastic packaging and gold plating on a standard piece ring with a blue film, and then cutting the standard piece ring by using scribing equipment to separate each passive component 30 to be packaged after plastic packaging and gold plating.
When the plastic-packaged and gold-plated passive components 30 to be packaged are attached to the standard chip ring, the first surface (i.e., the plastic-packaged surface) of the passive components is contacted with the standard chip ring.
The standard wafer ring is a wafer ring matched with the dicing equipment, and the plastic package and gold-plated passive components 30 to be packaged are attached to the standard wafer ring, so that the dicing equipment can be used for cutting the passive components. The blue film is an organic matter with viscosity so as to adhere each passive component to be packaged after plastic packaging and gold plating to the standard chip ring, and fixation in the cutting process is realized.
When in cutting, the plastic sealing plate 40 can be cut through, the standard sheet ring is cut through, and a part of the standard sheet ring is left without cutting, so that each independent plastic-packaged and gold-plated passive component 30 to be packaged is connected through the standard sheet ring, dispersion is avoided, and when in use, only a single gold-plated passive component 30 to be packaged is required to be adsorbed and taken out through a suction nozzle.
S600: and taking out the independent plastic-packaged and gold-plated passive component 30 to be packaged and fixing the passive component on the substrate.
In some embodiments, each individual encapsulated and gold plated passive component 30 to be encapsulated may be secured to the substrate by soldering with a solder material (e.g., silver paste). Specifically, for each of the passive components 30 to be packaged after plastic packaging and gold plating, the second surface thereof may be opposite to the substrate, and then spot welding may be performed by using a welding material, so as to fix the two terminals of the passive components 30 to be packaged and the substrate together by welding. Specifically, materials are welded on a substrate in a spot mode, then the independent plastic-packaged and gold-plated passive components 30 to be packaged are taken out through a mechanical arm and placed on the welded materials, and the welding of the two components is realized through high-temperature baking or normal-temperature solidification.
The substrate may be a copper alloy base material, an organic material, a ceramic material, or the like.
S700: leads are soldered on the terminals of the individually plastic-encapsulated and gold-plated passive components 30 to be encapsulated to connect the terminals to pins on the substrate through the leads.
Because the terminal of the passive component 30 to be packaged is gold-plated, the lead wire can be welded, and then the terminal is led out through the lead wire so as to be connected with the pin on the substrate, so that the lead-out space of the terminal can be adjusted, and the packaging is more convenient. And after the terminals of the passive component 30 to be packaged after plastic packaging and gold plating are led out to the pins of the substrate, the packaging of the passive component 30 to be packaged is completed.
According to the packaging method of the passive component, disclosed by the embodiment of the invention, the terminal of the passive component 30 to be packaged is plated with gold, so that the passive component is led out to the pin of the substrate through the lead wire welded on the terminal, the lead-out space is adjustable, and the packaging is more convenient; the plastic-packaged passive components 30 to be packaged are subjected to full-plate gold plating, so that mass production can be realized, and the cost is reduced; the carrier plate 10 separated from each passive component 30 to be packaged after plastic packaging can be recycled, so that the cost is saved.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and various modifications can be made to the above-described embodiment of the present invention. All simple, equivalent changes and modifications made in accordance with the claims and the specification of this application fall within the scope of the patent claims. The present invention is not described in detail in the conventional art.
Claims (6)
1. The packaging method of the passive component is characterized by comprising the following steps of:
s100: fixing a plurality of passive components to be packaged on a carrier plate; the carrier plate is provided with a plurality of positioning structures for positioning the passive components to be packaged;
S200: carrying out plastic packaging on each to-be-packaged passive component fixed on the carrier plate to form a plastic sealing plate for coating each to-be-packaged passive component;
s300: disconnecting each passive component to be packaged from the carrier plate to obtain each passive component to be packaged after being subjected to plastic package by the plastic sealing plate;
S400: gold plating is carried out on the surface of the terminal of each passive component to be packaged from the surface which is not covered by the plastic sealing plate, so that each passive component to be packaged after plastic sealing and gold plating is obtained;
S500: cutting the plastic-packaged and gold-plated passive components to separate the plastic-packaged and gold-plated passive components to obtain a plurality of independent plastic-packaged and gold-plated passive components;
S600: taking out the independent plastic-packaged and gold-plated passive components to be packaged and fixing the passive components on the substrate;
S700: welding leads on the terminals of the to-be-packaged passive components which are independently packaged in a plastic mode and plated with gold, so that the terminals are connected to pins on the substrate through the leads;
the step S400 specifically includes:
placing the passive components to be packaged after plastic packaging into electroplating liquid;
Plating gold on the surfaces of the terminals of the passive components to be packaged by an electroless plating method;
The step S500 specifically includes:
Attaching each passive component to be packaged after plastic packaging and gold plating to a standard wafer ring with a blue film;
cutting the standard wafer ring by using scribing equipment so as to separate each passive component to be packaged after plastic packaging and gold plating;
The step S600 specifically includes:
spot welding a material on the substrate;
taking out the independent plastic-packaged and gold-plated passive component to be packaged and placing a terminal of the passive component on the welding material;
Through high temperature baking or normal temperature curing.
2. The method of claim 1, wherein the carrier is circular.
3. The method of claim 1, wherein the carrier is a steel plate or a copper plate.
4. The method for packaging a passive component according to claim 1, wherein step S100 specifically includes:
s110: sticking removable glue on the carrier plate;
s120: and sequentially adhering each passive component to be packaged on the removable adhesive.
5. The method of packaging a passive component as claimed in claim 4, wherein the step S300 specifically includes:
and heating the removable glue to melt the removable glue so as to disconnect each passive component to be packaged from the carrier plate, thereby obtaining each passive component to be packaged after plastic packaging.
6. The method of claim 1, wherein the blue film is an organic material having a viscosity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410224295.4A CN117812845B (en) | 2024-02-29 | 2024-02-29 | Packaging method of passive component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410224295.4A CN117812845B (en) | 2024-02-29 | 2024-02-29 | Packaging method of passive component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117812845A CN117812845A (en) | 2024-04-02 |
| CN117812845B true CN117812845B (en) | 2024-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410224295.4A Active CN117812845B (en) | 2024-02-29 | 2024-02-29 | Packaging method of passive component |
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| Country | Link |
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| CN (1) | CN117812845B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070671A (en) * | 2015-09-10 | 2015-11-18 | 中芯长电半导体（江阴）有限公司 | Chip encapsulation method |
| CN110211932A (en) * | 2019-05-29 | 2019-09-06 | 浙江荷清柔性电子技术有限公司 | A kind of flexible chip encapsulating structure and manufacturing method |
| CN117594726A (en) * | 2023-12-28 | 2024-02-23 | 佛山市国星半导体技术有限公司 | Preparation method of LED packaging device |
-
2024
- 2024-02-29 CN CN202410224295.4A patent/CN117812845B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070671A (en) * | 2015-09-10 | 2015-11-18 | 中芯长电半导体（江阴）有限公司 | Chip encapsulation method |
| CN110211932A (en) * | 2019-05-29 | 2019-09-06 | 浙江荷清柔性电子技术有限公司 | A kind of flexible chip encapsulating structure and manufacturing method |
| CN117594726A (en) * | 2023-12-28 | 2024-02-23 | 佛山市国星半导体技术有限公司 | Preparation method of LED packaging device |
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| Publication number | Publication date |
|---|---|
| CN117812845A (en) | 2024-04-02 |
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