CN108213676A - A kind of method of new ceramics metallization positioning welding metal device - Google Patents
A kind of method of new ceramics metallization positioning welding metal device Download PDFInfo
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- CN108213676A CN108213676A CN201810069045.2A CN201810069045A CN108213676A CN 108213676 A CN108213676 A CN 108213676A CN 201810069045 A CN201810069045 A CN 201810069045A CN 108213676 A CN108213676 A CN 108213676A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/02—Pressure butt welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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Abstract
The present invention provides a kind of method of new ceramics metallization positioning welding metal device, includes the following steps：Ceramic metallization product, which is placed in, to be carried on platform；Negative pressure activity suction nozzle is sucked out metal device and is moved to the first image collections of CCD area, and the first image collection unit carries out image collection to metal device surface to be welded；The second image collection units of CCD carry out image collection to the coat of metal area of ceramic metallization product；Metal device is moved to above coat of metal area by the processing of CCD device datas, negative pressure activity suction nozzle, makes metal device surface to be welded corresponding with coat of metal area by position correction；Negative pressure activity suction nozzle, which moves down, makes metal device be contacted with the extruding of coat of metal area；Soldering tip is moved to above metal device；Soldering tip, which moves down, makes metal device be contacted with the extruding of coat of metal area；Welding；Cooling；Negative pressure activity suction nozzle resets respectively with soldering tip.The present invention realizes metal device and precisely, is firmly connected on ceramic metallization product, easy to operate.
Description
Technical field
The invention belongs to the technical fields of electronic component processing and manufacturing, and in particular to a kind of new ceramics metallization positioning
The method more particularly to one kind of welding metal device are positioned by CCD images, are welded using transient resistance and are realized fixed point welding precision
The production new technology of size metallic part.
Background technology
With the development of Communication Development and manufacturing technology, ceramic metallization product from military field develop to civilian frequency marking or
The every field such as markers.Ceramic metallization product is mainly due to its excellent corrosion resistance, dielectricity and suitable thermal expansion system
Number is mainly used for LED heat radiation substrate, ceramic package, electronic circuit board etc..
Since ceramic material surfaces structure is different from metal material surface structure, metal is difficult to reach wetting with ceramics, no
It can act on therewith and be formed and firmly cohered, thus the sealing-in of ceramics and metal device is by firmly sticking in ceramic surface
One layer of metallic film, the principle easily soaked by metallic film with metal device are attached.
In order to adapt to smaller, more miniature product, the size of ceramic metallization product constantly reduces, and gradually develops into precision
The product of micromation.Therefore on ceramic metallization product, the requirement to the positioning accuracy and interconnection technique of positioning metal device
Also it is higher and higher.
At present in the ceramic metallization product that produces both at home and abroad, being fixedly connected mainly to have and pass through mould to precision metallic device
Tool is fixed or gluing fixes two ways.Wherein, mold is fixed metal device and is had the following problems：（1）Need the life of potsherd
Production have stronger stable type, it is desirable that ceramic wafer sintering after have unified size, metal device size is smaller, then to mold with
The requirement of ceramic wafer matching size is higher, to ensure that metal device can be corresponding with the coat of metal on ceramic wafer in mold；
（2）More demanding to mould and die accuracy, die manufacturing cost is high；（3）Product has limitation, and it is right with it that a kind of mold can only be applied
Answer the ceramic metallization product of size.Gluing fixed form has the following problems：（1）It is more demanding to glue performance；（2）Gluing
It fixes easily by influences such as atmosphere temperatures；（3）Easily the performance of subsequent technique and product is impacted.
At present, there is no a kind of convenient and efficient, generally applicable and inexpensive ceramic metallization product connection essences both at home and abroad
The process of close metal device.
Invention content
The purpose of the present invention is to provide a kind of methods of new ceramics metallization positioning welding metal device, can realize
Accurate, firm connection of the precision metallic device on ceramic metallization product is fixed, and easy to operate, does not influence ceramet
Change the subsequent processing of product.
