JPH0229737Y2 - - Google Patents
Info
- Publication number
- JPH0229737Y2 JPH0229737Y2 JP3445885U JP3445885U JPH0229737Y2 JP H0229737 Y2 JPH0229737 Y2 JP H0229737Y2 JP 3445885 U JP3445885 U JP 3445885U JP 3445885 U JP3445885 U JP 3445885U JP H0229737 Y2 JPH0229737 Y2 JP H0229737Y2
- Authority
- JP
- Japan
- Prior art keywords
- finger
- board
- ceramic
- hook
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3445885U JPH0229737Y2 (enrdf_load_stackoverflow) | 1985-03-11 | 1985-03-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3445885U JPH0229737Y2 (enrdf_load_stackoverflow) | 1985-03-11 | 1985-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61151373U JPS61151373U (enrdf_load_stackoverflow) | 1986-09-18 |
JPH0229737Y2 true JPH0229737Y2 (enrdf_load_stackoverflow) | 1990-08-09 |
Family
ID=30537846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3445885U Expired JPH0229737Y2 (enrdf_load_stackoverflow) | 1985-03-11 | 1985-03-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0229737Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-03-11 JP JP3445885U patent/JPH0229737Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61151373U (enrdf_load_stackoverflow) | 1986-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7254888B2 (en) | Method for manufacturing graphite-base heat sinks | |
JP5426393B2 (ja) | 被加工物搬送台 | |
CN101698262B (zh) | 钎焊处理装置用导热部件、电烙铁及电除焊料工具 | |
MY180753A (en) | Corrosion resistant material for reduced fouling, heat transfer component with improved corrosion and fouling resistance, and method for reducing fouling | |
JP2003046229A (ja) | Pbフリーはんだを用いた混載実装方法およびフローはんだ付け装置 | |
JPH0229737Y2 (enrdf_load_stackoverflow) | ||
US4420110A (en) | Non-wetting articles and method for soldering operations | |
JPWO2009154225A1 (ja) | 自動はんだ付け装置 | |
US4697730A (en) | Continuous solder system | |
JP2000183593A (ja) | フレキシブル回路基板用キャリアおよびはんだ付け方法ならびにはんだ付け装置 | |
JP2003179339A (ja) | フロー半田付け用治具 | |
GB2159084A (en) | Vapour phase soldering | |
JP2509373B2 (ja) | プリント基板のリフロ―はんだ付け方法およびその装置 | |
JPH05291737A (ja) | 回路基板搬送治具 | |
JPH03262194A (ja) | フレキシブルプリント基板のリフロー方法 | |
US20240047255A1 (en) | Wafer alignment assembly of the solder reflow system | |
JPH0390471U (enrdf_load_stackoverflow) | ||
JPS57190767A (en) | Soldering method for chip parts | |
Bacquias | Galvanic and Chemical Techniques in the Electronic Industry | |
JPH083996Y2 (ja) | 自動ハンダ付け機用プリント基板搬送爪 | |
JPH05262U (ja) | 不活性ガスリフロー装置 | |
Vianco | Wave Soldering | |
JP2519059B2 (ja) | はんだ付け用治具 | |
JP2003051672A (ja) | リフロー半田付け装置 | |
JPH059190B2 (enrdf_load_stackoverflow) |