JPH02281067A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPH02281067A JPH02281067A JP10315289A JP10315289A JPH02281067A JP H02281067 A JPH02281067 A JP H02281067A JP 10315289 A JP10315289 A JP 10315289A JP 10315289 A JP10315289 A JP 10315289A JP H02281067 A JPH02281067 A JP H02281067A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- silicon nitride
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 27
- 239000012778 molding material Substances 0.000 title claims abstract description 22
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 8
- 229920003986 novolac Polymers 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 20
- 239000011347 resin Substances 0.000 abstract description 20
- 238000007789 sealing Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、エポキシ樹脂成形材料に関するものである
。さらに詳しくは、この発明は、電気部品や電子部品を
封止するための樹脂モールド品に主として用いられる熱
放散性および成形性に優れたエポキシ樹脂成形材料に関
するしのである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to an epoxy resin molding material. More specifically, the present invention relates to an epoxy resin molding material that has excellent heat dissipation properties and moldability and is mainly used for resin molded products for sealing electrical and electronic components.
（従来の技術）
近年、電気・電子機器の高性能化、高信頼性化、生産性
向上のために、プラスチックによる樹脂封止がなされる
ようになってきている。これらの電気部品や電子部品に
は、たとえばトランジスタ、ダイオード、コンデンサー
、フィルター、整流器、抵抗体、コイル等があり、ＶＩ
Ａ脂封止の手段はこれらに広く適用されてきてもいる。(Prior Art) In recent years, in order to improve the performance, reliability, and productivity of electric and electronic devices, resin encapsulation using plastics has become popular. These electrical and electronic components include, for example, transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc.
A means of sealing has also been widely applied to these.
また、この樹脂封止においては、パワーデバイス定格出
力の向上や素子の発熱による熱疲労寿命の短縮が課題と
なることから、封止用樹脂には結晶シリカや高純度アル
ミナなどの高熱伝導性の無機質フィラーを添加配合する
ことも行われてきている。In addition, in this resin encapsulation, the issues are improving the rated output of the power device and shortening the thermal fatigue life due to the heat generated by the element, so the encapsulating resin is made of highly thermally conductive materials such as crystalline silica and high-purity alumina. Addition and blending of inorganic fillers has also been carried out.
（発明が解決しようとする課題〉
しかしながら、これまでの樹脂封止においては、熱伝導
率を高めるために無機質フィラーの充填率を高めていく
と樹脂粘度が増大し、ワイヤー変形、ボイド未充填とい
った成形上の問題が避けられなかった。(Problem to be solved by the invention) However, in conventional resin sealing, increasing the filling rate of inorganic filler to increase thermal conductivity increases resin viscosity, causing wire deformation and void filling. Molding problems were inevitable.
このため、これまでの封止用樹脂成形材料によってはパ
ワーデバイスの高ｍ能化や高出力化の要請には対応する
ことができないのが実情である。For this reason, the reality is that conventional resin molding materials for sealing cannot meet the demands for higher performance and higher output of power devices.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来の封止用樹脂成形材料の欠点を解消し、高熱
伝導性とともに低粘度化、高流動性化をも特性付与する
ことのできる、熱放散性および成形性に優れた樹脂成形
材料を提供することを目的としている。This invention was made in view of the above-mentioned circumstances, and aims to eliminate the drawbacks of conventional resin molding materials for sealing, and provide characteristics such as high thermal conductivity, low viscosity, and high fluidity. The purpose of the present invention is to provide a resin molding material with excellent heat dissipation properties and moldability.
（課題を解決するための手段）
この発明は、上記の課題を解決するものとして、エポキ
シ樹脂に、表面Ｓ ｉ ＯＲ（Ｒはアルキル基または脂
環式アルキル基を示す）構造を有する窒化硅素を配合し
てなることを特徴とするエポキシ樹脂成形材料を提供す
る。(Means for Solving the Problems) This invention solves the above problems by adding silicon nitride having a surface SiOR (R represents an alkyl group or an alicyclic alkyl group) structure to an epoxy resin. To provide an epoxy resin molding material characterized by being blended.