The present invention adopts the following technical scheme that：A kind of method of new ceramics metallization positioning welding metal device, including
Following steps：
1) ceramic metallization product is fixed on and carried on platform；
2) metal device is sucked out negative pressure activity suction nozzle from feeder channel, and upper surface left side and the negative pressure activity of metal device are inhaled
The surface contact of head, negative pressure activity suction nozzle can move under the action of the first kinematic mount arm；
3) metal device is moved to the first image collection area of CCD equipment by negative pressure activity suction nozzle, and the first image of CCD equipment is adopted
Collect unit and image collection is carried out to the surface to be welded of metal device, there is one layer of uniform weldering in the surface to be welded of metal device
Material；
4) upper surface of ceramic metallization product has coat of metal area, and the second image collection unit of CCD equipment is to ceramic metal
Coat of metal area on categoryization product carries out image collection；
5) CCD equipment is to the image data of collected metal device surface to be welded and the image data progress in coat of metal area
With processing, metal device is moved to the top in the coat of metal area of ceramic metallization product by negative pressure activity suction nozzle, passes through movement
Negative pressure activity suction nozzle corrects the position of metal device and/or by the mobile position carried platform and correct ceramic metallization product, makes
The position of metal device surface to be welded matches corresponding up and down with the position in coat of metal area；
6) negative pressure activity suction nozzle moves down, and metal device is pushed, and metal device is made to be fastened on coat of metal area surface,
Metal device surface to be welded is made to squeeze with coat of metal area to contact；
7) soldering tip can move under the action of the second kinematic mount arm, and soldering tip is moved to metal device by the second kinematic mount arm
The top of upper surface right side；
8) soldering tip moves down, and pushes and is fastened on the surface of metal device upper surface right side, and makes at soldering tip position,
Metal device surface to be welded is squeezed with coat of metal area and is contacted；
9) be powered pressure on soldering tip, makes the melt solder in metal device surface to be welded；
10) specific time is cooled down, solder solidification makes metal device be welded in coat of metal area, realizes metal device and ceramics
Metallized product is fixedly connected；
11) negative pressure activity suction nozzle vacuum is loosened, and negative pressure activity suction nozzle is detached with metal device, and negative pressure activity suction nozzle is distinguished with soldering tip
It sets back.
Metal device has regular texture or irregular structure, the surface to be welded of metal device and coat of metal area weldering
Junction is respectively plane.
The soldering tip includes anode soldering tip and cathode soldering tip, in the step 9）In, it is slow to weld current waveform used
Rise the impulse waveform of slow drop.
The step 8）With step 9）Welding process include soldering tip depression phases, welding delay stage and welding the stage.
In the step 6）In, when metal device is contacted with ceramic metallization product, the negative pressure activity suction nozzle is pressed downward
The down force pressure of metal device is the first down force pressure, in the step 8）In, the soldering tip depression phases, soldering tip are pressed downward gold
The down force pressure for belonging to device is the second down force pressure, and first down force pressure is not less than second down force pressure.
In the step 9）In, in the welding stage, in the surface to be welded, with the soldering tip position corresponding
The melt solder at place.
The soldering tip depression phases time is 300 ~ 500ms, and the welding delay stage time is 0 ~ 150ms, when welding the stage
Between be 30 ~ 100ms.
In the step 6）In, first down force pressure is 0.01 ~ 0.05MPa, in the step 8）In, described second
Down force pressure is 0.01 ~ 0.05MPa.
The negative pressure activity suction nozzle adsorbing metal device and vacuum degree in metal device moving process is driven for-
200~ -60 KPa。
Spacing between the anode soldering tip and cathode soldering tip is the area difference of 0.05mm, anode soldering tip and cathode soldering tip
For 1 × 0.4mm, the power-on voltage of the soldering tip is 0.5 ~ 3 V.
Beneficial effects of the present invention are as follows：
（1）Using CCD positioning and resistance-welding process, realization precision metallic device is accurate, reliable with ceramic metallization product
It is fixedly connected；
（2）Applied widely, the connection that can be suitable for various precision metallic devices and ceramic metallization product is fixed；
（3）This technique speed of welding is fast, at low cost, pollution-free, positioning accuracy is high, at the following process of ceramic metallization product
Reason is without influence.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, the accompanying drawings in the following description is only the embodiment of the present invention, common for this field
For technical staff, without having to pay creative labor, other attached drawings are can also be obtained according to these attached drawings.
