JPH0229328A - フレキシブル銅張板 - Google Patents
フレキシブル銅張板Info
- Publication number
- JPH0229328A JPH0229328A JP17823788A JP17823788A JPH0229328A JP H0229328 A JPH0229328 A JP H0229328A JP 17823788 A JP17823788 A JP 17823788A JP 17823788 A JP17823788 A JP 17823788A JP H0229328 A JPH0229328 A JP H0229328A
- Authority
- JP
- Japan
- Prior art keywords
- film
- epoxy resin
- resin
- adhesive
- polyetherimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 18
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 18
- 229920001721 polyimide Polymers 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 5
- 239000002966 varnish Substances 0.000 abstract description 14
- 239000002904 solvent Substances 0.000 abstract description 10
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 15
- -1 Glycidyl ester Chemical class 0.000 description 7
- 235000013405 beer Nutrition 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17823788A JPH0229328A (ja) | 1988-07-19 | 1988-07-19 | フレキシブル銅張板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17823788A JPH0229328A (ja) | 1988-07-19 | 1988-07-19 | フレキシブル銅張板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229328A true JPH0229328A (ja) | 1990-01-31 |
| JPH0575580B2 JPH0575580B2 (en, 2012) | 1993-10-20 |
Family
ID=16044991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17823788A Granted JPH0229328A (ja) | 1988-07-19 | 1988-07-19 | フレキシブル銅張板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229328A (en, 2012) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5821280A (en) * | 1995-07-27 | 1998-10-13 | Nihon Kohden Corporation | Process for producing conductive composition for biological electrode |
| JPH11157002A (ja) * | 1997-11-25 | 1999-06-15 | Sumitomo Bakelite Co Ltd | 金属・樹脂複合体、その製造方法及びフレキシブル回路配線板用基板 |
| JP2000502581A (ja) * | 1995-12-29 | 2000-03-07 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | タブ式電極 |
| EP1221471A1 (de) * | 2001-01-09 | 2002-07-10 | Alcan Technology & Management AG | Klebstoffmischung auf Basis eines Polyetherimid enthaltenden Epoxidharz |
| JP2003025489A (ja) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
-
1988
- 1988-07-19 JP JP17823788A patent/JPH0229328A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5821280A (en) * | 1995-07-27 | 1998-10-13 | Nihon Kohden Corporation | Process for producing conductive composition for biological electrode |
| JP2000502581A (ja) * | 1995-12-29 | 2000-03-07 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | タブ式電極 |
| JPH11157002A (ja) * | 1997-11-25 | 1999-06-15 | Sumitomo Bakelite Co Ltd | 金属・樹脂複合体、その製造方法及びフレキシブル回路配線板用基板 |
| EP1221471A1 (de) * | 2001-01-09 | 2002-07-10 | Alcan Technology & Management AG | Klebstoffmischung auf Basis eines Polyetherimid enthaltenden Epoxidharz |
| JP2003025489A (ja) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0575580B2 (en, 2012) | 1993-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3221756B2 (ja) | プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法 | |
| EP1461387B1 (en) | Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) | |
| WO2007067649A1 (en) | Laminates for high speed and high frequency printed circuit boards | |
| JP4849654B2 (ja) | 接着剤組成物および接着シート | |
| JP5632426B2 (ja) | ポリアミック酸及び非熱可塑性ポリイミド樹脂 | |
| JP5162379B2 (ja) | ポリアミック酸及び非熱可塑性ポリイミド樹脂 | |
| JPH0229328A (ja) | フレキシブル銅張板 | |
| JP3516473B2 (ja) | プリント基板用耐熱性接着剤フィルム | |
| JP3063929B2 (ja) | 耐熱性の接着剤 | |
| JPH07173449A (ja) | アクリル系接着剤組成物及びこれを用いた接着フィルム | |
| JPH0753676A (ja) | 無溶剤エポキシ樹脂組成物及びそれを用いたプリプレグ、銅張積層板 | |
| JP2722402B2 (ja) | フレキシブル印刷回路基板用の接着剤組成物 | |
| JP2848434B2 (ja) | 接着剤組成物 | |
| JPS643917B2 (en, 2012) | ||
| JPS62207322A (ja) | 熱硬化性樹脂組成物 | |
| JPH0552872B2 (en, 2012) | ||
| JPH0220151B2 (en, 2012) | ||
| JPH0553628B2 (en, 2012) | ||
| JP3095115B2 (ja) | 多層プリント配線板用光・熱硬化型アンダーコート剤及び多層プリント配線板の製造方法 | |
| JPH104270A (ja) | 多層プリント配線板の製造方法 | |
| JPH02187485A (ja) | フレキシブル印刷回路基板用接着剤組成物 | |
| JPH07336054A (ja) | 多層プリント配線板用層間絶縁樹脂材料及び多層プリント配線板の製造方法 | |
| JPH03210380A (ja) | 接着剤組成物 | |
| JP3065682B2 (ja) | フレキシブル印刷回路用基板 | |
| JPS5866385A (ja) | 印刷配線用基板の製造方法 |