またこの発明は、エポキシ樹脂にフェノールノボラック
樹脂とともに、その一部または全部が上記の窒化硅素か
らなる無機質充填材をその樹脂組成物全体量の６０〜９
０重量％配合することや、シランカップリング剤をも配
合することを好ましい態様としてもいる。もちろんこの
組成物には、必要に応じてその他架橋剤、硬化剤、硬化
促進剤、離型剤、着色剤などの添加剤を配合してもよい
。In addition, the present invention provides an epoxy resin with a phenol novolak resin and an inorganic filler, a part or all of which is composed of the above-mentioned silicon nitride, in an amount of 60 to 99% of the total amount of the resin composition.
Preferred embodiments include blending 0% by weight and blending a silane coupling agent as well. Of course, other additives such as a crosslinking agent, a curing agent, a curing accelerator, a mold release agent, and a coloring agent may be added to this composition as required.
この発明のベース樹脂として用いるエポキシ樹脂につい
ては、その種類に特段の限定はなく、エポキシ基含有の
硬化可能なエポキシ樹脂であるならば、ビスフェノール
Ａ型エポキシ樹脂、ノボラック型エポキシ樹脂、ハロゲ
ン化エポキシ樹脂、グリシジルエステル型エポキシ樹脂
等の適宜なものを使用することができる。There are no particular limitations on the type of epoxy resin used as the base resin of this invention, and as long as it is a curable epoxy resin containing an epoxy group, bisphenol A type epoxy resin, novolac type epoxy resin, halogenated epoxy resin , glycidyl ester type epoxy resin, etc. can be used.
これに配合する窒化硅素は、その表面にＳｉＯＲ基を持
つことを特徴としている。The silicon nitride blended into this is characterized by having a SiOR group on its surface.
この点について説明すると、無機質充填材と樹脂とは本
来的に相溶性が悪く増粘の原因となるが、表面にシラノ
ール（Ｓｔ−ＯＨ）基を有する窒化硅素硅素の場合には
その配合が低粘度化に大きく寄与し、また、このシラノ
ール基のままの状態よりも、これをアルコールと反応さ
せて表面ＳｉＯＲ楕遣を有するものとしたものが封止用
樹脂の耐湿性および成形性（特にパリ特性）の点から好
ましいことが見出された。このような知見に基づいては
じめてこの発明は完成されている。To explain this point, inorganic fillers and resins inherently have poor compatibility and cause thickening, but in the case of silicon nitride, which has silanol (St-OH) groups on the surface, the blending is low. The silanol group greatly contributes to the increase in viscosity, and the moisture resistance and moldability of the sealing resin (in particular, the moldability of the silanol group) is improved by reacting it with alcohol to form a surface SiOR ellipse. It was found to be preferable from the viewpoint of (characteristics). This invention was only completed based on such knowledge.
ここでＳｉＯＲ構造を生成させるためのアルコールにつ
いては特にその種類に限定はないが、低沸点で反応性の
大きなアルキルアルコールまたは脂環式アルキルアルコ
ールとすることが好ましい。The type of alcohol used to generate the SiOR structure is not particularly limited, but it is preferably an alkyl alcohol or alicyclic alkyl alcohol that has a low boiling point and high reactivity.
特にメタノール、エタノール、プロパツールなどの低級
アルコールが好適なものとして例示される。In particular, lower alcohols such as methanol, ethanol, and propatool are exemplified as preferred.
この発明の樹脂成形材料においては、あらかじめアルコ
ールによって表面処理した窒化硅素を配合すればよく、
樹脂全体量に対して６０〜９０重量％の割合でこれを配
合することが好ましい、なお、この場合、その一部の割
合を池の無機質充填材との併用としてもよい、必要に応
じて、ガラス繊維、炭酸カルシウム、クレー、タルク、
水酸化アルミニウム等を併用することができる。いずれ
の場合も、上記の窒化硅素を主体として配合するが、こ
の配合が６０重量％未満では熱伝導性の向上が充分でな
く、また配合量が９０重量％を越えると耐湿性や成形性
が低下する傾向にある。In the resin molding material of this invention, silicon nitride that has been surface-treated with alcohol in advance may be blended.
It is preferable to blend this in a proportion of 60 to 90% by weight based on the total amount of resin. In this case, a part of the proportion may be used in combination with the inorganic filler of the pond. If necessary, Glass fiber, calcium carbonate, clay, talc,
Aluminum hydroxide etc. can be used together. In either case, silicon nitride is mainly blended, but if the blend is less than 60% by weight, the thermal conductivity will not be improved sufficiently, and if the blend exceeds 90% by weight, moisture resistance and moldability will deteriorate. It is on a declining trend.