Fig. 1 is the dimensional structure diagram of the present invention；
Fig. 2 is the structure after metal device surface to be welded of the present invention is matched with the coat of metal zone position on ceramic metallization product
Schematic diagram；
Fig. 3 is the structure diagram in welding stage of the present invention.
Specific embodiment
In order to make the technical purpose of the present invention, technical solution and advantageous effect clearer, below in conjunction with the accompanying drawings and specifically
Embodiment is further illustrated technical scheme of the present invention.
As shown in Figure 1 to Figure 3, the present invention is welded metal device 1 using CCD location technologies and resistance-welding process principle
On ceramic metallization product 2, the lower surface of metal device 1 is surface to be welded, has uniform solder, ceramics in surface to be welded
2 upper surface of metallized product has coat of metal area 3, and the device that welding production process is related to includes：Platform 4 is carried, CCD is set
It is standby, suction nozzle 5 and soldering tip 6.
Wherein, carrying platform 4 can move horizontally under the action of controller, so as to be carried out to the position of ceramic metallization product
Correction；CCD equipment includes the first image collection unit 7 and the second image collection unit 8, and the first image collection unit 7 is used to adopt
Collect the image information of 1 surface to be welded of metal device, the second image collection unit 8 is used to acquire the image information in coat of metal area 3；
Suction nozzle 5 is connected on the first kinematic mount arm 51, and the first kinematic mount arm 51 can drive suction nozzle 5 to move；Soldering tip 6 is connected to second
On kinematic mount arm 61, the second kinematic mount arm 61 can drive soldering tip 6 to move, and soldering tip 6 includes anode soldering tip 62 and cathode soldering tip
63。
The method of new ceramics metallization positioning welding metal device, includes the following steps：
1) ceramic metallization product 2 is fixed on and carried on platform 4；
2) metal device 1 is sucked out negative pressure activity suction nozzle 5 from feeder channel, and metal device 1 is tightly inhaled in negative pressure activity suction nozzle 5
On, the upper surface left side 11 of metal device 1 is contacted with the surface of negative pressure activity suction nozzle 5, and negative pressure activity suction nozzle 5 can be in the first fortune
It is moved under the action of dynamic support arm 51；
3) metal device 1 is moved to the first image collection area of CCD equipment, the first image of CCD equipment by negative pressure activity suction nozzle 5
Collecting unit 7（Such as the first video cameras of CCD）Image collection is carried out to the surface to be welded of metal device 1（The present embodiment is optics shadow
As acquisition）, the first image collection unit 7 according to the reflecting rate of the surface to be welded of metal device 1, identification metal device 1 it is to be welded
The range of junction retroreflective regions determines face shaping, the size of the surface to be welded of metal device 1, and determines treating for metal device 1
The centre coordinate of welding surface has one layer of uniform solder in the surface to be welded of metal device 1；
4) upper surface of ceramic metallization product 2 has coat of metal area 3, the second image collection unit 8 of CCD equipment（Such as CCD
Second video camera）Image collection is carried out to the coat of metal area 3 on ceramic metallization product 2（The present embodiment is adopted for optical image
Collection searches for coat of metal photosensitive area）, the second image collection unit 8 is according to the reflecting rate in coat of metal area 3, the identification coat of metal
The range of 3 retroreflective regions of area determines face shaping, the size in coat of metal area 3, and determines the centre coordinate in coat of metal area 3；
5) CCD equipment to the image data of the surface to be welded of collected metal device 1 and the image data in coat of metal area 3 into
On the one hand row matching treatment is the appearance shape of the face shaping to the surface to be welded of metal device 1, size and coat of metal area 3
Shape, size carry out matching treatment, are on the other hand to the centre coordinate of the surface to be welded of metal device 1 and coat of metal area 3
Centre coordinate carries out matching treatment, and then, control device moves metal device 1 according to above-mentioned data, control negative pressure activity suction nozzle 5
It moves to the top in the coat of metal area 3 of ceramic metallization product 2, and passes through movable negative-pressure activity suction nozzle 5 and correct metal device 1
Position and/or by the mobile position carried platform 4 and correct ceramic metallization product 2, make the position of 1 surface to be welded of metal device with
Match correspondence above and below the position in coat of metal area 3；
6) negative pressure activity suction nozzle 5 moves down, and metal device 1 is pushed, and metal device 1 is made to be fastened on 3 table of coat of metal area
On face, the surface to be welded of metal device 1 is made to be squeezed with coat of metal area 3 and is contacted；
7) soldering tip 6 can move under the action of the second kinematic mount arm 61, and soldering tip 6 is moved to metal by the second kinematic mount arm 61
The top of 1 upper surface right side 12 of device, metal device upper surface right side 12 are oppositely arranged with upper surface left side 11, and gold
It is not be overlapped with upper surface left side 11 to belong to device upper surface right side 12；
8) soldering tip 6 moves down, and pushes and is fastened on the surface of metal device upper surface right side 12, and make in soldering tip 6
At position, the surface to be welded of metal device 1 is squeezed with coat of metal area 3 to be contacted；
9) be powered pressure on soldering tip 6, makes the melt solder in the surface to be welded of metal device 1；
10) specific time is cooled down, solder solidification makes metal device 1 be welded in coat of metal area 3, realizes metal device 1 and pottery
Porcelain metallized product 2 is fixedly connected；
11) 5 vacuum of negative pressure activity suction nozzle is loosened, and negative pressure activity suction nozzle 5 is detached with metal device 1, negative pressure activity suction nozzle 5 and soldering tip
6 set back respectively.
In the present embodiment, metal device 1 can have well-regulated structure or an irregular structure, but metal device 1 is treated
Welding surface and the welding surface in the coat of metal area 3 are both needed to respectively plane, to ensure the surface to be welded of metal device 1 and described
The welding surface in coat of metal area 3 comes into full contact with, to realize welding effect.
The shape of metal device 1 can be that annular, square, circle etc. are variously-shaped, and the shape in coat of metal area 3 also may be used
Think that annular, square, circle etc. are variously-shaped.
CCD equipment is to the image data of the surface to be welded of collected metal device 1 and the image data in coat of metal area 3
Matching treatment is carried out, automation equipment is modified matching to the position of metal device 1 and the position of ceramic metallization product 2,
The automatic adjusting position in the horizontal direction of platform 4 is carried, to adjust the position of ceramic metallization product 2, so as to adjust metal is corrected
Metal device 1 is moved to 3 top of coat of metal area by the position in coating area 3, negative pressure activity suction nozzle 5, and negative pressure activity suction nozzle 5 may be used also
To rotate clockwise or counterclockwise the position to correct metal device 1, as shown in Fig. 2, so as to reach the position of metal device 1 with
The position in coat of metal area 3 matches up and down.After location matches, negative pressure activity suction nozzle 5 pushes so that the metal device 1 with
Certain pressure is contacted with coat of metal area 3.
In the present embodiment, it is the slow impulse waveform for rising slow drop to weld current waveform used, to ensure that welding does not influence gold
Belong to device products performance, ensure to weld flawless embrittlement.
The step 8）With step 9）Welding process include soldering tip depression phases, welding delay stage and welding the stage.
As shown in figure 3, soldering tip 6 pushes metal device 1, and after metal device 1 is made to be contacted with coat of metal area 3 with certain pressure, warp
After certain time delay, welding is being performed, welding delay can ensure that metal device 1 comes into full contact with coat of metal area 3, make gold
The pressure belonged between the surface to be welded of device 1 and coat of metal area 3 is evenly distributed, and performs welding again later, ensures that welding is smooth
It completes, ensures welding quality.