また、この発明ではフェノールノボラック樹脂を配合す
ることが好ましいが、これに加えて、必要に応じ、フェ
ノール樹脂、メラミン樹脂、インシアネート等の架橋剤
や、アミン、アミド等の硬化剤、アミン系もしくはリン
系の硬化促進剤を添加してもよい。Further, in this invention, it is preferable to blend a phenol novolak resin, but in addition to this, if necessary, a crosslinking agent such as a phenol resin, a melamine resin, an incyanate, a curing agent such as an amine or an amide, an amine type or A phosphorus-based curing accelerator may be added.
さらにまた、シランカップリング剤がこの発明において
好ましく配合されるが、エポキシシランがその好適なも
のとして例示される。Furthermore, a silane coupling agent is preferably blended in the present invention, and epoxy silane is exemplified as a suitable one.
以上の通りのこの発明のエポキシ樹脂成形材料は、各配
合成分を混合、混練、粉砕、あるいは造粒して実際の使
用に供することができる。成形材料は、トランファー成
形、射出成形等によるトランジスタ、ダイオード、コン
デンサー、フィルタ−１整流器、抵抗体、コイル等の電
気・電子部品の多数個取り成形に適することはもちろん
のこと、圧縮成形等にも適用できるものである。The epoxy resin molding material of the present invention as described above can be put to actual use by mixing, kneading, pulverizing, or granulating the respective ingredients. The molding material is not only suitable for multi-cavity molding of electrical and electronic components such as transistors, diodes, capacitors, filter-1 rectifiers, resistors, and coils by transfer molding, injection molding, etc., but also suitable for compression molding, etc. It is also applicable.
以下、実施例を示し、この発明のエポキシ樹脂成形材料
についてさらに詳しく説明する。EXAMPLES Hereinafter, the epoxy resin molding material of the present invention will be explained in more detail with reference to Examples.
実施例１〜５
表１に示した配合によって各成分を混合および混練して
エポキシ樹脂成形材料を製造した。なお、エポキシ樹脂
としては、エポキシ当量２２０ 、Ｓ Ｐ８０℃の０−
クレゾールノボラック樹脂を、またフェノールノボラッ
ク樹脂としては、水酸基当量１０４．５ｐ８７℃のもの
を使用した。Examples 1 to 5 Epoxy resin molding materials were manufactured by mixing and kneading each component according to the formulation shown in Table 1. In addition, the epoxy resin has an epoxy equivalent of 220 and an S P of 80°C.
A cresol novolac resin and a phenol novolac resin having a hydroxyl equivalent of 104.5p and 87°C were used.
ＳｉＯＲ構造を有する窒化硅素については、５重量％の
アルコールを用い、流動層（５０℃×６０分〜１００℃
Ｘ３０分）において反応させ、乾燥処理したものを使用
した。For silicon nitride having a SiOR structure, 5% by weight of alcohol was used and a fluidized bed (50°C x 60 minutes to 100°C
30 minutes) and dried.
この樹脂成形材料の特性について評価を行い、その結果
を表１に示した。The properties of this resin molding material were evaluated and the results are shown in Table 1.
この評価は次の基準方式により行った。This evaluation was performed using the following standard method.
（１） 溶融粘度
１５０℃で、フローテスター（ノズル径ｌＸ２１１１ｍ
、荷重３０ｋｇ／ａａ）により測定。(1) At a melt viscosity of 150°C, use a flow tester (nozzle diameter 1 x 2111 m).
, load 30kg/aa).
（２） スパイラルフロー １７０℃で、ＥＭＭＩに準じて評価。(2) Spiral flow Evaluated according to EMMI at 170°C.
（３） ワイヤー変形
１６ＤＩＰ標準アルミニウムＴＥＧ、モールド後軟Ｘ線
にてＡｕワイヤ（２５μｍ）の変形度を写真判定。(3) Wire deformation After molding with 16DIP standard aluminum TEG, the degree of deformation of the Au wire (25 μm) was photo-determined using soft X-rays.