When metal device 1 is contacted with ceramic metallization product 2, the negative pressure activity suction nozzle 5 is pressed downward under metal device 1
Pressure pressure is the first down force pressure, under the down force pressure that 6 depression phases of soldering tip, soldering tip 6 are pressed downward metal device 1 is second
Pressure pressure, first down force pressure are not less than second down force pressure.
First down force pressure and the second down force pressure can be set as different value according to the hardness of different metal device, and second
Down force pressure is designed as smaller, and to ensure high temperature generated when welding moment etc., metal device will not be caused to damage.
It in the welding stage, is powered to soldering tip 6, the flow path of electric current is welded for 1-cathode of anode 62-metal device of soldering tip
First 63, metal device 1 has resistance, and the instantaneous high-temperature that resistance generates when electric current flows through makes to be easier to melt on 1 bottom surface of metal device
Solder melt.Movable weld tips are instantaneous, high voltage pushes fusion welding, realize the welding of precision metallic device.
In the present embodiment, in the step 9）In, in the welding stage, in the surface to be welded, with the soldering tip position
Melt solder at corresponding position.After the melt solder in surface to be welded, solidification near soldering tip position, metal device is completed
The connection of the metal device 1 and ceramic metallization product 2 is realized in welding between the surface to be welded of part 1 and coat of metal area 3
It is fixed.
In the present embodiment, the area in coat of metal area 3 is more than the area of the surface to be welded of metal device 1, ensures metal device
The surface to be welded of part 1 can come into full contact with coat of metal area 3.
In the present embodiment, the soldering tip depression phases time is 300 ~ 500ms, and the welding delay stage time is 0 ~ 150ms,
Welding phases-time is 30 ~ 100ms.
In the present embodiment, first down force pressure is 0.01 ~ 0.05MPa, second down force pressure for 0.01 ~
0.05MPa。
In the present embodiment, the negative pressure activity suction nozzle is in adsorbing metal device and in metal device moving process is driven
Vacuum degree is -200 ~ -60 KPa, to ensure metal device 1 during being sucked by negative pressure activity suction nozzle 5 and metal device 1
It does not cause to deviate in moving process, ensures the stability of position of the metal device 1 on negative pressure activity suction nozzle 5.It can basis
The shape of metal device 1, quality settings vacuum degree.
In the present embodiment, the spacing between the anode soldering tip and cathode soldering tip is 0.05mm, and the energization of the soldering tip is electric
It presses as 0.5 ~ 3 V.
In the present embodiment, ceramic metallization resultant metal coating area and the bonding pad of metal device surface to be welded are less than 3.5
× 3.0mm, coat of metal area area are less than 3.0 × 2.2mm, and metal device size is smaller than 2.5 × 2.0mm.Electric resistance welding
Area reaches 1.0 × 1.0mm, can be welded and fixed the gold that side size range is 1.0 ~ 5.0 mm, thickness range is 0.1 ~ 2.0mm
Belong to device, realize the welding of precision metallic device, micro metal device and ceramic metallization product.
Specific embodiment one：
The ceramic metallization product in square-shaped metal coating area will be distributed with（3.0×2.2mm）It is on platform and fixed as carrying, it bears
Pressure activity suction nozzle draws square bodily form metal device（2.8×2.0×0.15mm）Vacuum pump pressure be -85KPa（By metal device
The shape and quality of part determine）, after CCD equipment carries out image collection and matches positioning, negative pressure activity suction nozzle, which pushes, places product
Time is 600ms, and negative pressure activity suction nozzle pushes after pushing through 100ms soldering tips, and after 50ms welding delays, soldering tip leads to 1.5V high
Pressure welds 50ms, then through 100ms solder solidifications, finally, negative pressure activity suction nozzle is lifted off metal device with soldering tip, and welding is solid
Terminate calmly.
It is 2.4s when terminating used that this technique is installed fixed from feeding to metal device, and fixing intensity reaches 0.07MPa.
Specific embodiment two：
As shown in Figures 2 and 3, the ceramic metallization product that circular ring metal coating area will be distributed with（2.0×1.8mm）As for taking
On microscope carrier and fixed, negative pressure activity suction nozzle draws metal ring device（Internal diameter 1.0mm, outer diameter 1.4mm, high 0.15mm）Vacuum
Pump pressure is -55KPa, and after CCD equipment carries out image collection and matches positioning, the negative pressure activity suction nozzle pushing placement product time is
600ms, negative pressure activity suction nozzle push after pushing through 100ms soldering tips, after 50ms welding delays, soldering tip（Including anode soldering tip 62
With cathode soldering tip 63）Logical 1.0V high pressures, weld 35ms, then through 100ms solder solidifications, finally, negative pressure activity suction nozzle on soldering tip
Metal device is lifted away from out, is welded and fixed end.
It is 1.3s when terminating used that this technique is installed fixed from feeding to metal device, and fixing intensity reaches 0.1MPa.
In the present invention, innovatively resistance welding technology is used in the welding procedure of ceramic metallized layer and metal device,
It is more convenient during placing precision metallic device, is directly welded on ceramic metallized layer, not only with relatively low cost,
Also there is stronger fixing intensity simultaneously.
In the present invention, the welding of precision metallic device and ceramic metallization product is realized, further improves metal device
The technology that part is fixedly connected.By introducing resistance welding technology, the optimum organization of control device, rational fixed during the connection process
Position, the accurate control of equipment room run time, adjust rational weldingvoltage, time and welding pressure, and one kind is prepared in design
New ceramics metallization welding procedure.
In the present invention, relatively cheap and easy-operating CCD positioning and resistance-welding process have been selected as precision metallic device
Fixation, the production cost of material is significantly reduced compared with making expendable graphite jig and fixing welding, with dispensing stationary phase
It is more convenient more pollution-free than then.This technique supports that the shear strength of product is larger after welding, and metal device is fixed stably without mold
Surely offset is not likely to produce, the following process of ceramic metallization product is handled without influence.
Product obtained by present invention process can be applied to various ceramic metallization tables compared with current technique both at home and abroad
Face welding product, and have many advantages, such as that speed of welding is fast, at low cost, pollution-free, positioning accuracy is high.
It should be noted last that：Technical scheme of the present invention that the above embodiments are only illustrative and not limiting is any right
The equivalent replacement and do not depart from the modification of spirit and scope of the invention or part replacement that the present invention carries out, should all cover in this hair
Within bright protective scope of the claims.
Claims (10)
- A kind of 1. method of new ceramics metallization positioning welding metal device, which is characterized in that include the following steps：1) ceramic metallization product is fixed on and carried on platform；2) metal device is sucked out negative pressure activity suction nozzle from feeder channel, upper surface left side and the negative pressure activity of metal device The surface contact of suction nozzle, negative pressure activity suction nozzle can move under the action of the first kinematic mount arm；3) metal device is moved to the first image collection area of CCD equipment, the first image of CCD equipment by negative pressure activity suction nozzle Collecting unit carries out the surface to be welded of metal device image collection, has one layer of uniform weldering in the surface to be welded of metal device Material；4) upper surface of ceramic metallization product has coat of metal area, and the second image collection unit of CCD equipment is to ceramic metal Coat of metal area on categoryization product carries out image collection；5) CCD equipment carries out the image data of collected metal device surface to be welded and the image data in coat of metal area Metal device is moved to the top in the coat of metal area of ceramic metallization product, passes through shifting by matching treatment, negative pressure activity suction nozzle Dynamic negative pressure activity suction nozzle corrects the position of metal device and/or the position of ceramic metallization product is corrected by mobile carrying platform, Make to match above and below the position and the position in coat of metal area of metal device surface to be welded corresponding；6) negative pressure activity suction nozzle moves down, and metal device is pushed, and metal device is made to be fastened on coat of metal area surface On, metal device surface to be welded is made to be squeezed with coat of metal area and is contacted；7) soldering tip can move under the action of the second kinematic mount arm, and soldering tip is moved to metal device by the second kinematic mount arm Upper surface right side top；8) soldering tip moves down, and pushes and is fastened on the surface of metal device upper surface right side, and makes in soldering tip position Place, metal device surface to be welded are squeezed with coat of metal area and are contacted；9) be powered pressure on soldering tip, makes the melt solder in metal device surface to be welded；10) specific time is cooled down, solder solidification makes metal device be welded in coat of metal area, realizes metal device and ceramics Metallized product is fixedly connected；11) negative pressure activity suction nozzle vacuum is loosened, and negative pressure activity suction nozzle is detached with metal device, negative pressure activity suction nozzle and soldering tip point It does not set back.
- 2. a kind of method of new ceramics metallization positioning welding metal device according to claim 1, which is characterized in that Metal device has regular texture or irregular structure, and the surface to be welded of metal device and coat of metal area welding surface are divided equally It Wei not plane.
- 3. a kind of method of new ceramics metallization positioning welding metal device according to claim 2, which is characterized in that The soldering tip includes anode soldering tip and cathode soldering tip, in the step 9）In, it is that slow rise delays drop to weld current waveform used Impulse waveform.
- 4. a kind of method of new ceramics metallization positioning welding metal device according to claim 3, which is characterized in that The step 8）With step 9）Welding process include soldering tip depression phases, welding delay stage and welding the stage.
- 5. a kind of method of new ceramics metallization positioning welding metal device according to claim 4, which is characterized in that In the step 6）In, when metal device is contacted with ceramic metallization product, the negative pressure activity suction nozzle is pressed downward metal device Down force pressure for the first down force pressure, in the step 8）In, the soldering tip depression phases, soldering tip are pressed downward metal device Down force pressure is the second down force pressure, and first down force pressure is not less than second down force pressure.
- 6. a kind of method of new ceramics metallization positioning welding metal device according to claim 5, which is characterized in that In the step 9）In, in the welding stage, in the surface to be welded, with the solder at the soldering tip position corresponding Melting.
- 7. a kind of method of new ceramics metallization positioning welding metal device according to claim 4, which is characterized in that The soldering tip depression phases time be 300 ~ 500ms, the welding delay stage time be 0 ~ 150ms, welding phases-time be 30 ~ 100ms。
- 8. a kind of method of new ceramics metallization positioning welding metal device according to claim 5, which is characterized in that In the step 6）In, first down force pressure is 0.01 ~ 0.05MPa, in the step 8）In, second down force pressure For 0.01 ~ 0.05MPa.
- 9. according to a kind of method of new ceramics metallization positioning welding metal device of claim 2 to 8 any one of them, It is characterized in that, the negative pressure activity suction nozzle is in adsorbing metal device and the vacuum degree in metal device moving process is driven For -200 ~ -60 KPa.
- 10. a kind of method of new ceramics metallization positioning welding metal device according to claim 9, feature exist It is 0.05mm in, spacing between the anode soldering tip and cathode soldering tip, the area of anode soldering tip and cathode soldering tip is respectively 1 × 0.4mm, the power-on voltage of the soldering tip is 0.5 ~ 3 V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810069045.2A CN108213676B (en) | 2018-01-24 | 2018-01-24 | Novel method for positioning and welding metal device through ceramic metallization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810069045.2A CN108213676B (en) | 2018-01-24 | 2018-01-24 | Novel method for positioning and welding metal device through ceramic metallization |
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| Publication Number | Publication Date |
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| CN108213676A true CN108213676A (en) | 2018-06-29 |
| CN108213676B CN108213676B (en) | 2020-06-26 |
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| CN201810069045.2A Active CN108213676B (en) | 2018-01-24 | 2018-01-24 | Novel method for positioning and welding metal device through ceramic metallization |
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| CN110576278A (en) * | 2019-10-10 | 2019-12-17 | 宝鸡文理学院 | Method for positioning and welding metal device by ceramic metallization |
| CN113828954A (en) * | 2021-10-22 | 2021-12-24 | 中国科学院空天信息创新研究院 | Metal-ceramic sealing method and metal-ceramic composite structure |
| CN114799689A (en) * | 2022-04-29 | 2022-07-29 | 中国科学院西安光学精密机械研究所 | Microsphere adsorption positioning device and method for laser processing |
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