（４） 成形性
１６ＤＩＰモールド後の外観評価（ボイド、かすれ、パ
リの出方）
（５） 熱伝導率
１００φ、２５關厚め成形品をＱＴＭ迅速熱伝導計（昭
和電工製）にて評価。(4) Formability: Appearance evaluation after 16 DIP molding (voids, blurring, appearance of cracks) (5) Thermal conductivity: 100φ, 25mm thick molded product was evaluated using a QTM rapid thermal conductivity meter (manufactured by Showa Denko).
この表１の結果より明らかなように、後述の比較例に比
べて、熱伝導性とともに成形性に優れた樹脂成形材料が
得られることが確認された。As is clear from the results in Table 1, it was confirmed that a resin molding material with excellent thermal conductivity and moldability was obtained compared to the comparative example described below.
比較例１〜２
ＳｉＯＲ構造を持つ窒化硅素を配合することなく、実施
例１〜５と同様にして成形材料を製造し、その特性を評
価した０表１にその結果を示したが、実施例に比べて熱
伝導性、成形性ともに劣っていた。Comparative Examples 1 to 2 Molding materials were produced in the same manner as Examples 1 to 5 without blending silicon nitride having a SiOR structure, and their properties were evaluated.The results are shown in Table 1, but Example Both thermal conductivity and formability were inferior to that of .
（発明の効果）
この発明により、以上詳しく説明した通り、熱伝導性と
ともに成形性の良好なエポキシ樹脂成形材料が実現され
る。(Effects of the Invention) As described above in detail, the present invention provides an epoxy resin molding material with good thermal conductivity and moldability.
Claims (4)
または脂環式アルキル基を示す）構造を有する窒化硅素
を配合してなることを特徴とするエポキシ樹脂成形材料
。(1) An epoxy resin molding material comprising an epoxy resin mixed with silicon nitride having a surface structure of SiOR (R represents an alkyl group or an alicyclic alkyl group).
び一部または全部が請求項（１）記載の窒化硅素からな
る無機質充填材を配合してなるエポキシ樹脂成形材料。(2) An epoxy resin molding material prepared by blending an epoxy resin with a phenol novolac resin and an inorganic filler partially or entirely consisting of silicon nitride according to claim (1).
てなる請求項（２）記載のエポキシ樹脂成形材料。(3) The epoxy resin molding material according to claim (2), which contains an inorganic filler in an amount of 60 to 90% by weight based on the total amount.
）または（２）記載のエポキシ樹脂成形材料。(4) Claim (1) containing a silane coupling agent
) or the epoxy resin molding material described in (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103152A JPH0798895B2 (en) | 1989-04-22 | 1989-04-22 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103152A JPH0798895B2 (en) | 1989-04-22 | 1989-04-22 | Epoxy resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02281067A true JPH02281067A (en) | 1990-11-16 |
| JPH0798895B2 JPH0798895B2 (en) | 1995-10-25 |
Family
ID=14346532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1103152A Expired - Fee Related JPH0798895B2 (en) | 1989-04-22 | 1989-04-22 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0798895B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61272268A (en) * | 1985-05-28 | 1986-12-02 | Denki Kagaku Kogyo Kk | Thermosetting resin composition |
| JPS6284162A (en) * | 1985-10-08 | 1987-04-17 | Ube Ind Ltd | Production of modified silicon nitride powder |
| JPS6438424A (en) * | 1987-08-03 | 1989-02-08 | Matsushita Electric Works Ltd | Epoxy resin molding material |
| JPH02166754A (en) * | 1988-12-21 | 1990-06-27 | Matsushita Electric Works Ltd | Molding material for sealing semiconductor |
-
1989
- 1989-04-22 JP JP1103152A patent/JPH0798895B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61272268A (en) * | 1985-05-28 | 1986-12-02 | Denki Kagaku Kogyo Kk | Thermosetting resin composition |
| JPS6284162A (en) * | 1985-10-08 | 1987-04-17 | Ube Ind Ltd | Production of modified silicon nitride powder |
| JPS6438424A (en) * | 1987-08-03 | 1989-02-08 | Matsushita Electric Works Ltd | Epoxy resin molding material |
| JPH02166754A (en) * | 1988-12-21 | 1990-06-27 | Matsushita Electric Works Ltd | Molding material for sealing semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0798895B2 (en) | 1995-10-25 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |